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XB5306A

XySemi · Battery Management · SOT-23-6

XB5306A from XySemi, in a SOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected Not used; leave unconnected.
2 VM passive Negative terminal of the battery pack; the internal FET switch connects this terminal to GND, and the VM input pin voltage is rated -6 to 10 V.
3 GND power_in Ground, connected to the negative terminal of the battery; must be connected with heavy lines to pin 6 outside the package.
4 NC unconnected Not used; leave unconnected.
5 VDD power_in Power supply input; the VDD input pin voltage is rated -0.3 to 6 V.
6 GND power_in Ground, connected to the negative terminal of the battery; must be connected with heavy lines to pin 3 outside the package.

Key specifications

Parameter Value
Manufacturer XySemi
Package SOT-23-6
Category Power Management (PMIC)
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Overcharge Detection Voltage VCU 4.25 4.3 4.35 V 3
Overcharge Release Voltage VCL 4.05 4.1 4.15 V 3
Overdischarge Detection Voltage VDL 2.3 2.4 2.5 V 3
Overdischarge Release Voltage VDR 2.9 3 3.1 V 3
Current Consumption in Normal Operation IOPE 2.8 6 μA VDD=3.6V, VM=0V 3
Current Consumption in Power Down IPDN 1.5 3 μA VDD=2.0V, VM pin floating 3
VDD input pin voltage -0.3 6 V 3
VM input pin voltage -6 10 V 3
Operating Ambient Temperature -40 85 °C 3
Maximum Junction Temperature 125 °C 3
Storage Temperature -55 150 °C 3
Lead Temperature (Soldering) 300 °C Soldering, 10 sec 3
Power Dissipation at T=25°C 0.3 W T=25°C 3
Package Thermal Resistance (Junction to Ambient) θJA 300 °C/W 3
Package Thermal Resistance (Junction to Case) θJC 150 °C/W 3

CAD (KiCad official)

  • Symbol: XB5306A
  • Footprint: Package_TO_SOT_SMD:SOT-23-6
  • 3D model: SOT-23-6 (KiCad packages3D, STEP)
  • 3D model files: xb5306a-etched.step / xb5306a-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); xb5306a.step / xb5306a.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: XySemi datasheet (12 pp, sha256 b415d1f28ee557e5, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF