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ae007 Project page: AFS_Adom rev A (Rice Eclipse AFS clean-room AI redesign): highlight reel and narrated process video with… cbe460e 7d ago

AFS_Adom full gallery

Every screenshot and plot from the project, grouped by area. Back to the project page.

The board

Top view of the AFS_Adom board in 3D Top face. Power on the left (XT30, TVS, shunt, the two bucks and their inductors), RP2350B in the middle, the sensor cluster to the right away from the inductors, microSD lower right, USB-C bottom centre.

Bottom view of the AFS_Adom board in 3D, showing the back-face silkscreen with header pinouts and the test point key Bottom face. This side is the service manual: every through-hole header and molecule contact is named, plus a key from test point to net and what the board is.

Close-up of the RP2350B QFN-80 with its decoupling capacitors and the 12 MHz crystal The RP2350B (QFN-80, 0.4 mm pitch) with its decoupling ring, the 12 MHz crystal and the core regulator inductor.

Side profile of the board showing component heights and the gold machine pins Side profile: the tallest parts are the XT30 and the 220 uF servo-rail capacitors. The gold pins at each end are the Adom molecule machine pins.

Layout

The full PCB layout in the KiCad PCB editor The routed board in KiCad's PCB editor: 4 layers, 2190 track segments, 508 vias.

The servo rail net highlighted in KiCad: a wide copper band along the top edge feeding all eight servo headers The servo rail (VBAT) lit as one net: a 2 mm band on both outer layers feeds all eight headers through the current shunt.

The VSYS net highlighted: the ideal-diode output feeding both buck converters VSYS, the ideal-diode output, feeding both bucks. It was widened twice after the field solve found narrow spots.

The ground net highlighted: outer-layer pours plus the stitching vias Ground: pours on both outer layers, a solid inner plane and 42 stitching vias the field solve showed were needed.

The RP2350B section of the schematic Part of the MCU sheet, one of 7 schematic sheets. The full schematic is in the PDF below.

Current and heat (Adom Fields, simulated)

Adom Fields heat view: heat flow in the copper with each hot part labelled with its temperature rise Heat flow in the copper with each hot part's rise: both bucks about +27 C, the shunt +25 C, the ideal-diode FET +23 C, the RP2350 +19 C, in still air.

Adom Fields 3D current view: current density in every layer, stacked Current density in all four layers, exploded. Every loaded net stays under the 60 A/mm2 screen; the worst is 59 A/mm2 on VSYS.

Adom Fields temperature map of the whole board Temperature over the board in still air.

Current density drawn per layer with a colour scale and a per-net table The AI's own current-density drawing from the solve, per layer, with the net table.

Simulation (ngspice, own models)

Power-path simulation: the battery unplugged at 30 ms and replugged at 60 ms with USB present; the 3.3 V rail does not move Battery unplugged and replugged with USB present. VSYS dips to 4.8 V and 3.3 V does not move, so the MCU does not reset.

Servo stall simulation: an 8 A, 20 ms pulse through the shunt An 8 A all-servo stall through the 5 mOhm shunt. The rail droops 0.77 V, and the INA219 input peaks at 45 mV, inside its 80 mV range.

3.3 V buck simulation at 7.4 V input with a 0.5 A load step The 3.3 V buck at 7.4 V in: 3 mVpp ripple and a 36 mV dip on a 0.5 A step. This is a behavioural model, not the vendor's.