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Contents

README

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DP6580

Shenzhen Developer Microelec · MOSFETs · TO-252

DP6580 from Shenzhen Developer Microelec, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; drive with VGS up to ±25 V absolute maximum, threshold VGS(th) 2 V min, 3 V typ, 4 V max at VDS=VGS, ID=250 µA.
2 D passive Drain, connected to the exposed tab; VDS rated 65 V and continuous ID 85 A (silicon limit) at TC=25°C.
3 S passive Source; body diode forward voltage VSD 0.9 V typ, 1.3 V max at ISD=40 A, RDS(on) 7.1 mΩ typ at VGS=10 V.

Key specifications

Parameter Value
Manufacturer Shenzhen Developer Microelec
Package TO-252
Category Triode/MOS Tube/Transistor
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-source breakdown voltage BVDSS 65 V VGS=0V, ID=250uA 3
Gate threshold voltage VGS(th) 2 3 4 V VDS=VGS, ID=250uA 3
Zero gate voltage drain current (Tj=25°C) IDSS 0.05 1 µA VDS=65V, VGS=0V, Tj=25°C 3
Zero gate voltage drain current (Tj=125°C) IDSS 5 µA VDS=65V, VGS=0V, Tj=125°C 3
Gate-source leakage current IGSS 10 100 nA VGS=25V, VDS=0V 3
Drain-source on-state resistance RDS(on) 7.1 8.4 mΩ VGS=10V, ID=40A, Tj=25°C 3
Body diode forward voltage VSD 0.9 1.3 V VGS=0V, ISD=40A 4
Drain-source voltage VDS 65 V 2
Continuous drain current (silicon limit) ID 85 A TC = 25°C (Silicon limit) 2
Continuous drain current (package limit) ID 87 A TC = 25°C (Package limit) 2
Continuous drain current (silicon limit) ID 54 A TC = 100°C (Silicon limit) 2
Pulsed drain current ID pulse 340 A TC = 25°C, tp limited by Tjmax 2
Avalanche energy, single pulse EAS 400 mJ L=0.5mH, Rg=25Ω 2
Gate-source voltage VGS -25 25 V 3
Power dissipation Ptot 98 W TC = 25°C 3
Operating junction and storage temperature Tj, Tstg -55 150 °C 3
Thermal resistance, junction to case RthJC 1.27 °C/W junction to case 3
Thermal resistance, junction to ambient RthJA 102 °C/W junction to ambient (min. footprint) 3

CAD (KiCad official)

  • Symbol: DP6580
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252 (KiCad packages3D, STEP)
  • 3D model files: dp6580-etched.step / dp6580-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); dp6580.step / dp6580.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shenzhen Developer Microelec datasheet (12 pp, sha256 7c5a693082ea169c, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF