board
65% MX Keyboard (soldered)
Public Unreviewedby gzc
65% ANSI keyboard PCB (68 soldered MX switches) for a gasket-mount case, rev B: STM32F072 under the spacebar running QMK, USB through a Unified Daughterboard on a Pico-EZmate cable, strict-grid copper, green with lead-free HASL, PCBWay bare board for hand assembly.
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| README.md | 15h ago |
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| shot-thermal-vias-1-end.png | 1d ago |
| shot-thermal-vias-1-start.png | 1d ago |
Step 13: Thermal
copper and vias at every hot tab against the rise budget; then the AI's own temperature rise drawing and a walkthrough of the pours it judged
Visits
- 2026-11-09T04:00:19Z
- 2026-11-09T04:44:37Z
- 2026-11-09T04:50:01Z
- 2026-11-09T05:00:06Z
- 2026-11-09T05:22:57Z
- 2026-11-09T06:09:37Z
- 2026-11-09T06:36:06Z
- 2026-11-09T19:54:22Z
- 2026-11-09T20:23:45Z
- 2026-11-09T21:03:34Z
- 2026-11-09T21:07:48Z
- 2026-11-09T22:23:04Z
- 2026-11-10T04:34:07Z
- 2026-11-10T05:17:21Z
What the binary checked
analyze-thermal
- acknowledgedPeaks: 0 item(s)
- boardSinkAssumptions: 0 item(s)
- boardSinkNotes: 0 item(s)
- expiredAcks: 0 item(s)
- fieldNote: same-input field screen passed under its stated assumptions
- fieldReport: aiflow-run/fields/fields.json
- heuristicPass: True
- pass: True
- results: 0 item(s)
thermal-vias
- acked: 0 item(s)
- countedOn: live board (kicad_routing_state)
- landed: 0
- leftOutAcked:
- short: 0 item(s)
thermal-vias-plan
- boardZones: zone "GND pour, both layers" (GND F.Cu): the run's pour (spec.pours), as filled on the saved board, zone "GND pour, both layers" (GND B.Cu): the run's pour (spec.pours), as filled on the saved board
- parts: 0 item(s)
- plan: aiflow-run/plan-thermal-vias.json
- pourFreshness: 0 item(s)
Screenshots and drawings
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