π142U31 from 2Pai Semi, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	VDD1	power_in	Supply voltage for isolator side 1, operating from 3.0 V to 5.5 V.
2	GND1	power_in	Ground 1, the ground reference for isolator side 1.
3	VIA	input	Logic input A, with VIH minimum of 0.7VDDx and VIL maximum of 0.3VDDx.
4	VIB	input	Logic input B, with VIH minimum of 0.7VDDx and VIL maximum of 0.3VDDx.
5	VOC	output	Logic output C, rated for a high-level output current of -6 mA and a low-level output current of 6 mA.
6	VOD	output	Logic output D, rated for a high-level output current of -6 mA and a low-level output current of 6 mA.
7	NC/EN1	unconnected	No connect for the π142U3X variant; the datasheet gives EN1 enable function only for the π142U6X variant.
8	GND1	power_in	Ground 1, the ground reference for isolator side 1.
9	GND2	power_in	Ground 2, the ground reference for isolator side 2.
10	NC/EN2	unconnected	No connect for the π142U3X variant; the datasheet gives EN2 enable function only for the π142U6X variant.
11	VID	input	Logic input D, with VIH minimum of 0.7VDDx and VIL maximum of 0.3VDDx.
12	VIC	input	Logic input C, with VIH minimum of 0.7VDDx and VIL maximum of 0.3VDDx.
13	VOB	output	Logic output B, rated for a high-level output current of -6 mA and a low-level output current of 6 mA.
14	VOA	output	Logic output A, rated for a high-level output current of -6 mA and a low-level output current of 6 mA.
15	GND2	power_in	Ground 2, the ground reference for isolator side 2.
16	VDD2	power_in	Supply voltage for isolator side 2, operating from 3.0 V to 5.5 V.

