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SN74ABT821ADWR
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Texas Instruments Flip Flops, SOIC-24-300mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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Symbol & Footprint
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README
markdownSN74ABT821ADWR
Texas Instruments · Flip Flops · SOIC-24-300mil
SN74ABT821ADWR from Texas Instruments, in a SOIC-24-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OE | input | Buffered output-enable input places the ten Q outputs in the high-impedance state when high and does not affect the latched data; the outputs are in the high-impedance state during power up or power down when VCC is below 2.1 V. |
| 2 | 1D | input | Data input to flip-flop 1 that is captured on the positive transition of CLK; the recommended setup time is 2.1 ns and hold time is 1.3 ns. |
| 3 | 2D | input | Data input to flip-flop 2 that is captured on the positive transition of CLK; the recommended setup time is 2.1 ns and hold time is 1.3 ns. |
| 4 | 3D | input | Data input to flip-flop 3 that is captured on the positive transition of CLK; the recommended setup time is 2.1 ns and hold time is 1.3 ns. |
| 5 | 4D | input | Data input to flip-flop 4 that is captured on the positive transition of CLK; the recommended setup time is 2.1 ns and hold time is 1.3 ns. |
| 6 | 5D | input | Data input to flip-flop 5 that is captured on the positive transition of CLK; the recommended setup time is 2.1 ns and hold time is 1.3 ns. |
| 7 | 6D | input | Data input to flip-flop 6 that is captured on the positive transition of CLK; the recommended setup time is 2.1 ns and hold time is 1.3 ns. |
| 8 | 7D | input | Data input to flip-flop 7 that is captured on the positive transition of CLK; the recommended setup time is 2.1 ns and hold time is 1.3 ns. |
| 9 | 8D | input | Data input to flip-flop 8 that is captured on the positive transition of CLK; the recommended setup time is 2.1 ns and hold time is 1.3 ns. |
| 10 | 9D | input | Data input to flip-flop 9 that is captured on the positive transition of CLK; the recommended setup time is 2.1 ns and hold time is 1.3 ns. |
| 11 | 10D | input | Data input to flip-flop 10 that is captured on the positive transition of CLK; the recommended setup time is 2.1 ns and hold time is 1.3 ns. |
| 12 | GND | power_in | Ground reference pin for the device; the recommended supply range is 4.5 V to 5.5 V on VCC relative to this pin. |
| 13 | CLK | input | Clock input on whose positive transition the ten D inputs are latched and transferred to the Q outputs; maximum clock frequency is 125 MHz with pulse widths of at least 2.9 ns high and 3.8 ns low. |
| 14 | 10Q | tri_state | Three-state buffered output of flip-flop 10 that drives high-capacitance or low-impedance bus loads with up to 32 mA IOH and 64 mA IOL. |
| 15 | 9Q | tri_state | Three-state buffered output of flip-flop 9 that drives high-capacitance or low-impedance bus loads with up to 32 mA IOH and 64 mA IOL. |
| 16 | 8Q | tri_state | Three-state buffered output of flip-flop 8 that drives high-capacitance or low-impedance bus loads with up to 32 mA IOH and 64 mA IOL. |
| 17 | 7Q | tri_state | Three-state buffered output of flip-flop 7 that drives high-capacitance or low-impedance bus loads with up to 32 mA IOH and 64 mA IOL. |
| 18 | 6Q | tri_state | Three-state buffered output of flip-flop 6 that drives high-capacitance or low-impedance bus loads with up to 32 mA IOH and 64 mA IOL. |
| 19 | 5Q | tri_state | Three-state buffered output of flip-flop 5 that drives high-capacitance or low-impedance bus loads with up to 32 mA IOH and 64 mA IOL. |
| 20 | 4Q | tri_state | Three-state buffered output of flip-flop 4 that drives high-capacitance or low-impedance bus loads with up to 32 mA IOH and 64 mA IOL. |
| 21 | 3Q | tri_state | Three-state buffered output of flip-flop 3 that drives high-capacitance or low-impedance bus loads with up to 32 mA IOH and 64 mA IOL. |
| 22 | 2Q | tri_state | Three-state buffered output of flip-flop 2 that drives high-capacitance or low-impedance bus loads with up to 32 mA IOH and 64 mA IOL. |
| 23 | 1Q | tri_state | Three-state buffered output of flip-flop 1 that drives high-capacitance or low-impedance bus loads with up to 32 mA IOH and 64 mA IOL. |
| 24 | VCC | power_in | Supply voltage input with a recommended range of 4.5 V to 5.5 V and an absolute maximum of 7 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-24-300mil |
| Category | Logic |
| Pins | 24 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage | VCC | 4.5 | 5.5 | V | 3 | ||
| High-level input voltage | VIH | 2 | V | 3 | |||
| Low-level input voltage | VIL | 0.8 | V | 3 | |||
| Input voltage | VI | 0 | V | max printed as VCC | 3 | ||
| High-level output current | IOH | -32 | mA | 3 | |||
| Low-level output current | IOL | 64 | mA | 3 | |||
| Input transition rise or fall rate | ∆t/∆v | 10 | ns/V | 3 | |||
| Power-up ramp rate | ∆t/∆VCC | 200 | µs/V | 3 | |||
| Operating free-air temperature | TA | -40 | 85 | °C | 3 | ||
| Supply voltage range | VCC | -0.5 | 7 | V | 3 | ||
| Input voltage range | VI | -0.5 | 7 | V | see Note 1 | 3 | |
| Voltage applied to any output in high or power-off state | VO | -0.5 | 5.5 | V | 3 | ||
| Current into any output in low state | IO | 128 | mA | SN74ABT821A | 3 | ||
| Input clamp current | IIK | -18 | mA | VI < 0 | 3 | ||
| Output clamp current | IOK | -50 | mA | VO < 0 | 3 | ||
| Storage temperature range | Tstg | -65 | 150 | °C | 3 | ||
| Package thermal impedance | θJA | 81 | °C/W | DW package | 3 | ||
| Input clamp voltage | VIK | -1.2 | V | VCC = 4.5 V, II = -18 mA | 4 | ||
| High-level output voltage | VOH | 2.5 | V | VCC = 4.5 V, IOH = -3 mA | 4 | ||
| High-level output voltage | VOH | 3 | V | VCC = 5 V, IOH = -3 mA | 4 | ||
| High-level output voltage | VOH | 2 | V | VCC = 4.5 V, IOH = -32 mA | 4 | ||
| Low-level output voltage | VOL | 0.55 | V | VCC = 4.5 V, IOL = 64 mA | 4 | ||
| Input current | II | -1 | 1 | µA | VCC = 0 to 5.5 V, VI = VCC or GND | 4 | |
| Power-up output high-impedance current | IOZPU | -50 | 50 | µA | VCC = 0 to 2.1 V, VO = 0.5 to 2.7 V, OE = X | 4 | |
| Power-down output high-impedance current | IOZPD | -50 | 50 | µA | VCC = 2.1 V to 0, VO = 0.5 to 2.7 V, OE = X | 4 | |
| High-impedance output current high | IOZH | 10 | µA | VCC = 2.1 V to 5.5 V, VO = 2.7 V, OE ≥ 2 V | 4 | ||
| High-impedance output current low | IOZL | -10 | µA | VCC = 2.1 V to 5.5 V, VO = 0.5 V, OE ≥ 2 V | 4 | ||
| Power-off input/output current | Ioff | -100 | 100 | µA | VCC = 0, VI or VO ≤ 4.5 V | 4 | |
| Output high leakage current | ICEX | 50 | µA | VCC = 5.5 V, VO = 5.5 V, outputs high | 4 | ||
| Short-circuit output current | IO | -180 | -100 | -50 | mA | VCC = 5.5 V, VO = 2.5 V | 4 |
| Quiescent supply current, outputs high | ICC | 1 | 250 | µA | VCC = 5.5 V, IO = 0, VI = VCC or GND, outputs high | 4 | |
| Quiescent supply current, outputs low | ICC | 24 | 38 | mA | VCC = 5.5 V, IO = 0, VI = VCC or GND, outputs low | 4 | |
| Quiescent supply current, outputs disabled | ICC | 0.5 | 250 | µA | VCC = 5.5 V, IO = 0, VI = VCC or GND, outputs disabled | 4 | |
| Supply current increase per input at TTL level | ∆ICC | 1.5 | mA | VCC = 5.5 V, one input at 3.4 V, other inputs at VCC or GND | 4 | ||
| Input capacitance | Ci | 3.5 | pF | VI = 2.5 V or 0.5 V | 4 | ||
| Output capacitance | Co | 7.5 | pF | VO = 2.5 V or 0.5 V | 4 | ||
| Input hysteresis | Vhys | 100 | mV | 4 | |||
| Clock frequency | fclock | 0 | 125 | MHz | 4 | ||
| Pulse duration CLK high | tw | 2.9 | ns | CLK high | 4 | ||
| Pulse duration CLK low | tw | 3.8 | ns | CLK low | 4 | ||
| Setup time, data before CLK↑ | tsu | 2.1 | ns | 4 | |||
| Hold time, data after CLK↑ | th | 1.3 | ns | 4 | |||
| Propagation delay CLK to Q, low-to-high | tPLH | 1.6 | 6.2 | ns | CL = 50 pF | 5 | |
| Propagation delay CLK to Q, high-to-low | tPHL | 2.3 | 6.7 | ns | CL = 50 pF | 5 | |
| Enable time OE to Q, high | tPZH | 1 | 5.8 | ns | CL = 50 pF | 5 | |
| Enable time OE to Q, low | tPZL | 2.2 | 6.3 | ns | CL = 50 pF | 5 | |
| Disable time OE to Q, high | tPHZ | 2.7 | 6.7 | ns | CL = 50 pF | 5 | |
| Disable time OE to Q, low | tPLZ | 1.7 | 6.5 | ns | CL = 50 pF | 5 |
CAD (KiCad official)
- Symbol:
SN74ABT821ADWR - Footprint:
Package_SO:SOIC-24W_7.5x15.4mm_P1.27mm - 3D model: SOIC-24-300mil (KiCad packages3D, STEP)
- 3D model files:
sn74abt821adwr-etched.step/sn74abt821adwr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);sn74abt821adwr.step/sn74abt821adwr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (15 pp, sha256
16843c4ca7b2e96b, retrieved 2026-11-05, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).