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gzc adom-aiflow: step evidence (thermal-vias) d502495 10h ago

Step 9: Heatsink vias

Heatsink vias where the heat is: for every part that dissipates real power (the regulator, the inductor, the catch diode, the FETs), an array of vias in its thermal pad or the copper it dumps heat into, stitched to the ground or the plane on the other side, sized and counted from its dissipation; the AI reviews the plan and the binary lands it.

Visits

  • 2026-11-09T03:53:41Z
  • 2026-11-09T06:17:17Z
  • 2026-11-09T06:34:52Z
  • 2026-11-09T20:28:20Z (a return: None)
  • 2026-11-10T04:15:37Z
  • 2026-11-10T05:00:45Z

What the binary checked

thermal-vias

  • acked: 0 item(s)
  • countedOn: live board (kicad_routing_state)
  • landed: 0
  • leftOutAcked:
  • short: 0 item(s)

thermal-vias-plan

  • boardZones: zone "GND pour, both layers" (GND F.Cu): the run's pour (spec.pours), as filled on the saved board, zone "GND pour, both layers" (GND B.Cu): the run's pour (spec.pours), as filled on the saved board
  • parts: 0 item(s)
  • plan: aiflow-run/plan-thermal-vias.json
  • pourFreshness: 0 item(s)

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