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Contents

README

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LMR50410Y5FQDBVRQ1

Texas Instruments · DC-DC Converters · SOT-23-6

LMR50410Y5FQDBVRQ1 from Texas Instruments, in a SOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CB passive Bootstrap capacitor connection for the high-side FET driver; connect a high quality 100-nF capacitor from this pin to the SW pin (CB to SW max 5.5 V).
2 GND power_in Power ground terminal connected to the source of the low-side FET internally; connect to system ground and the ground side of CIN and COUT, with the path to CIN as short as possible.
3 FB input Feedback input to the converter; for this fixed 5.0-V output version connect it directly to the output point, and never short it to ground during operation (FB to GND max 5.5 V).
4 EN input Precision enable input (high = on, low = off) that must not be floated, can be tied to VIN, and allows adjustable UVLO with an external resistor divider.
5 VIN power_in Supply input terminal to the internal bias LDO and high-side FET, operating range 4 V to 36 V, with input bypass capacitors CIN connected directly between this pin and GND.
6 SW passive Switching output of the converter, internally connected to the source of the high-side FET and drain of the low-side FET; connect to the power inductor.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOT-23-6
Category Power Supply Chip
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Rising UVLO threshold VIN_UVLO 3.55 3.75 4 V Rising threshold 5
Falling UVLO threshold VIN_UVLO 3.25 3.45 3.65 V Falling threshold 5
Shutdown quiescent current ISD 3 10 µA VEN = 0 V 5
Enable input high-level VEN-VOUT-H 1.1 1.23 1.36 V VENABLE rising 5
Enable input low-level VEN-VOUT-L 0.95 1.1 1.22 V VENABLE falling 5
Enable input leakage current ILKG-EN 10 200 nA VEN = 3.3V 5
Output voltage (5 V fixed) VOUT-5V-Fixed 4.925 5 5.075 V Vin=12V 5
High-side current limit ISC 1.25 1.6 1.9 A Vin=12V 5
Low-side current limit ILS-LIMIT 0.9 1.1 1.3 A Vin=12V 5
Internal oscillator frequency FOSC 1.8 2.1 2.4 MHz 2.1-MHz variant 6
Input voltage VIN to GND (abs max) VIN -0.3 38 V VIN to GND 4
EN to GND (abs max) EN -0.3 V Max is VIN+0.3 4
FB to GND (abs max) FB -0.3 5.5 V FB to GND 4
SW to GND (abs max) SW -0.3 V Max is VIN+0.3 4
SW to GND transients SW -3.5 38 V less than 10-ns transients 4
CB to SW (abs max) CB -0.3 5.5 V CB to SW 4
Junction temperature (abs max) TJ -40 150 °C 4
Storage temperature Tstg -65 150 °C 4
ESD HBM V(ESD) -2500 2500 V Human body model (HBM) 4
ESD CDM V(ESD) -750 750 V Charged device model (CDM) 4
Input voltage VIN to GND VIN 4 36 V VIN to GND 4
EN to GND EN 0 V Max is VIN 4
Output current IOUT 0 1 A 4
Junction-to-ambient thermal resistance RθJA 173 °C/W DBV (SOT-23-6) 4
Junction-to-case (top) thermal resistance RθJC(top) 116 °C/W DBV (SOT-23-6) 4
Junction-to-board thermal resistance RθJB 31 °C/W DBV (SOT-23-6) 4
Junction-to-top characterization parameter ψJT 20 °C/W DBV (SOT-23-6) 4
Junction-to-board characterization parameter ψJB 30 °C/W DBV (SOT-23-6) 5
Negative current limit IL-NEG -0.6 A FPWM variant only 5
High-side MOSFET ON-resistance RDS-ON-HS 450 mΩ TJ=25 ℃, VIN = 12 V 5
Low-side MOSFET ON-resistance RDS-ON-LS 240 mΩ TJ=25 ℃, VIN = 12 V 5
Thermal shutdown threshold TSD-Rising 170 °C Shutdown threshold 5
Thermal shutdown recovery threshold TSD-Falling 158 °C Recovery threshold 6
Feedback leakage current (5 V fixed) ILKG-VOUT-5V-Fixed 2.6 µA VOUT = 5V (Fixed Option) 5

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper The SW pin connecting to the inductor must be as short as possible, and just wide enough to carry the load current without excessive heating. Short, thick traces or copper pours (shapes) must be used 27

CAD (KiCad official)

  • Symbol: LMR50410Y5FQDBVRQ1
  • Footprint: Package_TO_SOT_SMD:SOT-23-6
  • 3D model: SOT-23-6 (KiCad packages3D, STEP)
  • 3D model files: lmr50410y5fqdbvrq1-etched.step / lmr50410y5fqdbvrq1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lmr50410y5fqdbvrq1.step / lmr50410y5fqdbvrq1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (38 pp, sha256 70125484c2028d37, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF