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TISP4040L1BJR-S

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BOURNS Semiconductor Discharge Tubes (TSS), SMB(DO-214AA). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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TISP4040L1BJR-S

BOURNS · Semiconductor Discharge Tubes (TSS) · SMB(DO-214AA)

TISP4040L1BJR-S from BOURNS, in a SMB(DO-214AA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 T passive Terminal T is one of the two symmetrical protector terminals and corresponds to alternative line designator A, with repetitive peak off-state voltage VDRM of ±25 V and breakover voltage V(BO) of ±40 V for the TISP4040.
2 R passive Terminal R is the second symmetrical protector terminal, corresponds to alternative line designator B, and is the reference terminal for all voltage-current measurements, with VDRM of ±25 V for the TISP4040.

Key specifications

Parameter Value
Manufacturer BOURNS
Package SMB(DO-214AA)
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Repetitive peak off-state voltage ('4040) VDRM -25 25 V '4040 variant; printed as ±25 V 2
Repetitive peak off-state current IDRM -5 5 µA VD = VDRM; printed as ±5 µA 2
Breakover voltage ('4040) V(BO) -40 40 V di/dt = ±0.8 A/ms; printed as ±40 V for '4040 2
Impulse breakover voltage ('4040) V(BO) -63 63 V dv/dt = ±1000 V/µs linear voltage ramp, max ramp value ±500 V; di/dt = ±5 A/µs linear current ramp, max ramp value ±10 A; printed as ±63 V for '4040 2
Breakover current I(BO) -0.8 0.8 A di/dt = ±0.8 A/ms; printed as ±0.8 A 2
Off-state current ('4040) ID -2 2 µA VD = ±22 V ('4040); printed as ±2 µA 2
Holding current IH -50 50 mA IT = ±5 A, di/dt = +/-30mA/ms; printed as ±50 mA 2
Non-repetitive peak on-state pulse current, 2/10 µs ITSP -150 150 A 2/10 µs (Telcordia GR-1089-CORE); printed as ±150 A 2
Non-repetitive peak on-state pulse current, 8/20 µs ITSP -120 120 A 8/20 µs (IEC 61000-4-5); printed as ±120 A 2
Non-repetitive peak on-state pulse current, 10/160 µs ITSP -65 65 A 10/160 µs (FCC Part 68); printed as ±65 A 2
Non-repetitive peak on-state pulse current, 5/310 µs ITSP -45 45 A 5/310 µs (ITU-T K.20/45/21, 10/700 µs voltage wave shape); printed as ±45 A 2
Non-repetitive peak on-state pulse current, 5/320 µs ITSP -45 45 A 5/320 µs (FCC Part 68, 9/720 µs voltage wave shape); printed as ±45 A 2
Non-repetitive peak on-state pulse current, 10/560 µs ITSP -35 35 A 10/560 µs (FCC Part 68); printed as ±35 A 2
Non-repetitive peak on-state pulse current, 10/1000 µs ITSP -30 30 A 10/1000 µs (Telcordia GR-1089-CORE); printed as ±30 A 2
Off-state capacitance Coff 23 29 pF f = 1 MHz, Vd = 1 V rms, VD = 0; '4040 3
Off-state capacitance Coff 20 26 pF f = 1 MHz, Vd = 1 V rms, VD = 1 V; '4040 3
Off-state capacitance Coff 18 24 pF f = 1 MHz, Vd = 1 V rms, VD = 2 V; '4040 3
Storage temperature range Tstg -65 150 °C 2
Maximum junction temperature TJM 150 °C 2
Initial rate of rise of current di/dt 130 A/µs 2/10 waveshape 2
Non-repetitive peak on-state current, 20 ms (50 Hz) full sine wave ITSM 20 A 20 ms (50 Hz) full sine wave 2
Non-repetitive peak on-state current, 16.7 ms (60 Hz) full sine wave ITSM 22 A 16.7 ms (60 Hz) full sine wave 2
Non-repetitive peak on-state current, 0.2 s ITSM 13 A 0.2 s 50 Hz/60 Hz a.c. 2
Non-repetitive peak on-state current, 2 s ITSM 5 A 2 s 50 Hz/60 Hz a.c. 2
Non-repetitive peak on-state current, 1000 s ITSM 1.8 A 1000 s 50 Hz/60 Hz a.c. 2
Junction to free air thermal resistance (SMB, EIA/JESD51-3 PCB) RθJA 120 °C/W EIA/JESD51-3 PCB, IT = ITSM(1000), TA = 25 °C (see Note 3) 3
Junction to free air thermal resistance (SMB, 4-layer PCB) RθJA 55 °C/W 265 mm x 210 mm populated line card, 4-layer PCB, IT = ITSM(1000), TA = 25 °C 3

CAD (KiCad official)

  • Symbol: TISP4040L1BJR-S
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB(DO-214AA) (KiCad packages3D, STEP)
  • 3D model files: tisp4040l1bjr-s-etched.step / tisp4040l1bjr-s-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tisp4040l1bjr-s.step / tisp4040l1bjr-s.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: BOURNS datasheet (12 pp, sha256 24f328fd89bc6349, retrieved 2026-10-15, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF