component
HGV8542M
Public Made by Adomby adom
HGSEMI Operational Amplifier, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownHGV8542M
HGSEMI · Operational Amplifier · SOP-8
HGV8542M from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUT A | output | Output of amplifier A, which swings within the supply rails (the datasheet specifies V_OH and V_OL against V+ and V-). |
| 2 | -IN A | input | Inverting input of amplifier A; differential input voltage must stay within the absolute maximum rating of ±VS. |
| 3 | +IN A | input | Non-inverting input of amplifier A; the common-mode input range spans the supply rails (VCM = 0 V to VS in the CMRR specification). |
| 4 | V- | power_in | Negative supply rail; the operating supply is 2.7 V to 5.5 V and the absolute maximum total supply (V+ to V-) is 6 V, with GND between V- and V+. |
| 5 | +IN B | input | Non-inverting input of amplifier B; the common-mode input range spans the supply rails (VCM = 0 V to VS in the CMRR specification). |
| 6 | -IN B | input | Inverting input of amplifier B; differential input voltage must stay within the absolute maximum rating of ±VS. |
| 7 | OUT B | output | Output of amplifier B, which swings within the supply rails (the datasheet specifies V_OH and V_OL against V+ and V-). |
| 8 | V+ | power_in | Positive supply rail; the operating supply is 2.7 V to 5.5 V and the absolute maximum total supply (V+ to V-) is 6 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | SOP-8 |
| Category | Amplifiers/Comparators |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage | VS | 6 | V | 5 | |||
| Differential input voltage | -6 | 6 | V | 5 | |||
| Operating temperature range | -40 | 125 | °C | 5 | |||
| Storage temperature range | -65 | 150 | °C | 5 | |||
| Lead temperature | 300 | °C | soldering, 60 s | 5 | |||
| Supply voltage range | VS | 2.7 | 5.5 | V | 1 | ||
| Operating temperature range | TA | -40 | 125 | °C | 1 | ||
| Junction-to-ambient thermal resistance (8-pin SOIC) | θJA | 158 | °C/W | 8-pin SOIC (R) | 5 | ||
| Junction-to-case thermal resistance (8-pin SOIC) | θJC | 43 | °C/W | 8-pin SOIC (R) | 5 | ||
| Input offset voltage | VOS | 1 | 6 | mV | VS = 2.7 V, VCM = 1.35 V, TA = 25°C | 2 | |
| Input offset voltage over temperature | VOS | 7 | mV | −40°C ≤ TA ≤ +125°C | 2 | ||
| Input bias current | IB | 4 | 60 | pA | VS = 2.7 V, VCM = 1.35 V, TA = 25°C | 2 | |
| Input bias current over temperature | IB | 100 | pA | −40°C ≤ TA ≤ +85°C | 2 | ||
| Input bias current over temperature | IB | 1000 | pA | −40°C ≤ TA ≤ +125°C | 2 | ||
| Input offset current | IOS | 0.1 | 30 | pA | VS = 2.7 V, VCM = 1.35 V, TA = 25°C | 2 | |
| Input offset current over temperature | IOS | 50 | pA | −40°C ≤ TA ≤ +85°C | 2 | ||
| Input offset current over temperature | IOS | 500 | pA | −40°C ≤ TA ≤ +125°C | 2 | ||
| Common-mode rejection ratio | CMRR | 40 | 45 | dB | VS = 2.7 V, VCM = 0 V to 2.7 V | 2 | |
| Common-mode rejection ratio over temperature | CMRR | 38 | dB | −40°C ≤ TA ≤ +125°C | 2 | ||
| Large-signal voltage gain | AVO | 100 | 500 | V/mV | RL = 100 kΩ, VO = 0.5 V to 2.2 V | 2 | |
| Large-signal voltage gain over temperature | AVO | 50 | V/mV | −40°C ≤ TA ≤ +85°C | 2 | ||
| Large-signal voltage gain over temperature | AVO | 2 | V/mV | −40°C ≤ TA ≤ +125°C | 2 | ||
| Input offset voltage drift | ΔVOS/ΔT | 4 | μV/°C | −40°C ≤ TA ≤ +125°C | 2 | ||
| Input bias current drift | ΔIB/ΔT | 100 | fA/°C | −40°C ≤ TA ≤ +85°C | 2 | ||
| Input bias current drift | ΔIB/ΔT | 2000 | fA/°C | −40°C ≤ TA ≤ +125°C | 2 | ||
| Input offset current drift | ΔIOS/ΔT | 25 | fA/°C | −40°C ≤ TA ≤ +125°C | 2 | ||
| High-level output voltage | VOH | 2.575 | 2.65 | V | IL = 1 mA, VS = 2.7 V | 2 | |
| High-level output voltage over temperature | VOH | 2.55 | V | −40°C ≤ TA ≤ +125°C | 2 | ||
| Low-level output voltage | VOL | 35 | 100 | mV | IL = 1 mA, VS = 2.7 V | 2 | |
| Low-level output voltage over temperature | VOL | 125 | mV | −40°C ≤ TA ≤ +125°C | 2 | ||
| Output short-circuit current (sourcing/sinking) | IOUT | 15 | mA | VOUT = VS − 1 V | 2 | ||
| Short-circuit current | ISC | -20 | 20 | mA | 2 | ||
| Open-loop output impedance | ZOUT | 50 | Ω | f = 200 kHz, AV = 1 | 2 | ||
| Power supply rejection ratio | PSRR | 65 | 76 | dB | VS = 2.5 V to 6 V | 2 | |
| Power supply rejection ratio over temperature | PSRR | 60 | dB | −40°C ≤ TA ≤ +125°C | 2 | ||
| Supply current per amplifier | ISY | 38 | 55 | μA | VO = 0 V, VS = 2.7 V | 2 | |
| Supply current per amplifier over temperature | ISY | 75 | μA | −40°C ≤ TA ≤ +125°C | 2 | ||
| Slew rate | SR | 0.4 | 0.75 | V/μs | RL = 100 kΩ | 2 | |
| Settling time to 0.1% | tS | 5 | μs | to 0.1% (1 V step) | 2 | ||
| Gain bandwidth product | GBP | 980 | kHz | 2 | |||
| Phase margin | ΦM | 63 | ° | 2 | |||
| Input voltage noise density | en | 40 | nV/√Hz | f = 1 kHz | 2 | ||
| Input voltage noise density | en | 38 | nV/√Hz | f = 10 kHz | 2 | ||
| Input current noise density | in | 0.1 | pA/√Hz | 2 | |||
| Supply current per amplifier (3 V table) | ISY | 40 | 60 | μA | VO = 0 V (3 V table) | 3 | |
| Supply current per amplifier over temperature (3 V table) | ISY | 75 | μA | −40°C ≤ TA ≤ +125°C | 3 | ||
| Supply current per amplifier (5 V table) | ISY | 45 | 65 | μA | VO = 0 V (5 V table) | 4 | |
| Supply current per amplifier over temperature (5 V table) | ISY | 85 | μA | −40°C ≤ TA ≤ +125°C | 4 | ||
| Slew rate (5 V table) | SR | 0.45 | 0.92 | V/μs | RL = 100 kΩ, CL = 200 pF | 4 | |
| Gain bandwidth product (5 V table) | GBP | 1000 | kHz | 4 |
CAD (KiCad official)
- Symbol:
HGV8542M - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files:
hgv8542m-etched.step/hgv8542m-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hgv8542m.step/hgv8542m.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HGSEMI datasheet (15 pp, sha256
fc99488bc7b54830, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).