by adom
0805 MLCC · 100 nF ±10% X7R · 50 V
3D Model
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Contents
README
markdown100 nF Capacitor 0805 - Samsung CL21B104KBCNFNC
Samsung Electro-Mechanics CL21B104KBCNFNC: 0805 MLCC, 100 nF ±10% X7R, 50 V. An Adom Basic Part: Adom keeps it on reels for its pick-and-place line, so boards built with it draw on Adom stock.
Key specs
| Spec | Datasheet |
|---|---|
| 0805 multilayer ceramic chip capacitor, 2.00 × 1.25 × 0.85 mm body (±0.10 mm), 0.50 mm termination bands; Ni inner electrodes, Cu termination, 100% Sn Pb-free plating | p.1 |
| 100 nF ±10%, rated 50 V, X7R (Class II) dielectric, code B | p.1 |
| X7R temperature characteristic: capacitance change within ±15% from −55 to +125 °C | p.2 |
| Part-number position 9 is code F, Samsung's Product for POWER application build of the CL21 series | p.1 |
| Dissipation factor 0.025 max at 1 kHz / 1.0 Vrms; insulation resistance 10,000 MΩ or 500 MΩ·µF, whichever is smaller | p.2 |
| Withstands 250% of rated voltage with no dielectric or mechanical breakdown; high-temperature life test runs at 200% of rated voltage for 1,000 h | p.2 |
| Class II dielectric, capacitance changes with applied DC and AC voltage; the product manual requires designing against the DC-bias characteristic | p.11, p.14 |
| Reflow soldering rated to a 260 +0/−5 °C peak, 10 s max | p.2 |
| Cardboard (paper) carrier tape, 4 mm pitch, 4,000 pcs per 7-inch (φ178 mm) reel | p.1, p.4, p.5, p.7 |
| Store at 0-40 °C and ≤70% RH; solderability shelf life 6 months from delivery | p.33 |
Notes for designers
CL21B104KBCNFNC is Samsung's 0805 take on the most ordinary value in electronics: 100 nF, X7R, rated 50 V. (p.1) Two things set it apart from a generic 0805 0.1 µF. The body is the thin 0.85 mm C-thickness rather than the usual full-height brick, and position 9 of the part number is an F, Samsung's Product for POWER application build. (p.1)
The numbers you design against: ±10% initial tolerance, and X7R holds capacitance within ±15% from −55 to +125 °C. (p.1, p.2) Dissipation factor is specified at 0.025 max, four times tighter than the 0.1 limit on the high-capacitance X5R parts in this family, and insulation resistance is 10,000 MΩ or 500 MΩ·µF, whichever is smaller. The dielectric is proofed at 250% of rated voltage, and the high-temperature life test runs 1,000 h at 200% of rated voltage. (p.2)
It is still a Class II ceramic, so capacitance moves with applied DC and AC voltage, the product manual tells you to check the bias characteristic in-circuit rather than trust the label value. (p.14) Reflow is rated to a 260 +0/−5 °C peak for no more than 10 s, (p.2) and it ships on 4 mm-pitch cardboard tape, 4,000 to a 7-inch reel. (p.4)
Footprint
Redrawn from the datasheet land pattern (the previous pads were off by up to 0.476 mm).
Source: Land pattern from Samsung MLCC Product Manual, section 5-4 Land dimension (Reflow Footprint), p.32 (5-4 Land dimension, Reflow Footprint).
| mm | Datasheet | KiCad standard (C_0805_2012Metric) | Previous | This page |
|---|---|---|---|---|
| Pad length (along the part) | 0.75 to 0.8 | 1 | 1.05 | 0.775 |
| Pad width | 1.25 to 1.3 | 1.45 | 1.38 | 1.275 |
| Gap between pads | 0.7 to 0.75 | 0.9 | 0.726 | 0.725 |
| Centre to centre | 1.45 to 1.55 | 1.9 | 1.776 | 1.5 |
| Overall | 2.2 to 2.35 | 2.9 | 2.826 | 2.275 |
| Corner radius | not specified | 0.25 (ratio 0.25) | 0.1313 (ratio 0.125) | square (as drawn) |
| Corners: square, as the datasheet draws them. The datasheet does not call for rounded corners, so the footprint does not add any. |
Chip outline
The part's 3D outline in the standard pose (pad 1 toward the viewer), drawn from the STEP by Adom's OpenCascade service; the part number sits where the laser-etched mark is on the 3D model and reads the same way.
Symbol options
The default symbol, CL21B104KBCNFNC.kicad_sym (the one in the Symbol & Footprint panel), is the plain standard symbol. CL21B104KBCNFNC-outline.kicad_sym is the same symbol with the part's 3D chip outline drawn beside it, its part number placed and reading as on the 3D model.
Ordering
| MPN | CL21B104KBCNFNC |
| Manufacturer | Samsung Electro-Mechanics |
| Adom stock | Adom Basic Part, stocked on reels for Adom's pick-and-place line; reel counts on pnp-inventory |
| Other sources | adom-parts-search compares Mouser, DigiKey and JLCPCB |
Downloads
| File | What it is |
|---|---|
| CL21B104KBCNFNC.kicad_sym | KiCad symbol (standard symbol, the page default) |
| CL21B104KBCNFNC-outline.kicad_sym | KiCad symbol with the 3D chip outline |
| CL21B104KBCNFNC.kicad_mod | KiCad footprint (datasheet land pattern) |
| CL21B104KBCNFNC.step | 3D STEP with the part number laser-etched (default) |
| CL21B104KBCNFNC-unetched.step | 3D STEP, bare (no mark) |
| CL21B104KBCNFNC.glb | 3D GLB of the etched model (board use) |
| CL21B104KBCNFNC-unetched.glb | 3D GLB, bare |
| CL21B104KBCNFNC.lbr | Fusion 360 / EAGLE library |
| CL21B104KBCNFNC.adom-lbr.json | adom-lbr part (converts to Altium, KiCad, EAGLE) |
| CL21B104KBCNFNC-datasheet.pdf | Datasheet (release asset) |
Provenance
- Datasheet: SPECIFICATION (Reference sheet), per-MPN Samsung MLCC spec sheets (pages 4-36 of the full docs are the generic 'MLCC Product Manual' annex), revised No version/revision number printed in any of the 8 docs. Only in-body date: 'Product specifications included in the specifications are effective as of March 1, 2013.' (page 2 of all 8 docs)., Samsung Electro-Mechanics.
md5 85e70f1e33e415a7a24e0ae3d874fa7d - Footprint: Land pattern from Samsung MLCC Product Manual, section 5-4 Land dimension (Reflow Footprint), p.32 (5-4 Land dimension, Reflow Footprint). Pads redrawn on 2026-10-03.
- 3D model and symbol: unchanged by the footprint pass; the etched STEP adds a flat virtual part-number mark (an identification aid, not the maker's marking).
More
- Datasheet pages: the 36 datasheet pages as images.
- Assembly animation: the part dropping onto its pads, and Adom's pick-and-place picking it from tape.
Symbol & Footprint
Schematic Symbol
Open full view ↗PCB Footprint
Open full view ↗Datasheet
Datasheet (rendered from Markdown)
CL21B104KBCNFNC datasheet
SPECIFICATION (Reference sheet), per-MPN Samsung MLCC spec sheets (pages 4-36 of the full docs are the generic 'MLCC Product Manual' annex), revised No version/revision number printed in any of the 8 docs. Only in-body date: 'Product specifications included in the specifications are effective as of March 1, 2013.' (page 2 of all 8 docs)., Samsung Electro-Mechanics.
