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artifact-7069db1d811b3af9874844615dbce649b3f83e6c8b0f93ead6962db0f08fb638.png adom-aiflow: step evidence (thermal) · John Lauer 2d ago
artifact-7ab9cf7ae4c7fce8fdfdb4f34a506b1e94932cd1d73b5a3181a50bb1290acdaf.png adom-aiflow: step evidence (thermal) · John Lauer 2d ago
pub-shot-thermal-1-end.png Public-safe step pages and screenshots · John Lauer 1d ago
pub-shot-thermal-1-net-GND.png Public-safe step pages and screenshots · John Lauer 1d ago
pub-shot-thermal-1-net-VOUT.png Public-safe step pages and screenshots · John Lauer 1d ago
pub-shot-thermal-1-start.png Public-safe step pages and screenshots · John Lauer 1d ago
pub-shot-thermal-2-end.png Public-safe step pages and screenshots · John Lauer 1d ago
pub-shot-thermal-2-net-GND.png Public-safe step pages and screenshots · John Lauer 1d ago
pub-shot-thermal-2-net-VOUT.png Public-safe step pages and screenshots · John Lauer 1d ago
pub-shot-thermal-2-start.png Public-safe step pages and screenshots · John Lauer 1d ago
pub-shot-thermal-vias-1-end.png Public-safe step pages and screenshots · John Lauer 1d ago
pub-shot-thermal-vias-1-start.png Public-safe step pages and screenshots · John Lauer 1d ago
pub-shot-thermal-vias-2-end.png Public-safe step pages and screenshots · John Lauer 1d ago
pub-shot-thermal-vias-2-start.png Public-safe step pages and screenshots · John Lauer 1d ago
README.md Public-safe step pages and screenshots · John Lauer 1d ago

Step 19: Thermal

copper and vias at every hot tab against the rise budget; then the AI's own temperature rise drawing and a walkthrough of the pours it judged

Visits

  • 2026-10-18T22:18:00Z
  • 2026-10-18T22:39:46Z

What the binary checked

analyze-thermal

  • acknowledgedPeaks: 0 item(s)
  • boardSinkAssumptions: 0 item(s)
  • boardSinkNotes: 0 item(s)
  • expiredAcks: 0 item(s)
  • fieldNote: same-input field screen passed under its stated assumptions
  • fieldReport: ./aiflow-run/fields/fields.json
  • heuristicPass: True
  • pass: True
  • results: 2 item(s)

thermal-vias

  • acked: L1, U1
  • landed: 0
  • short: 0 item(s)

thermal-vias-plan

  • parts: 2 item(s)
  • plan: ./aiflow-run/plan-thermal-vias.json
  • pourFreshness: 0 item(s)

Screenshots and drawings

start

start

Layer-by-layer copper lateral heat flux and plated via conduction from U1 (250 mW) and L1 (120 mW) into F.Cu and B.Cu pours

Layer-by-layer copper lateral heat flux and plated via conduction from U1 (250 mW) and L1 (120 mW) into F.Cu and B.Cu pours

Full-board 3D FR4 and copper temperature rise in still air (+41.6 C peak) and moving air (+21.5 C peak) against the +55.0 C budget

Full-board 3D FR4 and copper temperature rise in still air (+41.6 C peak) and moving air (+21.5 C peak) against the +55.0 C budget

screenshot

screenshot

screenshot

screenshot

end

end

start

start

screenshot

screenshot

screenshot

screenshot

end

end

visit vias-1-end

visit vias-1-end

visit vias-1-start

visit vias-1-start

visit vias-2-end

visit vias-2-end

visit vias-2-start

visit vias-2-start

Clips

AI usage (Google Antigravity)

37 model calls: 127,382 fresh input, 4,979,006 cached input and 24,253 output tokens.