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Contents

README

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CMB044N10B

Cmos(广东场效应半导体) · IC · TO-263

CMB044N10B from Cmos(广东场效应半导体), in a TO-263. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; gate-source voltage limited to ±20 V, threshold 2 to 4 V at VGS=VDS, ID=250uA.
2 D passive Drain (also the tab); drain-source voltage 100 V max, continuous current 120 A (package limit), pulsed 480 A.
3 S passive Source; body diode continuous source current 120 A, pulsed 480 A.

Key specifications

Parameter Value
Manufacturer Cmos(广东场效应半导体)
Package TO-263
Category
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS 100 V VGS=0V , ID=250uA 2
Static Drain-Source On-Resistance RDS(ON) 4.2 mΩ VGS=10V , ID=50A 2
Gate Threshold Voltage VGS(th) 2 4 V VGS=VDS , ID =250uA 2
Drain-Source Leakage Current IDSS 1 uA VDS=80V, VGS=0V 2
Gate-Source Leakage Current IGSS -100 100 nA VGS = ±20V , VDS=0V 2
Continuous Source Current IS 120 A 2
Pulsed Source Current ISM 480 A VG=VD=0V , Force Current 2
Diode Forward Voltage VSD 1.3 V VGS=0V , IS=40A , TJ=25℃ 2
Drain-Source Voltage VDS 100 V 1
Gate-Source Voltage VGS -20 20 V 1
Continuous Drain Current (Package limit) ID@TC=25℃ 120 A TC=25℃ 1
Continuous Drain Current (Silicon limit) ID@TC=100℃ 108 A TC=100℃ 1
Pulsed Drain Current IDM 480 A 1
Single Pulse Avalanche Energy EAS 1458 mJ VDD=50V, VGS=10V, L=1mH, IAS=54A (Note 1) 1
Total Power Dissipation PD@TC=25℃ 227 W TC=25℃ 1
Storage Temperature Range TSTG -55 150 ℃ 1
Operating Junction Temperature Range TJ -55 150 ℃ 1
Thermal Resistance Junction-ambient RθJA 62 ℃/ W 1
Thermal Resistance Junction-case RθJC 0.55 ℃/ W 1

CAD (KiCad official)

  • Symbol: CMB044N10B
  • Footprint: Package_TO_SOT_SMD:TO-263-2
  • 3D model: TO-263 (KiCad packages3D, STEP)
  • 3D model files: cmb044n10b-etched.step / cmb044n10b-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); cmb044n10b.step / cmb044n10b.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Cmos(广东场效应半导体) datasheet (3 pp, sha256 d0baa9a6b55cd786, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF