ADP5587ACPZ-R7 from Analog Devices, in a LFCSP-24(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	R7	bidirectional	GPIO, Row 7 in the keypad matrix.
2	R6	bidirectional	GPIO, Row 6 in the keypad matrix.
3	R5	bidirectional	GPIO, Row 5 in the keypad matrix.
4	R4	bidirectional	GPIO, Row 4 in the keypad matrix.
5	R3	bidirectional	GPIO, Row 3 in the keypad matrix.
6	R2	bidirectional	GPIO, Row 2 in the keypad matrix.
7	R1	bidirectional	GPIO, Row 1 in the keypad matrix.
8	R0	bidirectional	GPIO, Row 0 in the keypad matrix.
9	C0	bidirectional	GPIO, Column 0 in the keypad matrix.
10	C1	bidirectional	GPIO, Column 1 in the keypad matrix.
11	C2	bidirectional	GPIO, Column 2 in the keypad matrix.
12	C3	bidirectional	GPIO, Column 3 in the keypad matrix.
13	C4	bidirectional	GPIO, Column 4 in the keypad matrix.
14	C5	bidirectional	GPIO, Column 5 in the keypad matrix.
15	C6	bidirectional	GPIO, Column 6 in the keypad matrix.
16	C7	bidirectional	GPIO, Column 7 in the keypad matrix.
17	C8	bidirectional	GPIO, Column 8 in the keypad matrix.
18	C9	bidirectional	GPIO, Column 9 in the keypad matrix.
19	GND	power_in	Ground.
20	RST	input	Hardware reset, active low; must be driven low for a minimum of 50 μs to be valid, and tied high with a pull-up resistor if not used.
21	VCC	power_in	Supply voltage, 1.65 V to 3.6 V.
22	SDA	bidirectional	I2C serial data; open drain, requires an external pull-up resistor.
23	SCL	input	I2C clock.
24	INT	output	Processor interrupt, active low, open drain; can be pulled up to 2.7 V or 1.8 V.
25	EP	passive	Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter	Value
Manufacturer	Analog Devices
Package	LFCSP-24(4x4)
Category	Interface ICs
Pins	25

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
VCC Input Voltage Range	VCC	1.65		3.6	V		3
Supply Current (idle)	ICC		1	10	μA	VCC = 1.8V to 3.0V, TA = −40°C to +85°C	3
Supply Current, one key press, 1.8 V	ICC		55	90	μA	VCC = 1.8 V, TA = −40°C to +85°C	3
Supply Current, one key press, 3.0 V	ICC		100	200	μA	VCC = 3.0 V, TA = −40°C to +85°C	3
Supply Current, GPI low (pull-up enabled)	ICC		20	50	μA	VCC = 1.8V to 3.0V, TA = −40°C to +85°C	3
Supply Current, GPI low (pull-up disabled)	ICC		2	10	μA	VCC = 1.8V to 3.0V, TA = −40°C to +85°C	3
Input Leakage Current	VI-LEAKAGE	-1		1	µA	1.8 V ≤ VIO ≤ 3.0 V	3
Logic Low Output Voltage (C0-C9, R0-R7)	VOL			0.4	V	ISINK = 1 mA	3
Output Low Voltage (INT, SDA)	VOL			0.4	V	ISINK = 3 mA, 1.8 V ≤ VCC ≤ 3.0 V	3
Logic High Leakage Current (INT, SDA)	VO-LEAKAGE		0.1	1	µA	1.8 V ≤ VCC ≤ 3.0 V	3
Pull-Up Resistance for GPIOs	RPULL-UP		100		kΩ		3
I/O Input Capacitance	CIN		1	10	pF		3
I/O Output Loading Capacitance	COUT			50	pF		3
Capacitive Load for Each Bus Line	CB			400	pF		3
SCL Clock Frequency	fSCL			400	kHz		4
SCL High Time	tHIGH	0.6			μs		4
SCL Low Time	tLOW	1.3			μs		4
Data Setup Time	tSU, DAT	100			ns		4
Data Hold Time	tHD, DAT	0		0.9	μs		4
Setup Time for Repeated Start	tSU, STA	0.6			μs		4
Hold Time for Start/Repeated Start	tHD, STA	0.6			μs		4
Bus Free Time for Stop and Start	tBUF	1.3			μs		4
Setup Time for Stop Condition	tSU, STO	0.6			μs		4
Rise Time for SCL and SDA	tR			300	ns	measured between 0.3 × VCC and 0.7 × VCC	4
Fall Time for SCL and SDA	tF			300	ns	measured between 0.3 × VCC and 0.7 × VCC	4
Pulse Width of Suppressed Spike	tSP	0		50	μs		4
Debounce	TD		275		μs		4
VCC	VCC	-0.3		4	V		5
GND	GND	-0.3		0.3	V		5
Operating Ambient Temperature Range	TA	-40		85	°C		5
Operating Junction Temperature Range	TJ	-40		125	°C		5
Storage Temperature Range	TSTG	-65		150	°C		5
ESD Machine Model		-200		200	V		5
ESD Human Body Model		-2000		2000	V		5
ESD Charged Device Model		-1000		1000	V		5
Thermal Resistance Junction-to-Ambient, 24-Lead LFCSP_WQ	θJA		57.8		°C/W	24-Lead LFCSP_WQ	5
Thermal Resistance Junction-to-Case, 24-Lead LFCSP_WQ	θJC		9.4		°C/W	24-Lead LFCSP_WQ	5
Maximum Power, 24-Lead LFCSP_WQ				600	mW	24-Lead LFCSP_WQ	5

CAD (KiCad official)

Symbol: ADP5587ACPZ-R7
Footprint: Package_DFN_QFN:QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm
3D model: LFCSP-24(4x4) (KiCad packages3D, STEP)
3D model files: adp5587acpz-r7-etched.step / adp5587acpz-r7-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); adp5587acpz-r7.step / adp5587acpz-r7.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Analog Devices datasheet (24 pp, sha256 6042ee18844a5276, retrieved 2026-10-31, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

ADP5587ACPZ-R7

Verified ADP5587ACPZ-R7

Verification log 1 record

3D Model

Symbol & Footprint

Schematic Symbol

PCB Footprint

Datasheet

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