Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

LAN9354

Microchip Tech · Interface - Specialized · QFN-56-EP(8x8)

LAN9354 from Microchip Tech, in a QFN-56-EP(8x8). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OSCI input External 25 MHz crystal input, which can also be driven by a single-ended clock oscillator with OSCO left unconnected.
2 OSCO output External 25 MHz crystal output; leave unconnected when OSCI is driven by a single-ended clock oscillator.
3 OSCVDD12 power_in Crystal +1.2 V power supply, supplied by the on-chip regulator unless regulator-off mode is configured via REG_EN.
4 OSCVSS power_in Crystal ground.
5 VDD33 power_in +3.3 V power supply for the internal regulators, which must be supplied even if the internal regulators are disabled.
6 VDDCR power_in +1.2 V digital core supply, supplied by the on-chip regulator unless regulator-off mode is set via REG_EN; 1 µF and 470 pF decoupling capacitors in parallel to ground should be used on this pin.
7 REG_EN passive When tied to 3.3 V, the internal 1.2 V regulators are enabled.
8 FXLOSEN input Three-level strap selecting FX-LOS versus FX-SD/copper mode: below 1 V selects FX-SD/copper for both ports, 1.5 V selects FX-LOS for port A, and above 2 V selects FX-LOS for ports A and B.
9 FXSDA/FXLOSA/FXSDENA input Port A fiber signal detect input (valid above 2 V typ.) when FX-LOS mode is not selected, or fiber loss-of-signal input (high = LOS) in FX-LOS mode, with the FX-SD enable strap selecting FX-SD above 1 V (typ.).
10 FXSDB/FXLOSB/FXSDENB input Port B fiber signal detect input (valid above 2 V typ.) when FX-LOS mode is not selected, or fiber loss-of-signal input (high = LOS) in FX-LOS mode, with the FX-SD enable strap selecting FX-SD above 1 V (typ.).
11 RST# input Active-low system reset input with internal pull-up that may be left unconnected because an internal power-on reset exists, and must meet the reset timing requirements in Section 20.0.
12 GPIO7 bidirectional General purpose I/O 7, fully programmable as a push-pull output, open-drain output, or Schmitt-triggered input via GPIO_CFG and GPIO_DATA_DIR.
13 GPIO6 bidirectional General purpose I/O 6, fully programmable as a push-pull output, open-drain output, or Schmitt-triggered input via GPIO_CFG and GPIO_DATA_DIR.
14 VDDIO power_in +1.8 V to +3.3 V variable I/O power supply.
15 LED5/GPIO5/PHYADD bidirectional LED 5 output when LED 5 Enable is set (open-drain polarity set by PHYADD strap at reset), otherwise GPIO5; the PHYADD strap sets the default Switch PHY Address Select soft-strap.
16 LED4/GPIO4/1588EN bidirectional LED 4 output when LED 4 Enable is set (open-drain polarity set by 1588EN strap at reset), otherwise GPIO4; the 1588EN strap sets the default 1588 Enable soft-strap.
17 P0_SPEED input In RMII MAC mode this live speed input is typically tied to the external PHY speed indication and can be overridden by VPHY_SPEED_SEL_LSB when auto-negotiation is cleared; it is not used in RMII PHY mode.
18 VDDIO power_in +1.8 V to +3.3 V variable I/O power supply.
19 P0_OUTD1/P0_MODE2 bidirectional Port 0 RMII output data bit 1 (8 mA drive; transmit data in MAC mode, receive data in PHY mode), also the Port 0 Mode[2] configuration strap.
20 P0_OUTD0/P0_MODE1 bidirectional Port 0 RMII output data bit 0 (8 mA drive; transmit data in MAC mode, receive data in PHY mode), also the Port 0 Mode[1] configuration strap.
21 P0_OUTDV output RMII output data valid, which is TX_EN to the external PHY in MAC mode and CRS_DV to the external MAC in PHY mode (8 mA drive).
22 VDDCR power_in +1.2 V digital core supply, supplied by the on-chip regulator unless regulator-off mode is set via REG_EN.
23 P0_REFCLK/P0_MODE0 bidirectional Port 0 RMII 50 MHz reference clock, an input or output selected by the RMII Clock Direction bit, with 12 mA or 16 mA drive when output; also the Port 0 Mode[0] configuration strap.
24 P0_INDV input RMII input data valid, which is CRS_DV from the external PHY in MAC mode and TX_EN from the external MAC in PHY mode (VIS input with pull-down).
25 P0_IND0 input RMII input data bit 0, receive data from the external PHY in MAC mode and transmit data from the external MAC in PHY mode (VIS input with pull-down).
26 P0_IND1 input RMII input data bit 1, receive data from the external PHY in MAC mode and transmit data from the external MAC in PHY mode (VIS input with pull-down).
27 RESERVED unconnected This pin is reserved and must be left unconnected for proper operation.
28 VDDIO power_in +1.8 V to +3.3 V variable I/O power supply.
29 LED3/GPIO3/EEEEN bidirectional LED 3 output when LED 3 Enable is set (open-drain polarity set by EEEEN strap at reset), otherwise GPIO3; the EEEEN strap sets the default EEE Enable soft-straps.
30 P0_DUPLEX input In RMII MAC mode this live duplex input is typically tied to the external PHY duplex indication and can be overridden by VPHY_DUPLEX when auto-negotiation is cleared; it is not used in RMII PHY mode.
31 VDDIO power_in +1.8 V to +3.3 V variable I/O power supply.
32 VDDCR power_in +1.2 V digital core supply, supplied by the on-chip regulator unless regulator-off mode is set via REG_EN.
33 P0_MDC bidirectional SMI/MII management clock: an input from an external master in slave modes and an output to external PHY(s) in MII master mode (8 mA); an external pull-down is recommended when SMI/MII is not used.
34 P0_MDIO bidirectional SMI/MII management data to/from an external master (slave modes) or external PHY(s) (MII master mode); an external pull-up is required when SMI or MII is used.
35 TESTMODE input This pin must be tied to VSS for proper operation.
36 I2CSDA/EESDA/TMS bidirectional I2C slave serial data input/output to/from the external master (VIS/VOD8), which must be pulled up by an external resistor at all times.
37 I2CSCL/EESCL/TCK bidirectional I2C slave serial clock input from the external master (VIS), which is not driven until the EEPROM is loaded.
38 IRQ output Interrupt request output whose polarity, source and buffer type (open-drain or push-pull) are programmable via the Interrupt Configuration Register (IRQ_CFG).
39 LED2/GPIO2/E2PSIZE bidirectional LED 2 output when LED 2 Enable is set (open-drain polarity set by E2PSIZE strap at reset), otherwise GPIO2; the E2PSIZE strap selects EEPROM size (low = 1K to 16K bits, high = 32K to 512K bits).
40 LED1/GPIO1/TDI bidirectional LED 1 output when LED 1 Enable is set, otherwise GPIO1 fully programmable as push-pull output, open-drain output, or Schmitt-triggered input.
41 VDDIO power_in +1.8 V to +3.3 V variable I/O power supply.
42 LED0/GPIO0/TDO/MNGT0 bidirectional LED 0 output when LED 0 Enable is set (open-drain polarity set by MNGT0 strap at reset), otherwise GPIO0; the MNGT0 strap selects serial management mode (0 = SMI, 1 = I2C).
43 VDD33TXRX1 power_in +3.3 V Port A analog power supply (see power connection notes).
44 TXNA bidirectional Port A twisted pair transmit/receive negative channel 1 (AIO); in fiber mode this is the Port A FX transmit negative OLVPECL output.
45 TXPA bidirectional Port A twisted pair transmit/receive positive channel 1 (AIO); in fiber mode this is the Port A FX transmit positive OLVPECL output.
46 RXNA bidirectional Port A twisted pair transmit/receive negative channel 2 (AIO); in fiber mode this is the Port A FX receive negative analog input.
47 RXPA bidirectional Port A twisted pair transmit/receive positive channel 2 (AIO); in fiber mode this is the Port A FX receive positive analog input.
48 VDD12TX1 power_in Port A transmitter +1.2 V supply from an external 1.2 V supply or the internal regulator; it must be tied to VDD12TX2 for proper operation.
49 RBIAS passive Bias reference for internal circuits, connected to an external 12.1 kΩ, 1% resistor to ground (nominal voltage 1.2 V).
50 VDD33BIAS power_in +3.3 V master bias power supply.
51 VDD12TX2 power_in Port B transmitter +1.2 V supply from an external 1.2 V supply or the internal regulator; it must be tied to VDD12TX1 for proper operation.
52 RXPB bidirectional Port B twisted pair transmit/receive positive channel 2 (AIO); in fiber mode this is the Port B FX receive positive analog input.
53 RXNB bidirectional Port B twisted pair transmit/receive negative channel 2 (AIO); in fiber mode this is the Port B FX receive negative analog input.
54 TXPB bidirectional Port B twisted pair transmit/receive positive channel 1 (AIO); in fiber mode this is the Port B FX transmit positive OLVPECL output.
55 TXNB bidirectional Port B twisted pair transmit/receive negative channel 1 (AIO); in fiber mode this is the Port B FX transmit negative OLVPECL output.
56 VDD33TXRX2 power_in +3.3 V Port B analog power supply (see power connection notes).
57 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package QFN-56-EP(8x8)
Category Communication Interface Chip/UART/485/232
Pins 57

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage (VDD12TX1, VDD12TX2, OSCVDD12, VDDCR) 0 1.5 V Note 1 467
Supply Voltage (VDD33TXRX1, VDD33TXRX2, VDD33BIAS, VDD33, VDDIO) 0 3.6 V Note 1 467
Ethernet Magnetics Supply Voltage -0.5 3.6 V 467
Negative voltage on input signal pins, with respect to ground -0.5 V Note 3: does not apply to RBIAS 467
Positive voltage on OSCI, with respect to ground 3.6 V 467
Storage Temperature -55 150 °C 467
Junction Temperature 150 °C 467
Low Input Level (IS type input buffer) VILI -0.3 0.8 V Note 19: applies to all inputs and tri-stated bidirectional pins 472
High Input Level (IS type input buffer) VIHI 2 3.6 V Note 19 472
Input Leakage IIH -10 10 µA VIN = VSS or VDD33 472
Low Input Level (FXSDENA/FXSDENB) VIL -0.3 0.8 V AI type input buffer 472
High Input Level (FXSDENA/FXSDENB) VIH 1.2 V AI type input buffer; max printed as VDD33+0.3 472
State A Threshold (FXLOSEN Input) VTHA -0.3 0.8 V AI type input buffer 472
State B Threshold (FXLOSEN Input) VTHB 1.2 1.7 V AI type input buffer 472
State C Threshold (FXLOSEN Input) VTHC 2.3 V AI type input buffer; max printed as VDD33+0.3 472
Low Input Level (OSCI Input) VILI -0.3 0.35 V ICLK type input buffer; Note 20 472
High Input Level (OSCI Input) VIHI 3.6 V ICLK type input buffer; min printed as OSCVDD12-0.35 472
Input Leakage (OSCI Input) IILCK -10 10 µA ICLK type input buffer 472
Low Output Level (VO8 type buffers) VOL 0.4 V IOL = 8 mA 474
Low Output Level (VOD8 type buffer) VOL 0.4 V IOL = 8 mA 474
Low Output Level (VO12 type buffers) VOL 0.4 V IOL = 12 mA 474
Low Output Level (VOD12 type buffer) VOL 0.4 V IOL = 12 mA 474
Low Output Level (VO16 type buffers) VOL 0.4 V IOL = 16 mA 474
Peak Differential Output Voltage High VPPH 950 1050 mVpk Note 24: measured at line side of transformer, line replaced by 100 Ω (±1%) 475
Peak Differential Output Voltage Low VPPL -950 -1050 mVpk Note 24: measured at line side of transformer, line replaced by 100 Ω (±1%) 475
Signal Amplitude Symmetry VSS 98 102 % Note 24 475
Signal Rise and Fall Time TRF 3 5 ns Note 24 475
Rise and Fall Symmetry TRFS 0.5 ns Note 24 475
Duty Cycle Distortion DCD 35 50 65 % Note 25: offset from 16 ns pulse width at 50% of pulse peak 475
Overshoot and Undershoot VOS 5 % 475
Jitter 1.4 ns Note 26: measured differentially 475
Transmitter Peak Differential Output Voltage VOUT 2.2 2.5 2.8 V Note 27: min/max guaranteed with 100 Ω resistive load 475
Receiver Differential Squelch Threshold VDS 300 420 585 mV 475
TCK clock period ttckp 40 ns Note: timing with respect to 25 pF test load; value placed in Min column by parameter meaning (single value in source) 466
TDI, TMS setup to TCK rising edge tsu 5 ns 25 pF test load; placed in Min column by parameter meaning (single value in source) 466
TDI, TMS hold from TCK rising edge th 5 ns 25 pF test load; placed in Min column by parameter meaning (single value in source) 466
TDO output valid from TCK falling edge tdov 15 ns 25 pF test load; placed in Max column by parameter meaning (single value in source) 466
TDO output invalid from TCK falling edge tdoinvld 0 ns 25 pF test load; placed in Min column by parameter meaning (single value in source) 466
Configuration strap valid time tcfg 15 ms Power-on configuration strap latching 479
OSCI Pin Capacitance 3 pF Note 34: includes pad, bond wire and lead frame 480
OSCO Pin Capacitance 3 pF Note 34: includes pad, bond wire and lead frame 480
Maximum Power (Internal Regulator Disabled, 2.5 V Ethernet Magnetics) 752 mW Table 20-2 468
Maximum Power (Internal Regulator Disabled, 3.3 V Ethernet Magnetics) 927 mW Table 20-2 468
Maximum Power (Internal Regulator Enabled, 2.5 V Ethernet Magnetics) 973 mW Table 20-2 468
Maximum Power (Internal Regulator Enabled, 3.3 V Ethernet Magnetics) 1148 mW Table 20-2 468
Thermal Resistance Junction to Ambient JA 24.7 °C/W Measured in still air (56-pin QFN) 468
Thermal Resistance Junction to Bottom of Case JT 0.1 °C/W Measured in still air (56-pin QFN) 468
Thermal Resistance Junction to Top of Case JC 1.8 °C/W Airflow 1 m/s (56-pin QFN) 468

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper with the FXSDB pin. As such, the LVPECL levels ensure that the input is greater than 1 V (typ.) and that Signal Detect mode is selected. When TP copper is desired, the Signal Detect input function is 101

CAD (KiCad official)

  • Symbol: LAN9354
  • Footprint: Package_DFN_QFN:QFN-56-1EP_8x8mm_P0.5mm_EP4.5x5.2mm
  • 3D model: QFN-56-EP(8x8) (KiCad packages3D, STEP)
  • 3D model files: lan9354-etched.step / lan9354-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lan9354.step / lan9354.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (487 pp, sha256 6d0f1e1a944406cb, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF