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Contents

README

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APX823-44W5G-7

Diodes Incorporated · Supervisor And Reset ICs · SOT-25-5

APX823-44W5G-7 from Diodes Incorporated, in a SOT-25-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RESET output Active-low reset output, asserted when VCC is below the threshold VTH- (4.38V typ for -44), when MR is low, or when the watchdog times out, and held for td (200ms typ) after release.
2 GND power_in Ground.
3 MR input Active-low manual reset input with internal 60kΩ pull-up; a low level causes RESET to become active.
4 WDI input Watchdog input triggered by a positive or negative transition within the time-out interval (1.6s typ); leaving it unconnected disables the watchdog.
5 VCC power_in Operating voltage input, 1.1V to 5.5V recommended (6.0V absolute maximum), with a 0.1µF ceramic bypass capacitor placed near the pin.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-25-5
Category Power Management (PMIC)
Pins 5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VCC Supply Voltage (recommended) VCC 1.1 5.5 V 3
High-level Input Voltage at MR and WDI (printed as 0.7 x VCC) VIH 0.7 V 3
Low-level Input Voltage at MR and WDI (printed as 0.3 x VCC) VIL 0.3 V 3
Input Voltage (max printed as VCC+0.3) VIN 0 V 3
Input Transition Rise and Fall Rate at MR or WDI Δt/ΔV 100 ns/V 3
Operating Ambient Temperature Range TA -40 85 oC 3
VCC Rising Time (VCC = 0~VT) TR 100 V/uS VCC = 0~VT 3
ESD HBM Human Body Model ESD Protection ESD HBM 5 KV Human Body Model 3
ESD MM Machine Model ESD Protection ESD MM 200 V Machine Model 3
VCC Supply Voltage (absolute maximum) VCC 6 V 3
VRESET: RESET, RESET-bar, MR, WDI (min -0.3; max printed as VCC+0.3) VRESET -0.3 V 3
Input Current VCC ICC 20 mA 3
Maximum High Output Current IO 20 mA 3
Continuous Total Power Dissipation SOT25 power rating PD 500 mW SOT25, TA = 25oC power rating 3
Continuous Total Power Dissipation SOT25 power rating PD 220 mW SOT25, TA = 70oC power rating 3
Continuous Total Power Dissipation SOT25 power rating PD 125 mW SOT25, TA = 85oC power rating 3
Derating Factor Above TA = 25oC, SOT25 PD 6.2 mW/°C SOT25, above TA = 25oC 3
Operating Junction Temperature Range TOP -40 105 °C 3
Storage Temperature Range TST -65 150 °C 3
Low-level Output Voltage RESET (APX823/824/825A -46/44 group) VOL 0.4 V VCC= VTH- -0.2V, IOL=3mA 4
Power-up Reset Voltage VRESET 0.4 V VCC > 1.1V, IOL=20μA 4
Negative-going Input Threshold Voltage VTH- (-44 variant) VTH- 4.31 4.38 4.47 V TA = 0 oC -85oC 4
Negative-going Input Threshold Voltage VTH- (-44 variant) VTH- 4.19 4.38 4.56 V TA= -40oC -85oC 4
Hysteresis at VCC Input (-44 variant) Vhys 50 mV 5
TS Set-up Time TS 20 μs VCC = VTH to (VTH, 100mV) 5
Average High-level Input Current WDI IIH(AV) 120 μA WDI=VCC, Time average (dc=88%) 5
Average Low-level Input Current WDI IIL(AV) -15 μA WDI=0.3V, VCC=5.5V time average (dc=12%) 5
High-level Input Current WDI IIH 120 160 μA WDI=VCC 5
Low-level Input Current WDI IIL 120 160 μA WDI=0.3V, VCC=5.5V 5
Supply Current (WDI and MR unconnected, outputs unconnected) ICC 30 40 μA WDI and MR unconnected, outputs unconnected, VCC = VTH-+0.2V 5
Internal Pull-up Resistor at MR RPU 60 kΩ 5
VOUT Temperature Coefficient TC 50 ppm/oC 5
Input Capacitance at MR, WDI Ci 5 pF VI = 0V to 5.5V 5
Pulse Width at MR tW 100 ns VCC> VTH-+0.2V, VIL=0.3 VCC, VIH=0.7 VCC 6
Pulse Width at WDI tW 50 ns VCC> VTH-+0.2V, VIL=0.3 VCC, VIH=0.7 VCC 6
Watchdog Time Out ttout 1.12 1.6 2.4 s VCC> VTH-+0.2V, See timing diagram 6
Delay Time td 140 200 280 ms VCC> VTH-+0.2V, See timing diagram 6
Propagation Delay Time High-to-low, MR to RESET (APX823/825A) tPHL 0.1 μs VCC> VTH-+0.2V, VIL=0.3 VCC, VIH=0.7 VCC 6
Propagation Delay Time High-to-low, VCC to RESET tPHL 25 μs VIL= VTH- -0.2V, VIH= VTH-+0.2V 6
Thermal Resistance Junction-to-Ambient, SOT25 θJA 161 oC/W Note 6: FR-4 PCB, 2oz copper, minimum recommended pad layout 5
Thermal Resistance Junction-to-Case, SOT25 θJC 27 oC/W Note 6: FR-4 PCB, 2oz copper, minimum recommended pad layout 5

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin  Terminals: Finish, Matte Tin Plated Leads, Solderable per MIL-STD-202, Method 208  Weight: 12

CAD (KiCad official)

  • Symbol: APX823-44W5G-7
  • Footprint: Package_TO_SOT_SMD:SOT-23-5
  • 3D model: SOT-25-5 (KiCad packages3D, STEP)
  • 3D model files: apx823-44w5g-7-etched.step / apx823-44w5g-7-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); apx823-44w5g-7.step / apx823-44w5g-7.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (13 pp, sha256 fdb2f5991123ff64, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF