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Contents

README

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LP6230CMSF

LOWPOWER · DC-DC Converters · MSOP-8

LP6230CMSF from LOWPOWER, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected Not connected (the datasheet lists this pin as 'No Connector').
2 FB input Regulation feedback input; connect an external resistive divider from VOUT to FB to set the output voltage, with VFB of 1.22 V to 1.28 V (1.25 V typical).
3 EN input Regulator on/off control input: logic high (VEN > 1.4 V) enables the regulator and logic low (VEN < 0.4 V) puts the device into low-current shutdown.
4 GND power_in Ground.
5 SW output Switching pin, the internal power MOSFET drain/switch node; the datasheet limits SW to GND at -0.3 V to 30 V.
6 VIN power_in Power supply pin; operating range is 2.2 V to 6 V, with VIN to GND absolute maximum of -0.3 V to 6.5 V.
7 NC unconnected Not connected (the datasheet lists this pin as 'No Connector').
8 NC unconnected Not connected (the datasheet lists this pin as 'No Connector').

Key specifications

Parameter Value
Manufacturer LOWPOWER
Package MSOP-8
Category Power Management (PMIC)
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operation voltage range VIN 2.2 6 V 3
Feedback voltage VFB 1.22 1.25 1.28 V 3
Shut down current ISD 0.1 1 μA VEN=0V 3
Shut down voltage VEN(OFF) 0.4 V 3
Enable on voltage VEN(ON) 1.4 V 3
SW current limit ILM 2 A 3
VIN to GND VIN -0.3 6.5 V 3
SW to GND SW -0.3 30 V 3
Other pin to GND -0.3 6 V 3
Maximum junction temperature 150 °C 3
Operating ambient temperature range -20 85 °C 3
Maximum soldering temperature 260 °C at leads, 10 sec 3
Maximum power dissipation PD 900 mW MSOP8, TA=25℃ 3
Thermal resistance (junction to ambient) θJA 165 ℃/W 3
Recommended inductor value L 2.2 10 μH 5

CAD (KiCad official)

  • Symbol: LP6230CMSF
  • Footprint: Package_SO:MSOP-8_3x3mm_P0.65mm
  • 3D model: MSOP-8 (KiCad packages3D, STEP)
  • 3D model files: lp6230cmsf-etched.step / lp6230cmsf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lp6230cmsf.step / lp6230cmsf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: LOWPOWER datasheet (7 pp, sha256 d1bf9c60f5131ba8, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF