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ESP32-C6-MINI-1U-N4

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Espressif Systems RF and Wireless, 61-SMD Module. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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ESP32-C6-MINI-1U-N4

Espressif Systems · RF and Wireless · 61-SMD Module

ESP32-C6-MINI-1U-N4 from Espressif Systems, in a 61-SMD Module. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground connection of the module.
2 GND power_in Ground connection of the module.
3 3V3 power_in Module power supply input; VDD33 is specified at 3.0 V min, 3.3 V typ and 3.6 V max, with absolute maximum rating of -0.3 to 3.6 V.
4 NC unconnected Not connected; listed as NC in the datasheet with no function.
5 IO2 bidirectional GPIO2 with alternate functions LP_GPIO2, LP_UART_RTSN, ADC1_CH2 and FSPIQ.
6 IO3 bidirectional GPIO3 with alternate functions LP_GPIO3, LP_UART_CTSN and ADC1_CH3.
7 NC unconnected Not connected; listed as NC in the datasheet with no function.
8 EN input High enables the chip and low powers it off; do not leave the EN pin floating.
9 IO4 bidirectional GPIO4 (MTMS strapping pin) with alternate functions LP_GPIO4, LP_UART_RXD, ADC1_CH4 and FSPIHD.
10 IO5 bidirectional GPIO5 (MTDI strapping pin) with alternate functions LP_GPIO5, LP_UART_TXD, ADC1_CH5 and FSPIWP.
11 GND power_in Ground connection of the module.
12 IO0 bidirectional GPIO0 with alternate functions XTAL_32K_P, LP_GPIO0, LP_UART_DTRN and ADC1_CH0.
13 IO1 bidirectional GPIO1 with alternate functions XTAL_32K_N, LP_GPIO1, LP_UART_DSRN and ADC1_CH1.
14 GND power_in Ground connection of the module.
15 IO6 bidirectional GPIO6 with alternate functions MTCK, LP_GPIO6, LP_I2C_SDA, ADC1_CH6 and FSPICLK.
16 IO7 bidirectional GPIO7 with alternate functions MTDO, LP_GPIO7, LP_I2C_SCL and FSPID.
17 IO12 bidirectional GPIO12 with alternate function USB_D- (USB data line).
18 IO13 bidirectional GPIO13 with alternate function USB_D+ (USB data line).
19 IO14 bidirectional GPIO14 general-purpose I/O.
20 IO15 bidirectional GPIO15 general-purpose I/O; also the JTAG signal source strapping pin.
21 NC unconnected Not connected; listed as NC in the datasheet with no function.
22 IO8 bidirectional GPIO8 general-purpose I/O; also a chip boot mode / ROM message strapping pin.
23 IO9 bidirectional GPIO9 general-purpose I/O; also a chip boot mode strapping pin with a weak internal pull-up.
24 IO18 bidirectional GPIO18 with alternate functions SDIO_CMD and FSPICS2.
25 IO19 bidirectional GPIO19 with alternate functions SDIO_CLK and FSPICS3.
26 IO20 bidirectional GPIO20 with alternate functions SDIO_DATA0 and FSPICS4.
27 IO21 bidirectional GPIO21 with alternate functions SDIO_DATA1 and FSPICS5.
28 IO22 bidirectional GPIO22 with alternate function SDIO_DATA2.
29 IO23 bidirectional GPIO23 with alternate function SDIO_DATA3.
30 RXD0 bidirectional U0RXD (UART0 receive) with alternate functions GPIO17 and FSPICS1.
31 TXD0 bidirectional U0TXD (UART0 transmit) with alternate functions GPIO16 and FSPICS0.
32 NC unconnected Not connected; listed as NC in the datasheet with no function.
33 NC unconnected Not connected; listed as NC in the datasheet with no function.
34 NC unconnected Not connected; listed as NC in the datasheet with no function.
35 NC unconnected Not connected; listed as NC in the datasheet with no function.
36 GND power_in Ground connection of the module.
37 GND power_in Ground connection of the module.
38 GND power_in Ground connection of the module.
39 GND power_in Ground connection of the module.
40 GND power_in Ground connection of the module.
41 GND power_in Ground connection of the module.
42 GND power_in Ground connection of the module.
43 GND power_in Ground connection of the module.
44 GND power_in Ground connection of the module.
45 GND power_in Ground connection of the module.
46 GND power_in Ground connection of the module.
47 GND power_in Ground connection of the module.
48 GND power_in Ground connection of the module.
49 GND power_in Ground pad labelled EPAD 49 in the peripheral schematic; soldering it to the base board ground is optional and improves thermal performance, but excess solder paste can raise the module gap.
50 GND power_in Ground connection of the module.
51 GND power_in Ground connection of the module.
52 GND power_in Ground connection of the module.
53 GND power_in Ground connection of the module.

Key specifications

Parameter Value
Manufacturer Espressif Systems
Package 61-SMD Module
Category RF and Wireless
Pins 53

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Power supply voltage VDD33 -0.3 3.6 V 26
Power supply voltage VDD33 3 3.3 3.6 V 26
Current delivered by external power supply IVDD 0.5 A 26
Operating ambient temperature TA -40 85 °C 85 °C version 26
High-level input current IIH 50 nA 26
Low-level input current IIL 50 nA 26
Power supply voltage (1.8 V) VCC 1.65 1.8 2 V Power supply voltage (1.8 V) 28
Power supply voltage (3.3 V) VCC 2.7 3.3 3.6 V Power supply voltage (3.3 V) 28
Maximum clock frequency FC 80 MHz 28
Program/erase cycles 100000 cycles 28
Data retention time TRET 20 years 28
Page program time TPP 0.8 5 ms 28
Sector erase time (4 KB) TSE 70 500 ms 29
Chip erase time (32 Mb) TCE 20 60 s Chip erase time (32 Mb) 29
RF transmit power range (Bluetooth LE) -16 19 dBm 33
RF transmit power range (802.15.4) -16 19 dBm 37
Sensitivity 1 Mbps -98 dBm @30.8% PER 34
Maximum received signal 1 Mbps 8 dBm @30.8% PER 34
Sensitivity 2 Mbps -95 dBm @30.8% PER 35
Maximum received signal 2 Mbps 8 dBm @30.8% PER 35
Sensitivity 125 Kbps -105.5 dBm @30.8% PER 36
Maximum received signal 125 Kbps 8 dBm @30.8% PER 36
Sensitivity 500 Kbps -101.5 dBm @30.8% PER 36
Maximum received signal 500 Kbps 8 dBm @30.8% PER 36
Sensitivity 802.15.4 250 Kbps -104 dBm @1% PER 37
Maximum received signal 802.15.4 250 Kbps 8 dBm @1% PER 37
Insulation resistance (external antenna connector) 500 MOHM 42
Contact resistance (external antenna connector) 20 MOHM 42

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing THERMOPLASTIC HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0; 42
contacts COPPER ALLOY gold CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; 42
shell COPPER ALLOY gold SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; 42

CAD (KiCad official)

  • Symbol: ESP32-C6-MINI-1U-N4
  • Footprint: PCM_Espressif:ESP32-C6-MINI-1U
  • 3D model: 61-SMD Module (KiCad packages3D, STEP)
  • 3D model files: esp32-c6-mini-1u-n4-etched.step / esp32-c6-mini-1u-n4-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esp32-c6-mini-1u-n4.step / esp32-c6-mini-1u-n4.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Espressif Systems datasheet (53 pp, sha256 26691033f31cbebf, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF