board
65% MX Keyboard (soldered)
Public Unreviewedby gzc
65% ANSI keyboard PCB (68 soldered MX switches) for a gasket-mount case, rev B: STM32F072 under the spacebar running QMK, USB through a Unified Daughterboard on a Pico-EZmate cable, strict-grid copper, green with lead-free HASL, PCBWay bare board for hand assembly.
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aiflow run 65-keyboard-claude-opus-5-5-20261109-0022: pours
5 files changed
+28−6
docs/runs/65-keyboard-claude-opus-5-5-20261109-0022/README.md+28−6docs/runs/65-keyboard-claude-opus-5-5-20261109-0022/shot-pours-1-start.pngdocs/runs/65-keyboard-claude-opus-5-5-20261109-0022/shot-thermal-vias-1-end.pngdocs/runs/65-keyboard-claude-opus-5-5-20261109-0022/thermal-vias-1-sheet.pngdocs/runs/65-keyboard-claude-opus-5-5-20261109-0022/thermal-vias-1.mp4docs/runs/65-keyboard-claude-opus-5-5-20261109-0022/README.md+28−6@@ -1,6 +1,6 @@ # AI Flow run: claude-opus-5-5 on board-0 -**Running**: step `thermal-vias`, 159.9 min of AI time since the prompt (211.7 min on the wall clock). This page updates at every step change.+**Running**: step `pours`, 160.0 min of AI time since the prompt (211.8 min on the wall clock). This page updates at every step change. Prompt at 2026-11-09T00:22:00Z (UTC). Flow: board. Every number here is from the run's append-only ledger (run.jsonl). AI time is the time the AI was working on a prompt: from the human's prompt to the AI's done, with any gap over 15 min where no command ran (unobserved, not proven idle) cut out. @@ -10,8 +10,8 @@ One row per human prompt: the AI's time on it, unobserved gaps excluded by the h | Session | Prompt at | Done at | AI time min | Unobserved gap min | What | |---|---|---|---|---|---|-| 1 | 2026-11-09T00:22:00Z | (open) | 159.9 | 52 | the first prompt |-| **all** | | | **159.9** | | |+| 1 | 2026-11-09T00:22:00Z | (open) | 160.0 | 52 | the first prompt |+| **all** | | | **160.0** | | | ## Per step @@ -22,6 +22,7 @@ AI time only, the idle cut out. | intake | 7.0 | 6.8 | 0.1 | 5 | 0 | 0 | 5.8 min | | placement | 32.2 | 12.4 | 19.8 | 64 | 4 | 2 | 4.2 min | | routing | 65.0 | 5.5 | 59.5 | 17 | 4 | 0 | 3.7 min |+| pours | 0.1 | 0.0 | 0.1 | 1 | 1 | 0 | 0.0 min | | capture | 0.0 | 0.0 | 0.0 | 1 | 0 | 0 | 0.0 min | | components | 1.0 | 0.1 | 0.9 | 3 | 1 | 0 | 0.1 min | | design | 8.6 | 8.6 | 0.0 | 3 | 0 | 0 | 8.6 min |@@ -36,8 +37,8 @@ AI time only, the idle cut out. | simulation | 13.6 | 13.6 | 0.0 | 4 | 0 | 0 | 12.8 min | | sourcing | 4.5 | 4.5 | 0.0 | 7 | 0 | 0 | 4.5 min | | test-plan | 1.3 | 1.3 | 0.0 | 3 | 0 | 0 | 1.3 min |-| thermal-vias | 0.0 | 0.0 | 0.0 | 1 | 1 | 0 | 0.0 min |-| **total** | **159.9** | **75.3** | **84.6** | | | | |+| thermal-vias | 0.1 | 0.0 | 0.1 | 3 | 1 | 0 | 0.0 min |+| **total** | **160.0** | **75.3** | **84.7** | | | | | ## Returns to earlier steps @@ -57,6 +58,7 @@ AI time only, the idle cut out. - 2026-11-09T03:24:18Z clip-start:routing-3 - 2026-11-09T03:32:06Z clip-start:schematic-1 - 2026-11-09T03:53:42Z clip-start:thermal-vias-1+- 2026-11-09T03:53:49Z clip-start:pours-1 ## Where the board stands @@ -219,12 +221,32 @@ Why the AI came back here: STM32 matrix pins re-assigned by side so each column/ What this step does: Heatsink vias where the heat is: for every part that dissipates real power (the regulator, the inductor, the catch diode, the FETs), an array of vias in its thermal pad or the copper it dumps heat into, stitched to the ground or the plane on the other side, sized and counted from its dissipation; the AI reviews the plan and the binary lands it. -**Clip: thermal-vias, still recording (started 2026-11-09T03:53:42Z); it appears here when the step ends.**+**Clip: thermal-vias, the PCB editor from 2026-11-09T03:53:42Z to 2026-11-09T03:53:45Z. Motion only: 0.1 min of real time, 2 s of it had something moving; the clock in the corner is the real elapsed time.**++<video width="100%" controls><source src="/blob/app/65-keyboard/docs/runs/65-keyboard-claude-opus-5-5-20261109-0022/thermal-vias-1.mp4" type="video/mp4"></video>++**Contact sheet: nine frames spread through the thermal-vias clip, what the camera saw.**++ **Screenshot: the board when thermal-vias began.**  +**Screenshot: the board when thermal-vias ended.**++++### pours++What this step does: pour every net the spec names, keepouts along Kelvin taps, thermal and stitching vias, land, measure the copper kept++**Clip: pours, still recording (started 2026-11-09T03:53:49Z); it appears here when the step ends.**++**Screenshot: the board when pours began.**+++ ## Plan usage, the second cost line Percent of each plan limit used, as the provider reports it, at the start of the run and at its end.
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