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MAX3078EIM

HGSEMI · RS-485 / RS-422 ICs · SOP-8

MAX3078EIM from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	RO	output	Receiver output: with RE low, RO is high when A−B is at or above the -50mV threshold and low when A−B is at or below -200mV, and it is high-impedance when RE is high.
2	RE	input	Receiver output enable, active low: RO is enabled when RE is low and goes high-impedance when RE is high; RE high with DE low puts the device into low-power shutdown, and RE has a hot-plug input structure.
3	DE	input	Driver output enable, active high: the driver outputs are enabled when DE is high and high-impedance when DE is low; DE has a hot-plug input structure.
4	DI	input	Driver input: with DE high, a low on DI drives A/Y low and B/Z high, and a high on DI drives A/Y high and B/Z low.
5	GND	power_in	Ground.
6	A	bidirectional	Receiver non-inverting input and driver non-inverting output (A/Y); receiver threshold is ±200mV EIA/TIA-485 compatible with 96kΩ typical input impedance per the datasheet's receiver specification.
7	B	bidirectional	Receiver inverting input and driver inverting output (B/Z); receiver input impedance is 1/8 unit load (96kΩ) for common-mode range -7V to +12V.
8	VCC	power_in	Positive supply, 3.15V to 3.45V; decouple with a 0.1µF capacitor to ground.

Key specifications

Parameter	Value
Manufacturer	HGSEMI
Package	SOP-8
Category	Interface
Pins	8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Supply voltage	VCC	3.15		3.45	V		3
Operating temperature range (industrial, MAX307_I_)	TA	-40		85	℃	MAX307_I_ (industrial grade)	3
Supply voltage (absolute maximum)	VCC			6	V		3
Control and driver input voltage	RE, DE, DI	-0.3		6	V		3
Driver output voltage	A,B,Y,Z	-7		12	V		3
Receiver input voltage	A,B	-7		12	V		3
Receiver output voltage	RO	-0.3			V		3
Continuous power dissipation, 8-pin SO				500	mW	TA=+70℃	3
Storage temperature		-65		150	℃		3
Lead temperature (soldering)	TLEAD			260	℃	soldering, 10 s	3
Differential driver output voltage (RS-422 load)	VOD	2			V	Fig.1, RL=100Ω (RS-422)	3
Differential driver output voltage (RS-485 load)	VOD	1.5			V	Fig.1, RL=54Ω (RS-485)	3
Differential driver output voltage magnitude change	ΔVOD			0.2	V	Fig.1, RL=100Ω or RL=54Ω	3
Driver common-mode output voltage	VOC			3	V	Fig.1, RL=100Ω or RL=54Ω	3
Common-mode voltage magnitude change	ΔVOC			0.2	V	Fig.1, RL=100Ω or RL=54Ω	3
Input high voltage	VIH	2			V	DE, DI, RE	4
Input low voltage	VIL			0.8	V	DE, DI	4
Input current	IIN	-1		1	μA	DE, DI, RE	4
Input current (A, B), VIN=12V	IA, IB			125	μA	DE=GND, VCC=GND or VCC, VIN=12V	4
Input current (A, B), VIN=-7V	IA, IB	-75			μA	DE=GND, VCC=GND or VCC, VIN=-7V	4
Output leakage current (Y, Z), VIN=12V	IO			125	μA	DE=GND, VCC=GND or VCC, VIN=12V	4
Output leakage current (Y, Z), VIN=-7V	IO	-100			μA	DE=GND, VCC=GND or VCC, VIN=-7V	4
Driver short-circuit output current	IOSD			250	mA	0≦VOUT≦12V	4
Driver short-circuit output current	IOSD	-250			mA	-7≦VOUT≦VCC	4
Driver short-circuit foldback output current	IOSDF			20	mA	Vcc-1V ≦VOUT ≦Vcc+0.3.3V	4
Driver short-circuit foldback output current	IOSDF	-20			mA	-0.3.3V ≦VOUT ≦+1V	4
Receiver differential threshold voltage	VTH	-200		200	mV	-7V≦VCM≦12V	4
Receiver output low voltage	VOL			0.4	V	IO=4mA, VID=-200mV	4
Receiver tri-state output current	IOZR	-1		1	μA	0≦VO≦VCC	4
Receiver input resistance	RIN	96			kΩ	-7V≦VCM≦12V	4
Receiver output short-circuit current	IOSR	7		95	mA	0V≦VRO≦VCC	4
Supply current	Icc		400	900	μA	No load, RE=VCC, DI=GND or VCC, DE=VCC	4
Supply current	Icc		330	600	μA	No load, RE=VCC, DI=GND or VCC, DE=GND	4
Supply current	Icc		400	1000	μA	No load, RE=GND, DI=GND or VCC, DE=VCC	4
Supply current	Icc		330	800	μA	No load, RE=GND, DI=GND or VCC, DE=GND	4
Standby supply current (shutdown)	ISHDN		0.05	10	μA	DE=GND, RE=VCC	4
ESD protection, RS-485 pins (IEC61000-4-2 air-gap discharge)		-16		16	kV	IEC61000-4-2 air-gap discharge	4
ESD protection, RS-485 pins (IEC61000-4-2 contact discharge, half-duplex)		-16		16	kV	IEC61000-4-2 contact discharge, half-duplex	4
ESD protection, HBM pin to ground		-16		16	kV	HBM, pin to ground	4
Driver propagation delay (rise and fall)	tDPLH, tDPHL			50	ns	Fig.2 and 5, RL=54Ω, CL=50pF	7
Driver output skew	tDSKEW			10	ns	Fig.2 and 5, RL=54Ω, CL=50pF	7
Driver rise and fall time	tDR, tDF			20	ns	Fig.2 and 5, RL=54Ω, CL=50pF	7
Maximum data rate (driver)	fMAX	16			Mbps		7
Driver enable to output high (table label: receiver enable to output low)	tDZH			150	ns	Fig.3 and 6, CL=100pF, S3 closed	7
Driver enable to output low (table label: receiver enable to output high)	tDZL			150	ns	Fig.3 and 6, CL=100pF, S2 closed	7
Driver low to disable time	tDLZ			100	ns	Fig.3 and 6, CL=15pF, S2 closed	7
Driver high to disable time	tDHZ			100	ns	Fig.3 and 6, CL=15pF, S3 closed	7
Driver enable from standby to output high	tDZH(SHDN)			2200	ns	Fig.3 and 6, CL=15pF, S3 closed	7
Driver enable from standby to output low	tDZL(SHDN)			2200	ns	Fig.3 and 6, CL=15pF, S2 closed	7
Standby time (driver table)	tSHDN	50	350	700	ns		7
Receiver propagation delay	tRPLH, tRPHL			50	ns	Fig.7 and 8, CL=15pF, /VID/≥2.0V, VID≤15ns	7
Receiver output skew	tRSKEW			20	ns	Fig.7 and 8, CL=15pF, /VID/≥2.0V, VID≤15ns	7
Maximum data rate (receiver)	fMAX	16			Mbps		7
Receiver enable to output low	tRZL			50	ns	Fig.4 and 9, S1=-1.3.3V, S2 to VCC	7
Receiver enable to output high	tRZH			50	ns	Fig.4 and 9, S1=+1.3.3V, S2 to GND	7
Receiver low to disable time	tRLZ			50	ns	Fig.4 and 9, S1=-1.3.3V, S2 to VCC	7
Receiver high to disable time	tRHZ			50	ns	Fig.4 and 9, S1=+1.3.3V, S2 to GND	7
Receiver enable from standby to output high	tRZH(SHDN)			2200	ns	Fig.4 and 9, S1=-1.3.3V, S2 to VCC	7
Receiver enable from standby to output low	tRZL(SHDN)			2200	ns	Fig.4 and 9, S1=+1.3.3V, S2 to GND	7
Standby time (receiver table)	tSHDN	50	350	700	ns		7

CAD (KiCad official)

Symbol: MAX3078EIM
Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
3D model: SOP-8 (KiCad packages3D, STEP)
3D model files: max3078eim-etched.step / max3078eim-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); max3078eim.step / max3078eim.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: HGSEMI datasheet (23 pp, sha256 96528bc5b794065e, retrieved 2026-10-18, tier: lcsc)
Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF