board
TPS54202 12 V to 5 V / 1 A Synchronous Buck Converter Molecule
Public Unreviewedby John Lauer
main
Step 19: Thermal
copper and vias at every hot tab against the rise budget; then the AI's own temperature rise drawing and a walkthrough of the pours it judged
Visits
- 2026-10-18T22:18:00Z
- 2026-10-18T22:39:46Z
What the binary checked
analyze-thermal
- acknowledgedPeaks: 0 item(s)
- boardSinkAssumptions: 0 item(s)
- boardSinkNotes: 0 item(s)
- expiredAcks: 0 item(s)
- fieldNote: same-input field screen passed under its stated assumptions
- fieldReport: ./aiflow-run/fields/fields.json
- heuristicPass: True
- pass: True
- results: 2 item(s)
thermal-vias
- acked: L1, U1
- landed: 0
- short: 0 item(s)
thermal-vias-plan
- parts: 2 item(s)
- plan: ./aiflow-run/plan-thermal-vias.json
- pourFreshness: 0 item(s)
Screenshots and drawings
start

Layer-by-layer copper lateral heat flux and plated via conduction from U1 (250 mW) and L1 (120 mW) into F.Cu and B.Cu pours

Full-board 3D FR4 and copper temperature rise in still air (+41.6 C peak) and moving air (+21.5 C peak) against the +55.0 C budget

screenshot

screenshot

end

start

screenshot

screenshot

end

visit vias-1-end

visit vias-1-start

visit vias-2-end

visit vias-2-start

Clips
AI usage (Google Antigravity)
37 model calls: 127,382 fresh input, 4,979,006 cached input and 24,253 output tokens.
# Step 19: Thermal
copper and vias at every hot tab against the rise budget; then the AI's own temperature rise drawing and a walkthrough of the pours it judged
## Visits
- 2026-10-18T22:18:00Z
- 2026-10-18T22:39:46Z
## What the binary checked
### analyze-thermal
- **acknowledgedPeaks**: 0 item(s)
- **boardSinkAssumptions**: 0 item(s)
- **boardSinkNotes**: 0 item(s)
- **expiredAcks**: 0 item(s)
- **fieldNote**: same-input field screen passed under its stated assumptions
- **fieldReport**: ./aiflow-run/fields/fields.json
- **heuristicPass**: True
- **pass**: True
- **results**: 2 item(s)
### thermal-vias
- **acked**: L1, U1
- **landed**: 0
- **short**: 0 item(s)
### thermal-vias-plan
- **parts**: 2 item(s)
- **plan**: ./aiflow-run/plan-thermal-vias.json
- **pourFreshness**: 0 item(s)
## Screenshots and drawings
**start**

**Layer-by-layer copper lateral heat flux and plated via conduction from U1 (250 mW) and L1 (120 mW) into F.Cu and B.Cu pours**

**Full-board 3D FR4 and copper temperature rise in still air (+41.6 C peak) and moving air (+21.5 C peak) against the +55.0 C budget**

**screenshot**

**screenshot**

**end**

**start**

**screenshot**

**screenshot**

**end**

**visit vias-1-end**

**visit vias-1-start**

**visit vias-2-end**

**visit vias-2-start**

## Clips
::adom-video{video="/john/tps54202-12v-5v-buck-20261018/render/docs/clips/pub-window-19530338-20261018-221841-10x.mp4" poster="/john/tps54202-12v-5v-buck-20261018/render/docs/clips/pub-window-19530338-20261018-221841-poster.jpg" title="Thermal, visit 1 (10x)" muted="true"}
::adom-video{video="/john/tps54202-12v-5v-buck-20261018/render/docs/clips/pub-window-19530338-20261018-224000-10x.mp4" poster="/john/tps54202-12v-5v-buck-20261018/render/docs/clips/pub-window-19530338-20261018-224000-poster.jpg" title="Thermal, visit 2 (10x)" muted="true"}
## AI usage (Google Antigravity)
37 model calls: 127,382 fresh input, 4,979,006 cached input and 24,253 output tokens.