component
TISP4040L1BJR-S
Public Made by Adomby adom
BOURNS Semiconductor Discharge Tubes (TSS), SMB(DO-214AA). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownTISP4040L1BJR-S
BOURNS · Semiconductor Discharge Tubes (TSS) · SMB(DO-214AA)
TISP4040L1BJR-S from BOURNS, in a SMB(DO-214AA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | T | passive | Terminal T is one of the two symmetrical protector terminals and corresponds to alternative line designator A, with repetitive peak off-state voltage VDRM of ±25 V and breakover voltage V(BO) of ±40 V for the TISP4040. |
| 2 | R | passive | Terminal R is the second symmetrical protector terminal, corresponds to alternative line designator B, and is the reference terminal for all voltage-current measurements, with VDRM of ±25 V for the TISP4040. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | BOURNS |
| Package | SMB(DO-214AA) |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Repetitive peak off-state voltage ('4040) | VDRM | -25 | 25 | V | '4040 variant; printed as ±25 V | 2 | |
| Repetitive peak off-state current | IDRM | -5 | 5 | µA | VD = VDRM; printed as ±5 µA | 2 | |
| Breakover voltage ('4040) | V(BO) | -40 | 40 | V | di/dt = ±0.8 A/ms; printed as ±40 V for '4040 | 2 | |
| Impulse breakover voltage ('4040) | V(BO) | -63 | 63 | V | dv/dt = ±1000 V/µs linear voltage ramp, max ramp value ±500 V; di/dt = ±5 A/µs linear current ramp, max ramp value ±10 A; printed as ±63 V for '4040 | 2 | |
| Breakover current | I(BO) | -0.8 | 0.8 | A | di/dt = ±0.8 A/ms; printed as ±0.8 A | 2 | |
| Off-state current ('4040) | ID | -2 | 2 | µA | VD = ±22 V ('4040); printed as ±2 µA | 2 | |
| Holding current | IH | -50 | 50 | mA | IT = ±5 A, di/dt = +/-30mA/ms; printed as ±50 mA | 2 | |
| Non-repetitive peak on-state pulse current, 2/10 µs | ITSP | -150 | 150 | A | 2/10 µs (Telcordia GR-1089-CORE); printed as ±150 A | 2 | |
| Non-repetitive peak on-state pulse current, 8/20 µs | ITSP | -120 | 120 | A | 8/20 µs (IEC 61000-4-5); printed as ±120 A | 2 | |
| Non-repetitive peak on-state pulse current, 10/160 µs | ITSP | -65 | 65 | A | 10/160 µs (FCC Part 68); printed as ±65 A | 2 | |
| Non-repetitive peak on-state pulse current, 5/310 µs | ITSP | -45 | 45 | A | 5/310 µs (ITU-T K.20/45/21, 10/700 µs voltage wave shape); printed as ±45 A | 2 | |
| Non-repetitive peak on-state pulse current, 5/320 µs | ITSP | -45 | 45 | A | 5/320 µs (FCC Part 68, 9/720 µs voltage wave shape); printed as ±45 A | 2 | |
| Non-repetitive peak on-state pulse current, 10/560 µs | ITSP | -35 | 35 | A | 10/560 µs (FCC Part 68); printed as ±35 A | 2 | |
| Non-repetitive peak on-state pulse current, 10/1000 µs | ITSP | -30 | 30 | A | 10/1000 µs (Telcordia GR-1089-CORE); printed as ±30 A | 2 | |
| Off-state capacitance | Coff | 23 | 29 | pF | f = 1 MHz, Vd = 1 V rms, VD = 0; '4040 | 3 | |
| Off-state capacitance | Coff | 20 | 26 | pF | f = 1 MHz, Vd = 1 V rms, VD = 1 V; '4040 | 3 | |
| Off-state capacitance | Coff | 18 | 24 | pF | f = 1 MHz, Vd = 1 V rms, VD = 2 V; '4040 | 3 | |
| Storage temperature range | Tstg | -65 | 150 | °C | 2 | ||
| Maximum junction temperature | TJM | 150 | °C | 2 | |||
| Initial rate of rise of current | di/dt | 130 | A/µs | 2/10 waveshape | 2 | ||
| Non-repetitive peak on-state current, 20 ms (50 Hz) full sine wave | ITSM | 20 | A | 20 ms (50 Hz) full sine wave | 2 | ||
| Non-repetitive peak on-state current, 16.7 ms (60 Hz) full sine wave | ITSM | 22 | A | 16.7 ms (60 Hz) full sine wave | 2 | ||
| Non-repetitive peak on-state current, 0.2 s | ITSM | 13 | A | 0.2 s 50 Hz/60 Hz a.c. | 2 | ||
| Non-repetitive peak on-state current, 2 s | ITSM | 5 | A | 2 s 50 Hz/60 Hz a.c. | 2 | ||
| Non-repetitive peak on-state current, 1000 s | ITSM | 1.8 | A | 1000 s 50 Hz/60 Hz a.c. | 2 | ||
| Junction to free air thermal resistance (SMB, EIA/JESD51-3 PCB) | RθJA | 120 | °C/W | EIA/JESD51-3 PCB, IT = ITSM(1000), TA = 25 °C (see Note 3) | 3 | ||
| Junction to free air thermal resistance (SMB, 4-layer PCB) | RθJA | 55 | °C/W | 265 mm x 210 mm populated line card, 4-layer PCB, IT = ITSM(1000), TA = 25 °C | 3 |
CAD (KiCad official)
- Symbol:
TISP4040L1BJR-S - Footprint:
Diode_SMD:D_SMB - 3D model: SMB(DO-214AA) (KiCad packages3D, STEP)
- 3D model files:
tisp4040l1bjr-s-etched.step/tisp4040l1bjr-s-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tisp4040l1bjr-s.step/tisp4040l1bjr-s.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: BOURNS datasheet (12 pp, sha256
24f328fd89bc6349, retrieved 2026-10-15, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).