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Contents

README

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SP015N06GHTD

Siliup · MOSFETs · TO-263

SP015N06GHTD from Siliup, in a TO-263. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate terminal; the gate-source voltage VGS is rated ±20 V in the absolute maximum ratings.
2 D passive Drain terminal; the drain-source voltage VDS is rated 150 V and the continuous drain current ID is 140 A at Tc=25℃.
3 S passive Source terminal; the body diode maximum continuous current IS is 140 A and the forward voltage VSD is 1.2 V max at IS=1A, VGS=0V.

Key specifications

Parameter Value
Manufacturer Siliup
Package TO-263
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS 150 V ID=250μA , VGS=0V 2
Drain Cut-Off Current IDSS 1 μA VDS=120V , VGS=0V 2
Gate Leakage Current IGSS -100 100 nA VGS=±20V , VDS=0V 2
Gate Threshold Voltage VGS(th) 2.8 3.2 3.8 V VDS=VGS , ID=250μA 2
Drain-Source ON Resistance RDS(ON) 6.2 7.5 mΩ VGS=10V , ID=20A 2
Source-Drain Diode Forward Voltage VSD 1.2 V IS=1A , VGS=0V , TJ=25℃ 2
Maximum Body-Diode Continuous Current IS 140 A 2
Drain-Source Voltage VDS 150 V 2
Gate-Source Voltage VGS -20 20 V 2
Continuous Drain Current (Tc=25℃) ID 140 A Tc=25℃ 2
Continuous Drain Current (Tc=100℃) ID 93 A Tc=100℃ 2
Pulsed Drain Current IDM 560 A 2
Single Pulse Avalanche Energy EAS 812 mJ VDD=50V,VGS=10V,L=0.5mH,RG=25Ω 2
Power Dissipation (Tc=25℃) PD 230 W Tc=25℃ 2
Power Dissipation (Tc=100℃) PD 92 W Tc=100℃ 2
Thermal Resistance Junction-to-Case RθJC 0.54 ℃/W 2
Storage Temperature Range TSTG -55 150 ℃ 2
Operating Junction Temperature Range TJ -55 150 ℃ 2

CAD (KiCad official)

  • Symbol: SP015N06GHTD
  • Footprint: Package_TO_SOT_SMD:TO-263-2
  • 3D model: TO-263 (KiCad packages3D, STEP)
  • 3D model files: sp015n06ghtd-etched.step / sp015n06ghtd-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sp015n06ghtd.step / sp015n06ghtd.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Siliup datasheet (9 pp, sha256 7285fdf6dfd6ef1d, retrieved 2026-10-27, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus off (skipped (clean text read)), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF