component
RS5N50D
Public Made by Adomby adom
REASUNOS MOSFETs, TO-252. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownRS5N50D
REASUNOS · MOSFETs · TO-252
RS5N50D from REASUNOS, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; controls the channel, with VGS rated at ±30 V maximum and a threshold of 2 to 4 V at ID=250µA. |
| 2 | D | passive | Drain, the trimmed centre lead, which is also the exposed metal tab; VDSS is 500 V and continuous ID is 5 A at TC=25℃. |
| 3 | S | passive | Source; carries the 5 A continuous source (body-diode) current IS and the 20 A pulsed current. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | REASUNOS |
| Package | TO-252 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-to-Source Breakdown Voltage | BVDSS | 500 | V | VGS=0V, ID=250µA | 2 | ||
| Drain-to-Source Leakage Current | IDSS | 1 | µA | VDS=500V, VGS=0V | 2 | ||
| Gate-to-Source Forward Leakage | IGSS | 100 | nA | VGS=30V, VDS=0V | 2 | ||
| Gate-to-Source Reverse Leakage | IGSS | -100 | nA | VGS=-30V, VDS=0V | 2 | ||
| Static Drain-to-Source On-Resistance | RDS(on) | 1.25 | 1.45 | Ω | VGS=10V, ID=2.5A | 2 | |
| Gate Threshold Voltage | VGS(TH) | 2 | 3 | 4 | V | VGS=VDS, ID=250µA | 2 |
| Continuous Source Current | IS | 5 | A | Integral pn-diode in MOSFET | 3 | ||
| Maximum Pulsed Current | ISM | 20 | A | Integral pn-diode in MOSFET | 3 | ||
| Diode Forward Voltage | VSD | 1.4 | V | IS=5A, VGS=0V | 3 | ||
| Drain-to-Source Voltage | VDSS | 500 | V | Tc=25℃ | 1 | ||
| Continuous Drain Current | ID | 5 | A | TC=25℃ | 1 | ||
| Continuous Drain Current | ID | 3 | A | TC=100℃ | 1 | ||
| Pulsed Drain Current | IDM | 20 | A | 1 | |||
| Power Dissipation | PD | 52 | W | Tc=25℃ | 1 | ||
| Gate-to-Source Voltage | VGS | -30 | 30 | V | 1 | ||
| Single Pulse Avalanche Energy | EAS | 200 | mJ | L=10mH, VDD=50V, RG=25Ω | 1 | ||
| Maximum Soldering Temperature, Leads | TL | 300 | ℃ | Leads at 0.063in(1.6mm) from case for 10 seconds | 1 | ||
| Maximum Soldering Temperature, Package | TPKG | 260 | ℃ | Package body for 10 seconds | 1 | ||
| Operating Junction and Storage Temperature Range | TJ, TSTG | -55 | 150 | ℃ | 1 | ||
| Junction-to-Case Thermal Resistance | RθJC | 2.6 | ℃/W | Drain lead soldered to water cooled heatsink, PD adjusted for peak junction temperature of +150℃ | 2 | ||
| Junction-to-Ambient Thermal Resistance | RθJA | 62 | ℃/W | 1 cubic foot chamber, free air | 2 | ||
| Turn-on Delay Time | td(ON) | 24 | nS | VDS=250V, ID=5A, RG=10Ω | 2 | ||
| Rise Time | trise | 18 | nS | VDS=250V, ID=5A, RG=10Ω | 2 | ||
| Turn-off Delay Time | td(OFF) | 52 | nS | VDS=250V, ID=5A, RG=10Ω | 2 | ||
| Fall Time | tfall | 31 | nS | VDS=250V, ID=5A, RG=10Ω | 2 | ||
| Input Capacitance | Ciss | 478 | pF | VGS=0V, VDS=25V, f=1.0MHz | 3 | ||
| Output Capacitance | Coss | 55 | pF | VGS=0V, VDS=25V, f=1.0MHz | 3 | ||
| Reverse Transfer Capacitance | Crss | 6.7 | pF | VGS=0V, VDS=25V, f=1.0MHz | 3 | ||
| Total Gate Charge | Qg | 16 | nC | VDS=400V, ID=5A, VGS=10V | 3 | ||
| Gate-to-Source Charge | Qgs | 3.5 | nC | VDS=400V, ID=5A, VGS=10V | 3 | ||
| Gate-to-Drain (Miller) Charge | Qgd | 5.5 | nC | VDS=400V, ID=5A, VGS=10V | 3 | ||
| Reverse Recovery Time | trr | 408 | nS | VR=400V, IF=5A, di/dt=100A/µs | 3 | ||
| Reverse Recovery Charge | Qrr | 1.5 | µC | VR=400V, IF=5A, di/dt=100A/µs | 3 |
CAD (KiCad official)
- Symbol:
RS5N50D - Footprint:
Package_TO_SOT_SMD:TO-252-2 - 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files:
rs5n50d-etched.step/rs5n50d-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);rs5n50d.step/rs5n50d.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: REASUNOS datasheet (8 pp, sha256
b48783f2b7f4daf1, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).