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Contents

README

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RN1102MFV

TOSHIBA · Digital Transistors · SOT-723

RN1102MFV from TOSHIBA, in a SOT-723. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Base input Base of the NPN transistor with built-in bias resistors R1 = 10 kΩ in series and R2 = 10 kΩ to emitter for RN1102MFV.
2 Emitter passive Emitter of the NPN transistor; VEBO rating is 10 V.
3 Collector passive Collector of the NPN transistor; VCBO and VCEO are 50 V and IC maximum is 100 mA.

Key specifications

Parameter Value
Manufacturer TOSHIBA
Package SOT-723
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Collector cut-off current ICBO 100 nA VCB = 50 V, IE = 0 mA 4
Collector cut-off current (CE, base open) ICEO 500 nA VCE = 50 V, IB = 0 mA 4
Emitter cut-off current IEBO 0.71 mA VEB = 10 V, IC = 0 mA 4
DC current gain hFE 50 VCE = 5 V, IC = 10 mA 4
Collector-emitter saturation voltage VCE(sat) 0.1 0.3 V IC = 5 mA, IB = 0.5 mA 4
Input voltage (ON) VI(ON) 1.2 V VCE = 0.2 V, IC = 5 mA 4
Input resistance R1 7 10 13 kΩ 4
Resistor ratio R1/R2 0.8 1 1.2 4
Bias resistor R2 (nominal, as printed in bias resistor table) R2 10 kΩ 1
Collector-base voltage VCBO 50 V Ta = 25 °C 3
Collector-emitter voltage VCEO 50 V Ta = 25 °C 3
Emitter-base voltage VEBO 10 V Ta = 25 °C 3
Collector current IC 100 mA Ta = 25 °C 3
Collector power dissipation PC 150 mW Mounted on FR4 board (25.4 mm × 25.4 mm × 1.6 mm), Note 1 3
Junction temperature Tj 150 °C 3
Storage temperature Tstg -55 150 °C 3

CAD (KiCad official)

  • Symbol: RN1102MFV
  • Footprint: Package_TO_SOT_SMD:SOT-723
  • 3D model: SOT-723, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.5 mm nominal SOT-723 height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: rn1102mfv-etched.step / rn1102mfv-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); rn1102mfv.step / rn1102mfv.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: TOSHIBA datasheet (11 pp, sha256 b1ce78547f27a130, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF