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Contents

Pinout
Key specifications
Electrical characteristics
Materials and finish
CAD (KiCad official)
Provenance

README

markdown

ESP32-C6-MINI-1U-N4

Espressif Systems · RF and Wireless · 61-SMD Module

ESP32-C6-MINI-1U-N4 from Espressif Systems, in a 61-SMD Module. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	GND	power_in	Ground connection of the module.
2	GND	power_in	Ground connection of the module.
3	3V3	power_in	Module power supply input; VDD33 is specified at 3.0 V min, 3.3 V typ and 3.6 V max, with absolute maximum rating of -0.3 to 3.6 V.
4	NC	unconnected	Not connected; listed as NC in the datasheet with no function.
5	IO2	bidirectional	GPIO2 with alternate functions LP_GPIO2, LP_UART_RTSN, ADC1_CH2 and FSPIQ.
6	IO3	bidirectional	GPIO3 with alternate functions LP_GPIO3, LP_UART_CTSN and ADC1_CH3.
7	NC	unconnected	Not connected; listed as NC in the datasheet with no function.
8	EN	input	High enables the chip and low powers it off; do not leave the EN pin floating.
9	IO4	bidirectional	GPIO4 (MTMS strapping pin) with alternate functions LP_GPIO4, LP_UART_RXD, ADC1_CH4 and FSPIHD.
10	IO5	bidirectional	GPIO5 (MTDI strapping pin) with alternate functions LP_GPIO5, LP_UART_TXD, ADC1_CH5 and FSPIWP.
11	GND	power_in	Ground connection of the module.
12	IO0	bidirectional	GPIO0 with alternate functions XTAL_32K_P, LP_GPIO0, LP_UART_DTRN and ADC1_CH0.
13	IO1	bidirectional	GPIO1 with alternate functions XTAL_32K_N, LP_GPIO1, LP_UART_DSRN and ADC1_CH1.
14	GND	power_in	Ground connection of the module.
15	IO6	bidirectional	GPIO6 with alternate functions MTCK, LP_GPIO6, LP_I2C_SDA, ADC1_CH6 and FSPICLK.
16	IO7	bidirectional	GPIO7 with alternate functions MTDO, LP_GPIO7, LP_I2C_SCL and FSPID.
17	IO12	bidirectional	GPIO12 with alternate function USB_D- (USB data line).
18	IO13	bidirectional	GPIO13 with alternate function USB_D+ (USB data line).
19	IO14	bidirectional	GPIO14 general-purpose I/O.
20	IO15	bidirectional	GPIO15 general-purpose I/O; also the JTAG signal source strapping pin.
21	NC	unconnected	Not connected; listed as NC in the datasheet with no function.
22	IO8	bidirectional	GPIO8 general-purpose I/O; also a chip boot mode / ROM message strapping pin.
23	IO9	bidirectional	GPIO9 general-purpose I/O; also a chip boot mode strapping pin with a weak internal pull-up.
24	IO18	bidirectional	GPIO18 with alternate functions SDIO_CMD and FSPICS2.
25	IO19	bidirectional	GPIO19 with alternate functions SDIO_CLK and FSPICS3.
26	IO20	bidirectional	GPIO20 with alternate functions SDIO_DATA0 and FSPICS4.
27	IO21	bidirectional	GPIO21 with alternate functions SDIO_DATA1 and FSPICS5.
28	IO22	bidirectional	GPIO22 with alternate function SDIO_DATA2.
29	IO23	bidirectional	GPIO23 with alternate function SDIO_DATA3.
30	RXD0	bidirectional	U0RXD (UART0 receive) with alternate functions GPIO17 and FSPICS1.
31	TXD0	bidirectional	U0TXD (UART0 transmit) with alternate functions GPIO16 and FSPICS0.
32	NC	unconnected	Not connected; listed as NC in the datasheet with no function.
33	NC	unconnected	Not connected; listed as NC in the datasheet with no function.
34	NC	unconnected	Not connected; listed as NC in the datasheet with no function.
35	NC	unconnected	Not connected; listed as NC in the datasheet with no function.
36	GND	power_in	Ground connection of the module.
37	GND	power_in	Ground connection of the module.
38	GND	power_in	Ground connection of the module.
39	GND	power_in	Ground connection of the module.
40	GND	power_in	Ground connection of the module.
41	GND	power_in	Ground connection of the module.
42	GND	power_in	Ground connection of the module.
43	GND	power_in	Ground connection of the module.
44	GND	power_in	Ground connection of the module.
45	GND	power_in	Ground connection of the module.
46	GND	power_in	Ground connection of the module.
47	GND	power_in	Ground connection of the module.
48	GND	power_in	Ground connection of the module.
49	GND	power_in	Ground pad labelled EPAD 49 in the peripheral schematic; soldering it to the base board ground is optional and improves thermal performance, but excess solder paste can raise the module gap.
50	GND	power_in	Ground connection of the module.
51	GND	power_in	Ground connection of the module.
52	GND	power_in	Ground connection of the module.
53	GND	power_in	Ground connection of the module.

Key specifications

Parameter	Value
Manufacturer	Espressif Systems
Package	61-SMD Module
Category	RF and Wireless
Pins	53

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Power supply voltage	VDD33	-0.3		3.6	V		26
Power supply voltage	VDD33	3	3.3	3.6	V		26
Current delivered by external power supply	IVDD	0.5			A		26
Operating ambient temperature	TA	-40		85	°C	85 °C version	26
High-level input current	IIH			50	nA		26
Low-level input current	IIL			50	nA		26
Power supply voltage (1.8 V)	VCC	1.65	1.8	2	V	Power supply voltage (1.8 V)	28
Power supply voltage (3.3 V)	VCC	2.7	3.3	3.6	V	Power supply voltage (3.3 V)	28
Maximum clock frequency	FC	80			MHz		28
Program/erase cycles		100000			cycles		28
Data retention time	TRET	20			years		28
Page program time	TPP		0.8	5	ms		28
Sector erase time (4 KB)	TSE		70	500	ms		29
Chip erase time (32 Mb)	TCE		20	60	s	Chip erase time (32 Mb)	29
RF transmit power range (Bluetooth LE)		-16		19	dBm		33
RF transmit power range (802.15.4)		-16		19	dBm		37
Sensitivity 1 Mbps				-98	dBm	@30.8% PER	34
Maximum received signal 1 Mbps				8	dBm	@30.8% PER	34
Sensitivity 2 Mbps				-95	dBm	@30.8% PER	35
Maximum received signal 2 Mbps				8	dBm	@30.8% PER	35
Sensitivity 125 Kbps				-105.5	dBm	@30.8% PER	36
Maximum received signal 125 Kbps				8	dBm	@30.8% PER	36
Sensitivity 500 Kbps				-101.5	dBm	@30.8% PER	36
Maximum received signal 500 Kbps				8	dBm	@30.8% PER	36
Sensitivity 802.15.4 250 Kbps				-104	dBm	@1% PER	37
Maximum received signal 802.15.4 250 Kbps				8	dBm	@1% PER	37
Insulation resistance (external antenna connector)		500			MOHM		42
Contact resistance (external antenna connector)				20	MOHM		42

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part	Material	Colour / plating	Datasheet says	Page
housing	THERMOPLASTIC		HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0;	42
contacts	COPPER ALLOY	gold	CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER;	42
shell	COPPER ALLOY	gold	SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER;	42

CAD (KiCad official)

Symbol: ESP32-C6-MINI-1U-N4
Footprint: PCM_Espressif:ESP32-C6-MINI-1U
3D model: 61-SMD Module (KiCad packages3D, STEP)
3D model files: esp32-c6-mini-1u-n4-etched.step / esp32-c6-mini-1u-n4-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esp32-c6-mini-1u-n4.step / esp32-c6-mini-1u-n4.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Espressif Systems datasheet (53 pp, sha256 26691033f31cbebf, retrieved 2026-10-28, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF