component
ADP5587ACPZ-R7
Public Made by Adomby adom
Analog Devices I/O Expanders, LFCSP-24(4x4). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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ADP5587ACPZ-R7
Analog Devices · I/O Expanders · LFCSP-24(4x4)
ADP5587ACPZ-R7 from Analog Devices, in a LFCSP-24(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | R7 | bidirectional | GPIO, Row 7 in the keypad matrix. |
| 2 | R6 | bidirectional | GPIO, Row 6 in the keypad matrix. |
| 3 | R5 | bidirectional | GPIO, Row 5 in the keypad matrix. |
| 4 | R4 | bidirectional | GPIO, Row 4 in the keypad matrix. |
| 5 | R3 | bidirectional | GPIO, Row 3 in the keypad matrix. |
| 6 | R2 | bidirectional | GPIO, Row 2 in the keypad matrix. |
| 7 | R1 | bidirectional | GPIO, Row 1 in the keypad matrix. |
| 8 | R0 | bidirectional | GPIO, Row 0 in the keypad matrix. |
| 9 | C0 | bidirectional | GPIO, Column 0 in the keypad matrix. |
| 10 | C1 | bidirectional | GPIO, Column 1 in the keypad matrix. |
| 11 | C2 | bidirectional | GPIO, Column 2 in the keypad matrix. |
| 12 | C3 | bidirectional | GPIO, Column 3 in the keypad matrix. |
| 13 | C4 | bidirectional | GPIO, Column 4 in the keypad matrix. |
| 14 | C5 | bidirectional | GPIO, Column 5 in the keypad matrix. |
| 15 | C6 | bidirectional | GPIO, Column 6 in the keypad matrix. |
| 16 | C7 | bidirectional | GPIO, Column 7 in the keypad matrix. |
| 17 | C8 | bidirectional | GPIO, Column 8 in the keypad matrix. |
| 18 | C9 | bidirectional | GPIO, Column 9 in the keypad matrix. |
| 19 | GND | power_in | Ground. |
| 20 | RST | input | Hardware reset, active low; must be driven low for a minimum of 50 μs to be valid, and tied high with a pull-up resistor if not used. |
| 21 | VCC | power_in | Supply voltage, 1.65 V to 3.6 V. |
| 22 | SDA | bidirectional | I2C serial data; open drain, requires an external pull-up resistor. |
| 23 | SCL | input | I2C clock. |
| 24 | INT | output | Processor interrupt, active low, open drain; can be pulled up to 2.7 V or 1.8 V. |
| 25 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Analog Devices |
| Package | LFCSP-24(4x4) |
| Category | Interface ICs |
| Pins | 25 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| VCC Input Voltage Range | VCC | 1.65 | 3.6 | V | 3 | ||
| Supply Current (idle) | ICC | 1 | 10 | μA | VCC = 1.8V to 3.0V, TA = −40°C to +85°C | 3 | |
| Supply Current, one key press, 1.8 V | ICC | 55 | 90 | μA | VCC = 1.8 V, TA = −40°C to +85°C | 3 | |
| Supply Current, one key press, 3.0 V | ICC | 100 | 200 | μA | VCC = 3.0 V, TA = −40°C to +85°C | 3 | |
| Supply Current, GPI low (pull-up enabled) | ICC | 20 | 50 | μA | VCC = 1.8V to 3.0V, TA = −40°C to +85°C | 3 | |
| Supply Current, GPI low (pull-up disabled) | ICC | 2 | 10 | μA | VCC = 1.8V to 3.0V, TA = −40°C to +85°C | 3 | |
| Input Leakage Current | VI-LEAKAGE | -1 | 1 | µA | 1.8 V ≤ VIO ≤ 3.0 V | 3 | |
| Logic Low Output Voltage (C0-C9, R0-R7) | VOL | 0.4 | V | ISINK = 1 mA | 3 | ||
| Output Low Voltage (INT, SDA) | VOL | 0.4 | V | ISINK = 3 mA, 1.8 V ≤ VCC ≤ 3.0 V | 3 | ||
| Logic High Leakage Current (INT, SDA) | VO-LEAKAGE | 0.1 | 1 | µA | 1.8 V ≤ VCC ≤ 3.0 V | 3 | |
| Pull-Up Resistance for GPIOs | RPULL-UP | 100 | kΩ | 3 | |||
| I/O Input Capacitance | CIN | 1 | 10 | pF | 3 | ||
| I/O Output Loading Capacitance | COUT | 50 | pF | 3 | |||
| Capacitive Load for Each Bus Line | CB | 400 | pF | 3 | |||
| SCL Clock Frequency | fSCL | 400 | kHz | 4 | |||
| SCL High Time | tHIGH | 0.6 | μs | 4 | |||
| SCL Low Time | tLOW | 1.3 | μs | 4 | |||
| Data Setup Time | tSU, DAT | 100 | ns | 4 | |||
| Data Hold Time | tHD, DAT | 0 | 0.9 | μs | 4 | ||
| Setup Time for Repeated Start | tSU, STA | 0.6 | μs | 4 | |||
| Hold Time for Start/Repeated Start | tHD, STA | 0.6 | μs | 4 | |||
| Bus Free Time for Stop and Start | tBUF | 1.3 | μs | 4 | |||
| Setup Time for Stop Condition | tSU, STO | 0.6 | μs | 4 | |||
| Rise Time for SCL and SDA | tR | 300 | ns | measured between 0.3 × VCC and 0.7 × VCC | 4 | ||
| Fall Time for SCL and SDA | tF | 300 | ns | measured between 0.3 × VCC and 0.7 × VCC | 4 | ||
| Pulse Width of Suppressed Spike | tSP | 0 | 50 | μs | 4 | ||
| Debounce | TD | 275 | μs | 4 | |||
| VCC | VCC | -0.3 | 4 | V | 5 | ||
| GND | GND | -0.3 | 0.3 | V | 5 | ||
| Operating Ambient Temperature Range | TA | -40 | 85 | °C | 5 | ||
| Operating Junction Temperature Range | TJ | -40 | 125 | °C | 5 | ||
| Storage Temperature Range | TSTG | -65 | 150 | °C | 5 | ||
| ESD Machine Model | -200 | 200 | V | 5 | |||
| ESD Human Body Model | -2000 | 2000 | V | 5 | |||
| ESD Charged Device Model | -1000 | 1000 | V | 5 | |||
| Thermal Resistance Junction-to-Ambient, 24-Lead LFCSP_WQ | θJA | 57.8 | °C/W | 24-Lead LFCSP_WQ | 5 | ||
| Thermal Resistance Junction-to-Case, 24-Lead LFCSP_WQ | θJC | 9.4 | °C/W | 24-Lead LFCSP_WQ | 5 | ||
| Maximum Power, 24-Lead LFCSP_WQ | 600 | mW | 24-Lead LFCSP_WQ | 5 |
CAD (KiCad official)
- Symbol:
ADP5587ACPZ-R7 - Footprint:
Package_DFN_QFN:QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm - 3D model: LFCSP-24(4x4) (KiCad packages3D, STEP)
- 3D model files:
adp5587acpz-r7-etched.step/adp5587acpz-r7-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);adp5587acpz-r7.step/adp5587acpz-r7.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Analog Devices datasheet (24 pp, sha256
6042ee18844a5276, retrieved 2026-10-31, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).