component
π142U31
Public Made by Adomby adom
2Pai Semi Digital Isolators, SOIC-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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π142U31
2Pai Semi · Digital Isolators · SOIC-16
π142U31 from 2Pai Semi, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VDD1 | power_in | Supply voltage for isolator side 1, operating from 3.0 V to 5.5 V. |
| 2 | GND1 | power_in | Ground 1, the ground reference for isolator side 1. |
| 3 | VIA | input | Logic input A, with VIH minimum of 0.7VDDx and VIL maximum of 0.3VDDx. |
| 4 | VIB | input | Logic input B, with VIH minimum of 0.7VDDx and VIL maximum of 0.3VDDx. |
| 5 | VOC | output | Logic output C, rated for a high-level output current of -6 mA and a low-level output current of 6 mA. |
| 6 | VOD | output | Logic output D, rated for a high-level output current of -6 mA and a low-level output current of 6 mA. |
| 7 | NC/EN1 | unconnected | No connect for the π142U3X variant; the datasheet gives EN1 enable function only for the π142U6X variant. |
| 8 | GND1 | power_in | Ground 1, the ground reference for isolator side 1. |
| 9 | GND2 | power_in | Ground 2, the ground reference for isolator side 2. |
| 10 | NC/EN2 | unconnected | No connect for the π142U3X variant; the datasheet gives EN2 enable function only for the π142U6X variant. |
| 11 | VID | input | Logic input D, with VIH minimum of 0.7VDDx and VIL maximum of 0.3VDDx. |
| 12 | VIC | input | Logic input C, with VIH minimum of 0.7VDDx and VIL maximum of 0.3VDDx. |
| 13 | VOB | output | Logic output B, rated for a high-level output current of -6 mA and a low-level output current of 6 mA. |
| 14 | VOA | output | Logic output A, rated for a high-level output current of -6 mA and a low-level output current of 6 mA. |
| 15 | GND2 | power_in | Ground 2, the ground reference for isolator side 2. |
| 16 | VDD2 | power_in | Supply voltage for isolator side 2, operating from 3.0 V to 5.5 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | 2Pai Semi |
| Package | SOIC-16 |
| Category | Interface ICs |
| Pins | 16 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltages (VDD1-GND1, VDD2-GND2) | -0.5 | 7 | V | 3 | |||
| Input Voltages (VIA, VIB) | -0.5 | V | Upper limit printed as VDDx + 0.5 V | 3 | |||
| Output Voltages (VOA, VOB) | -0.5 | V | Upper limit printed as VDDx + 0.5 V | 3 | |||
| Average Output Current per Pin Side 1 (IO1) | IO1 | -10 | 10 | mA | 3 | ||
| Average Output Current per Pin Side 2 (IO2) | IO2 | -10 | 10 | mA | 3 | ||
| Common-Mode Transients Immunity | -150 | 150 | kV/µs | 3 | |||
| Storage Temperature Range | TST | -65 | 150 | °C | 3 | ||
| Ambient Operating Temperature Range | TA | -40 | 125 | °C | 3 | ||
| Supply Voltage | VDDx | 3 | 5.5 | V | 4 | ||
| Low Level Input Signal Voltage | VIL | 0 | V | Upper limit printed as 0.3*VDDx | 4 | ||
| High Level Output Current | IOH | -6 | mA | 4 | |||
| Low Level Output Current | IOL | 6 | mA | 4 | |||
| Maximum Data Rate | 0 | 150 | Kbps | 4 | |||
| Junction Temperature | TJ | -40 | 150 | °C | 4 | ||
| Ambient Operating Temperature | TA | -40 | 125 | °C | 4 | ||
| Minimum Pulse Width | PW | 6.5 | us | Within pulse width distortion (PWD) limit | 5 | ||
| Maximum Data Rate | 150 | Kbps | Within PWD limit | 5 | |||
| Propagation Delay Time | tpHL, tpLH | 3 | 4.5 | us | 50% input to 50% output signal @ 5VDC supply | 5 | |
| Propagation Delay Time | tpHL, tpLH | 3.2 | 4.8 | us | 50% input to 50% output signal @ 3.3VDC supply | 5 | |
| Pulse Width Distortion | PWD | 0 | 0.02 | 0.2 | us | /tpHL - tpLH/ @ 5VDC supply | 5 |
| Part to Part Propagation Delay Skew | tPSK | 0.3 | us | Max difference between any two devices at same temperature, load and voltage @ 5VDC supply | 5 | ||
| Channel to Channel Propagation Delay Skew | tCSK | 0 | 0.2 | us | @ 5VDC supply | 5 | |
| Output Signal Rise/Fall Time | tr/tf | 1.5 | ns | 10% to 90% signal terminated 50 | 5 | ||
| Common-Mode Transient Immunity | CMTI | 100 | 150 | kV/µs | VIN = VDDx or 0V, VCM = 1000 V | 5 | |
| ESD (HBM - Human Body Model) | ESD | -8 | 8 | kV | All pins | 5 | |
| Low Level Output Voltage | VOL | 0 | 0.1 | V | 20 µA output current | 5 | |
| Low Level Output Voltage | VOL | 0.1 | 0.2 | V | 2 mA output current | 5 | |
| Input Current per Signal Channel | IIN | -10 | 0.5 | 10 | µA | 0 V ≤ Signal voltage ≤ VDDX | 5 |
| VDDx Undervoltage Rising Threshold | VDDxUV+ | 2.45 | 2.65 | 2.9 | V | 6 | |
| VDDx Undervoltage Falling Threshold | VDDxUV- | 2.3 | 2.5 | 2.75 | V | 6 | |
| VDDx Hysteresis | VDDxUVH | 0.15 | V | 6 | |||
| Quiescent Supply Current IDD1 (Q), π142Uxx | IDD1 (Q) | 862 | 1077 | 1400 | µA | @ 5VDC supply, 0V input signal | 6 |
| Quiescent Supply Current IDD2 (Q), π142Uxx | IDD2 (Q) | 862 | 1078 | 1401 | µA | @ 5VDC supply, 0V input signal | 6 |
| Quiescent Supply Current IDD1 (Q), π142Uxx | IDD1 (Q) | 828 | 1035 | 1346 | µA | @ 5VDC supply, 5V input signal | 6 |
| Quiescent Supply Current IDD2 (Q), π142Uxx | IDD2 (Q) | 829 | 1036 | 1347 | µA | @ 5VDC supply, 5V input signal | 6 |
| Quiescent Supply Current IDD1 (Q), π142Uxx | IDD1 (Q) | 809 | 1011 | 1314 | µA | @ 3.3VDC supply, 0V input signal | 6 |
| Quiescent Supply Current IDD2 (Q), π142Uxx | IDD2 (Q) | 810 | 1012 | 1316 | µA | @ 3.3VDC supply, 0V input signal | 6 |
| Quiescent Supply Current IDD1 (Q), π142Uxx | IDD1 (Q) | 818 | 1023 | 1330 | µA | @ 3.3VDC supply, 3.3V input signal | 6 |
| Quiescent Supply Current IDD2 (Q), π142Uxx | IDD2 (Q) | 819 | 1024 | 1331 | µA | @ 3.3VDC supply, 3.3V input signal | 6 |
| Supply Current IDD1 @5VDC, 2 Kbps, π142Uxx | IDD1 | 1.05 | 1.58 | mA | @ 5VDC, CL = 0 pF, 2 Kbps | 7 | |
| Supply Current IDD1 @5VDC, 50 Kbps, π142Uxx | IDD1 | 1.06 | 1.59 | mA | @ 5VDC, CL = 0 pF, 50 Kbps | 7 | |
| Supply Current IDD1 @5VDC, 150 Kbps, π142Uxx | IDD1 | 1.08 | 1.62 | mA | @ 5VDC, CL = 0 pF, 150 Kbps | 7 | |
| Supply Current IDD2 @5VDC, 2 Kbps, π142Uxx | IDD2 | 1.05 | 1.58 | mA | @ 5VDC, CL = 0 pF, 2 Kbps | 7 | |
| Supply Current IDD2 @5VDC, 50 Kbps, π142Uxx | IDD2 | 1.06 | 1.59 | mA | @ 5VDC, CL = 0 pF, 50 Kbps | 7 | |
| Supply Current IDD2 @5VDC, 150 Kbps, π142Uxx | IDD2 | 1.08 | 1.62 | mA | @ 5VDC, CL = 0 pF, 150 Kbps | 7 | |
| Supply Current IDD1 @3.3VDC, 2 Kbps, π142Uxx | IDD1 | 1.01 | 1.52 | mA | @ 3.3VDC, CL = 0 pF, 2 Kbps | 7 | |
| Supply Current IDD1 @3.3VDC, 50 Kbps, π142Uxx | IDD1 | 1.02 | 1.53 | mA | @ 3.3VDC, CL = 0 pF, 50 Kbps | 7 | |
| Supply Current IDD1 @3.3VDC, 150 Kbps, π142Uxx | IDD1 | 1.02 | 1.53 | mA | @ 3.3VDC, CL = 0 pF, 150 Kbps | 7 | |
| Supply Current IDD2 @3.3VDC, 2 Kbps, π142Uxx | IDD2 | 1.01 | 1.52 | mA | @ 3.3VDC, CL = 0 pF, 2 Kbps | 7 | |
| Supply Current IDD2 @3.3VDC, 50 Kbps, π142Uxx | IDD2 | 1.02 | 1.53 | mA | @ 3.3VDC, CL = 0 pF, 50 Kbps | 7 | |
| Supply Current IDD2 @3.3VDC, 150 Kbps, π142Uxx | IDD2 | 1.02 | 1.53 | mA | @ 3.3VDC, CL = 0 pF, 150 Kbps | 7 | |
| Rated Dielectric Insulation Voltage (3 kV part) | 3000 | V rms | 1-minute duration | 7 | |||
| Minimum External Air Gap (Clearance) L(CLR), 3 kV part | L(CLR) | 4 | mm | Measured from input terminals to output terminals, shortest distance through air | 7 | ||
| Minimum External Tracking (Creepage) L(CRP), 3 kV part | L(CRP) | 4 | mm | Measured from input terminals to output terminals, shortest distance path along body | 7 | ||
| Minimum Internal Gap (Internal Clearance), 3 kV part | 11 | µm | Insulation distance through insulation | 7 | |||
| Tracking Resistance (Comparative Tracking Index), 3 kV part | CTI | 400 | V | DIN IEC 112/VDE 0303 Part 1; printed as >400 | 7 | ||
| IC Junction to Ambient Thermal Resistance (3 kV part) | θJA | 100 | °C/W | Thermocouple located at center of package underside | 7 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | pC | In accordance with DIN V VDE V 0884-10, each π140U3x/π141U3x/π142U3x is proof tested by applying an insulation test voltage ≥ 1326 V peak for 1 sec (partial discharge detection limit = 5 pC); each π14 | 8 |
CAD (KiCad official)
- Symbol:
π142U31 - Footprint:
Package_SO:SOIC-16_3.9x9.9mm_P1.27mm - 3D model: SOIC-16 (KiCad packages3D, STEP)
- 3D model files:
142u31-etched.step/142u31-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);142u31.step/142u31.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: 2Pai Semi datasheet (17 pp, sha256
f74330c0b7db7a34, retrieved 2026-11-04, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).