component
XB5306A
Public Made by Adomby adom
XySemi Battery Management, SOT-23-6. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownXB5306A
XySemi · Battery Management · SOT-23-6
XB5306A from XySemi, in a SOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | Not used; leave unconnected. |
| 2 | VM | passive | Negative terminal of the battery pack; the internal FET switch connects this terminal to GND, and the VM input pin voltage is rated -6 to 10 V. |
| 3 | GND | power_in | Ground, connected to the negative terminal of the battery; must be connected with heavy lines to pin 6 outside the package. |
| 4 | NC | unconnected | Not used; leave unconnected. |
| 5 | VDD | power_in | Power supply input; the VDD input pin voltage is rated -0.3 to 6 V. |
| 6 | GND | power_in | Ground, connected to the negative terminal of the battery; must be connected with heavy lines to pin 3 outside the package. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | XySemi |
| Package | SOT-23-6 |
| Category | Power Management (PMIC) |
| Pins | 6 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Overcharge Detection Voltage | VCU | 4.25 | 4.3 | 4.35 | V | 3 | |
| Overcharge Release Voltage | VCL | 4.05 | 4.1 | 4.15 | V | 3 | |
| Overdischarge Detection Voltage | VDL | 2.3 | 2.4 | 2.5 | V | 3 | |
| Overdischarge Release Voltage | VDR | 2.9 | 3 | 3.1 | V | 3 | |
| Current Consumption in Normal Operation | IOPE | 2.8 | 6 | μA | VDD=3.6V, VM=0V | 3 | |
| Current Consumption in Power Down | IPDN | 1.5 | 3 | μA | VDD=2.0V, VM pin floating | 3 | |
| VDD input pin voltage | -0.3 | 6 | V | 3 | |||
| VM input pin voltage | -6 | 10 | V | 3 | |||
| Operating Ambient Temperature | -40 | 85 | °C | 3 | |||
| Maximum Junction Temperature | 125 | °C | 3 | ||||
| Storage Temperature | -55 | 150 | °C | 3 | |||
| Lead Temperature (Soldering) | 300 | °C | Soldering, 10 sec | 3 | |||
| Power Dissipation at T=25°C | 0.3 | W | T=25°C | 3 | |||
| Package Thermal Resistance (Junction to Ambient) | θJA | 300 | °C/W | 3 | |||
| Package Thermal Resistance (Junction to Case) | θJC | 150 | °C/W | 3 |
CAD (KiCad official)
- Symbol:
XB5306A - Footprint:
Package_TO_SOT_SMD:SOT-23-6 - 3D model: SOT-23-6 (KiCad packages3D, STEP)
- 3D model files:
xb5306a-etched.step/xb5306a-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);xb5306a.step/xb5306a.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: XySemi datasheet (12 pp, sha256
b415d1f28ee557e5, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).