Key specifications

Parameter	Value
Manufacturer	2Pai Semi
Package	SOIC-16
Category	Interface ICs
Pins	16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Supply Voltages (VDD1-GND1, VDD2-GND2)		-0.5		7	V		3
Input Voltages (VIA, VIB)		-0.5			V	Upper limit printed as VDDx + 0.5 V	3
Output Voltages (VOA, VOB)		-0.5			V	Upper limit printed as VDDx + 0.5 V	3
Average Output Current per Pin Side 1 (IO1)	IO1	-10		10	mA		3
Average Output Current per Pin Side 2 (IO2)	IO2	-10		10	mA		3
Common-Mode Transients Immunity		-150		150	kV/µs		3
Storage Temperature Range	TST	-65		150	°C		3
Ambient Operating Temperature Range	TA	-40		125	°C		3
Supply Voltage	VDDx	3		5.5	V		4
Low Level Input Signal Voltage	VIL	0			V	Upper limit printed as 0.3*VDDx	4
High Level Output Current	IOH	-6			mA		4
Low Level Output Current	IOL			6	mA		4
Maximum Data Rate		0		150	Kbps		4
Junction Temperature	TJ	-40		150	°C		4
Ambient Operating Temperature	TA	-40		125	°C		4
Minimum Pulse Width	PW	6.5			us	Within pulse width distortion (PWD) limit	5
Maximum Data Rate				150	Kbps	Within PWD limit	5
Propagation Delay Time	tpHL, tpLH	3		4.5	us	50% input to 50% output signal @ 5VDC supply	5
Propagation Delay Time	tpHL, tpLH	3.2		4.8	us	50% input to 50% output signal @ 3.3VDC supply	5
Pulse Width Distortion	PWD	0	0.02	0.2	us	/tpHL - tpLH/ @ 5VDC supply	5
Part to Part Propagation Delay Skew	tPSK			0.3	us	Max difference between any two devices at same temperature, load and voltage @ 5VDC supply	5
Channel to Channel Propagation Delay Skew	tCSK	0		0.2	us	@ 5VDC supply	5
Output Signal Rise/Fall Time	tr/tf			1.5	ns	10% to 90% signal terminated 50	5
Common-Mode Transient Immunity	CMTI	100	150		kV/µs	VIN = VDDx or 0V, VCM = 1000 V	5
ESD (HBM - Human Body Model)	ESD	-8		8	kV	All pins	5
Low Level Output Voltage	VOL	0		0.1	V	20 µA output current	5
Low Level Output Voltage	VOL	0.1		0.2	V	2 mA output current	5
Input Current per Signal Channel	IIN	-10	0.5	10	µA	0 V ≤ Signal voltage ≤ VDDX	5
VDDx Undervoltage Rising Threshold	VDDxUV+	2.45	2.65	2.9	V		6
VDDx Undervoltage Falling Threshold	VDDxUV-	2.3	2.5	2.75	V		6
VDDx Hysteresis	VDDxUVH		0.15		V		6
Quiescent Supply Current IDD1 (Q), π142Uxx	IDD1 (Q)	862	1077	1400	µA	@ 5VDC supply, 0V input signal	6
Quiescent Supply Current IDD2 (Q), π142Uxx	IDD2 (Q)	862	1078	1401	µA	@ 5VDC supply, 0V input signal	6
Quiescent Supply Current IDD1 (Q), π142Uxx	IDD1 (Q)	828	1035	1346	µA	@ 5VDC supply, 5V input signal	6
Quiescent Supply Current IDD2 (Q), π142Uxx	IDD2 (Q)	829	1036	1347	µA	@ 5VDC supply, 5V input signal	6
Quiescent Supply Current IDD1 (Q), π142Uxx	IDD1 (Q)	809	1011	1314	µA	@ 3.3VDC supply, 0V input signal	6
Quiescent Supply Current IDD2 (Q), π142Uxx	IDD2 (Q)	810	1012	1316	µA	@ 3.3VDC supply, 0V input signal	6
Quiescent Supply Current IDD1 (Q), π142Uxx	IDD1 (Q)	818	1023	1330	µA	@ 3.3VDC supply, 3.3V input signal	6
Quiescent Supply Current IDD2 (Q), π142Uxx	IDD2 (Q)	819	1024	1331	µA	@ 3.3VDC supply, 3.3V input signal	6
Supply Current IDD1 @5VDC, 2 Kbps, π142Uxx	IDD1		1.05	1.58	mA	@ 5VDC, CL = 0 pF, 2 Kbps	7
Supply Current IDD1 @5VDC, 50 Kbps, π142Uxx	IDD1		1.06	1.59	mA	@ 5VDC, CL = 0 pF, 50 Kbps	7
Supply Current IDD1 @5VDC, 150 Kbps, π142Uxx	IDD1		1.08	1.62	mA	@ 5VDC, CL = 0 pF, 150 Kbps	7
Supply Current IDD2 @5VDC, 2 Kbps, π142Uxx	IDD2		1.05	1.58	mA	@ 5VDC, CL = 0 pF, 2 Kbps	7
Supply Current IDD2 @5VDC, 50 Kbps, π142Uxx	IDD2		1.06	1.59	mA	@ 5VDC, CL = 0 pF, 50 Kbps	7
Supply Current IDD2 @5VDC, 150 Kbps, π142Uxx	IDD2		1.08	1.62	mA	@ 5VDC, CL = 0 pF, 150 Kbps	7
Supply Current IDD1 @3.3VDC, 2 Kbps, π142Uxx	IDD1		1.01	1.52	mA	@ 3.3VDC, CL = 0 pF, 2 Kbps	7
Supply Current IDD1 @3.3VDC, 50 Kbps, π142Uxx	IDD1		1.02	1.53	mA	@ 3.3VDC, CL = 0 pF, 50 Kbps	7
Supply Current IDD1 @3.3VDC, 150 Kbps, π142Uxx	IDD1		1.02	1.53	mA	@ 3.3VDC, CL = 0 pF, 150 Kbps	7
Supply Current IDD2 @3.3VDC, 2 Kbps, π142Uxx	IDD2		1.01	1.52	mA	@ 3.3VDC, CL = 0 pF, 2 Kbps	7
Supply Current IDD2 @3.3VDC, 50 Kbps, π142Uxx	IDD2		1.02	1.53	mA	@ 3.3VDC, CL = 0 pF, 50 Kbps	7
Supply Current IDD2 @3.3VDC, 150 Kbps, π142Uxx	IDD2		1.02	1.53	mA	@ 3.3VDC, CL = 0 pF, 150 Kbps	7
Rated Dielectric Insulation Voltage (3 kV part)				3000	V rms	1-minute duration	7
Minimum External Air Gap (Clearance) L(CLR), 3 kV part	L(CLR)	4			mm	Measured from input terminals to output terminals, shortest distance through air	7
Minimum External Tracking (Creepage) L(CRP), 3 kV part	L(CRP)	4			mm	Measured from input terminals to output terminals, shortest distance path along body	7
Minimum Internal Gap (Internal Clearance), 3 kV part		11			µm	Insulation distance through insulation	7
Tracking Resistance (Comparative Tracking Index), 3 kV part	CTI	400			V	DIN IEC 112/VDE 0303 Part 1; printed as >400	7
IC Junction to Ambient Thermal Resistance (3 kV part)	θJA		100		°C/W	Thermocouple located at center of package underside	7

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part	Material	Colour / plating	Datasheet says	Page
housing	pC		In accordance with DIN V VDE V 0884-10, each π140U3x/π141U3x/π142U3x is proof tested by applying an insulation test voltage ≥ 1326 V peak for 1 sec (partial discharge detection limit = 5 pC); each π14	8

CAD (KiCad official)

Symbol: π142U31
Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
3D model: SOIC-16 (KiCad packages3D, STEP)
3D model files: 142u31-etched.step / 142u31-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 142u31.step / 142u31.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: 2Pai Semi datasheet (17 pp, sha256 f74330c0b7db7a34, retrieved 2026-11-04, tier: lcsc)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

π142U31

Verified π142U31

Verification log 1 record

3D Model

Symbol & Footprint

Schematic Symbol

PCB Footprint

Datasheet

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