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README

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SN74ABT821ADWR

Texas Instruments · Flip Flops · SOIC-24-300mil

SN74ABT821ADWR from Texas Instruments, in a SOIC-24-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OE input Buffered output-enable input places the ten Q outputs in the high-impedance state when high and does not affect the latched data; the outputs are in the high-impedance state during power up or power down when VCC is below 2.1 V.
2 1D input Data input to flip-flop 1 that is captured on the positive transition of CLK; the recommended setup time is 2.1 ns and hold time is 1.3 ns.
3 2D input Data input to flip-flop 2 that is captured on the positive transition of CLK; the recommended setup time is 2.1 ns and hold time is 1.3 ns.
4 3D input Data input to flip-flop 3 that is captured on the positive transition of CLK; the recommended setup time is 2.1 ns and hold time is 1.3 ns.
5 4D input Data input to flip-flop 4 that is captured on the positive transition of CLK; the recommended setup time is 2.1 ns and hold time is 1.3 ns.
6 5D input Data input to flip-flop 5 that is captured on the positive transition of CLK; the recommended setup time is 2.1 ns and hold time is 1.3 ns.
7 6D input Data input to flip-flop 6 that is captured on the positive transition of CLK; the recommended setup time is 2.1 ns and hold time is 1.3 ns.
8 7D input Data input to flip-flop 7 that is captured on the positive transition of CLK; the recommended setup time is 2.1 ns and hold time is 1.3 ns.
9 8D input Data input to flip-flop 8 that is captured on the positive transition of CLK; the recommended setup time is 2.1 ns and hold time is 1.3 ns.
10 9D input Data input to flip-flop 9 that is captured on the positive transition of CLK; the recommended setup time is 2.1 ns and hold time is 1.3 ns.
11 10D input Data input to flip-flop 10 that is captured on the positive transition of CLK; the recommended setup time is 2.1 ns and hold time is 1.3 ns.
12 GND power_in Ground reference pin for the device; the recommended supply range is 4.5 V to 5.5 V on VCC relative to this pin.
13 CLK input Clock input on whose positive transition the ten D inputs are latched and transferred to the Q outputs; maximum clock frequency is 125 MHz with pulse widths of at least 2.9 ns high and 3.8 ns low.
14 10Q tri_state Three-state buffered output of flip-flop 10 that drives high-capacitance or low-impedance bus loads with up to 32 mA IOH and 64 mA IOL.
15 9Q tri_state Three-state buffered output of flip-flop 9 that drives high-capacitance or low-impedance bus loads with up to 32 mA IOH and 64 mA IOL.
16 8Q tri_state Three-state buffered output of flip-flop 8 that drives high-capacitance or low-impedance bus loads with up to 32 mA IOH and 64 mA IOL.
17 7Q tri_state Three-state buffered output of flip-flop 7 that drives high-capacitance or low-impedance bus loads with up to 32 mA IOH and 64 mA IOL.
18 6Q tri_state Three-state buffered output of flip-flop 6 that drives high-capacitance or low-impedance bus loads with up to 32 mA IOH and 64 mA IOL.
19 5Q tri_state Three-state buffered output of flip-flop 5 that drives high-capacitance or low-impedance bus loads with up to 32 mA IOH and 64 mA IOL.
20 4Q tri_state Three-state buffered output of flip-flop 4 that drives high-capacitance or low-impedance bus loads with up to 32 mA IOH and 64 mA IOL.
21 3Q tri_state Three-state buffered output of flip-flop 3 that drives high-capacitance or low-impedance bus loads with up to 32 mA IOH and 64 mA IOL.
22 2Q tri_state Three-state buffered output of flip-flop 2 that drives high-capacitance or low-impedance bus loads with up to 32 mA IOH and 64 mA IOL.
23 1Q tri_state Three-state buffered output of flip-flop 1 that drives high-capacitance or low-impedance bus loads with up to 32 mA IOH and 64 mA IOL.
24 VCC power_in Supply voltage input with a recommended range of 4.5 V to 5.5 V and an absolute maximum of 7 V.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-24-300mil
Category Logic
Pins 24

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VCC 4.5 5.5 V 3
High-level input voltage VIH 2 V 3
Low-level input voltage VIL 0.8 V 3
Input voltage VI 0 V max printed as VCC 3
High-level output current IOH -32 mA 3
Low-level output current IOL 64 mA 3
Input transition rise or fall rate ∆t/∆v 10 ns/V 3
Power-up ramp rate ∆t/∆VCC 200 µs/V 3
Operating free-air temperature TA -40 85 °C 3
Supply voltage range VCC -0.5 7 V 3
Input voltage range VI -0.5 7 V see Note 1 3
Voltage applied to any output in high or power-off state VO -0.5 5.5 V 3
Current into any output in low state IO 128 mA SN74ABT821A 3
Input clamp current IIK -18 mA VI < 0 3
Output clamp current IOK -50 mA VO < 0 3
Storage temperature range Tstg -65 150 °C 3
Package thermal impedance θJA 81 °C/W DW package 3
Input clamp voltage VIK -1.2 V VCC = 4.5 V, II = -18 mA 4
High-level output voltage VOH 2.5 V VCC = 4.5 V, IOH = -3 mA 4
High-level output voltage VOH 3 V VCC = 5 V, IOH = -3 mA 4
High-level output voltage VOH 2 V VCC = 4.5 V, IOH = -32 mA 4
Low-level output voltage VOL 0.55 V VCC = 4.5 V, IOL = 64 mA 4
Input current II -1 1 µA VCC = 0 to 5.5 V, VI = VCC or GND 4
Power-up output high-impedance current IOZPU -50 50 µA VCC = 0 to 2.1 V, VO = 0.5 to 2.7 V, OE = X 4
Power-down output high-impedance current IOZPD -50 50 µA VCC = 2.1 V to 0, VO = 0.5 to 2.7 V, OE = X 4
High-impedance output current high IOZH 10 µA VCC = 2.1 V to 5.5 V, VO = 2.7 V, OE ≥ 2 V 4
High-impedance output current low IOZL -10 µA VCC = 2.1 V to 5.5 V, VO = 0.5 V, OE ≥ 2 V 4
Power-off input/output current Ioff -100 100 µA VCC = 0, VI or VO ≤ 4.5 V 4
Output high leakage current ICEX 50 µA VCC = 5.5 V, VO = 5.5 V, outputs high 4
Short-circuit output current IO -180 -100 -50 mA VCC = 5.5 V, VO = 2.5 V 4
Quiescent supply current, outputs high ICC 1 250 µA VCC = 5.5 V, IO = 0, VI = VCC or GND, outputs high 4
Quiescent supply current, outputs low ICC 24 38 mA VCC = 5.5 V, IO = 0, VI = VCC or GND, outputs low 4
Quiescent supply current, outputs disabled ICC 0.5 250 µA VCC = 5.5 V, IO = 0, VI = VCC or GND, outputs disabled 4
Supply current increase per input at TTL level ∆ICC 1.5 mA VCC = 5.5 V, one input at 3.4 V, other inputs at VCC or GND 4
Input capacitance Ci 3.5 pF VI = 2.5 V or 0.5 V 4
Output capacitance Co 7.5 pF VO = 2.5 V or 0.5 V 4
Input hysteresis Vhys 100 mV 4
Clock frequency fclock 0 125 MHz 4
Pulse duration CLK high tw 2.9 ns CLK high 4
Pulse duration CLK low tw 3.8 ns CLK low 4
Setup time, data before CLK↑ tsu 2.1 ns 4
Hold time, data after CLK↑ th 1.3 ns 4
Propagation delay CLK to Q, low-to-high tPLH 1.6 6.2 ns CL = 50 pF 5
Propagation delay CLK to Q, high-to-low tPHL 2.3 6.7 ns CL = 50 pF 5
Enable time OE to Q, high tPZH 1 5.8 ns CL = 50 pF 5
Enable time OE to Q, low tPZL 2.2 6.3 ns CL = 50 pF 5
Disable time OE to Q, high tPHZ 2.7 6.7 ns CL = 50 pF 5
Disable time OE to Q, low tPLZ 1.7 6.5 ns CL = 50 pF 5

CAD (KiCad official)

  • Symbol: SN74ABT821ADWR
  • Footprint: Package_SO:SOIC-24W_7.5x15.4mm_P1.27mm
  • 3D model: SOIC-24-300mil (KiCad packages3D, STEP)
  • 3D model files: sn74abt821adwr-etched.step / sn74abt821adwr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sn74abt821adwr.step / sn74abt821adwr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (15 pp, sha256 16843c4ca7b2e96b, retrieved 2026-11-05, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF