LW A6SG-V2BA-FK0PN0
Public Unreviewedby adonis
ams OSRAM Standard LEDs - SMD, White SIDELED®, side-emitting. Datasheet-verified pinout, KiCad symbol/footprint/3D.
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1mo ago
LW A6SG-V2BA-FK0PN0
ams OSRAM · Standard LEDs - SMD, White SIDELED® · SIDELED®
A white, side-emitting SIDELED® from ams OSRAM: light leaves through the domed lens on one vertical face, parallel to the board, rather than upward. ThinGaN chip, diffused silicone resin, 120° Lambertian, binned to Cx = Cy = 0.33 and 900–2240 mcd at 20 mA. Ordering code Q65113A1198.
Pinout, land pattern and body dimensions are read off the manufacturer datasheet; the symbol, footprint and 3D model are generated from those numbers.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode. On this footprint - a view looking DOWN at the board - the cathode is the RIGHT-hand pad when the lens faces up the page. The datasheet's front view (p.14) labels the LEFT lead 'Cathode', but a front view and a top view see the lead axis from opposite sides. The vendor CAD settles it: the cathode marking on the top face sits over this pad. Return LED current here. |
| 2 | A | passive | Anode. Drive at IF = 20 mA typical, 5 mA min to 50 mA max (p.3). VF is 2.90 V min / 3.00 V typ / 3.50 V max at 20 mA (p.4), so size the series resistor from VF max, not typ. Never connect to a fixed supply without current limiting. |
Pin 1 is the cathode, and on this footprint it is the RIGHT-hand pad when the lens points up the page. The datasheet's front view (p.14) labels the left lead "Cathode", but a front view looks at the part from the lens side while a footprint looks down at the board — the two see the lead axis from opposite sides, so the cathode swaps ends between them. The vendor CAD is unambiguous: the cathode marking on the top face has no mirror partner and sits over the +X pad. The footprint repeats it as a filled silkscreen triangle behind that pad.
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | ams OSRAM |
| Package | SIDELED®, 2-lead gull-wing, side-emitting |
| Category | LED |
| Pins | 2 |
| Colour | White, Cx = 0.33 / Cy = 0.33 (CIE 1931) |
| Luminous intensity | 900 … 2240 mcd at IF = 20 mA |
| Forward voltage | 3.00 V typ, 3.50 V max at IF = 20 mA |
| Forward current | 20 mA typ, 50 mA max (5 mA min) |
| Viewing angle | 120° (2φ at 50 % IV) |
| Body size | 4.00 × 3.765 × 4.025 mm overall |
| Optical axis | 2.575 mm above the board |
Electrical and optical
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions |
|---|---|---|---|---|---|---|
| Forward voltage | VF | 2.90 | 3.00 | 3.50 | V | IF = 20 mA (p.4) |
| Forward current | IF | 5 | 20 | 50 | mA | TS = 25 °C (p.3) |
| Surge current | IFS | — | — | 300 | mA | t ≤ 10 µs, D = 0.005 (p.3) |
| Reverse voltage | VR | — | — | 5 | V | TS = 25 °C (p.3) |
| Reverse current | IR | — | 0.01 | 10 | µA | VR = 5 V (p.4) |
| Luminous intensity | IV | 900 | — | 2240 | mcd | IF = 20 mA, bins V2…BA (p.2, p.5) |
| Chromaticity | Cx / Cy | — | 0.33 / 0.33 | — | — | CIE 1931, bin group FK0PN0 (p.4) |
| Thermal resistance | RthJS | — | — | 220 | K/W | junction to solder point, real (p.4) |
| Thermal resistance | RthJA | — | — | 380 | K/W | junction to ambient, real (p.4) |
| Junction temperature | Tj | — | — | 125 | °C | p.3 |
| Operating temperature | Top | -40 | — | 110 | °C | p.3 |
Brightness bins for this ordering code: V2 (900–1120 mcd), AA (1120–1400), AB (1400–1800), BA (1800–2240), all at IF = 20 mA (p.5). Chromaticity bin group FK0…PN0 (p.6–8). MSL 2 per JEDEC J-STD-020E, reflow peak 245 °C (p.16). ESD 2 kV HBM Class 2. Corrosion robustness class 1B. Approximate weight 67.0 mg.
Land pattern
From the datasheet's Recommended Solder Pad drawing (p.15):
| Value | |
|---|---|
| Pads | 2 × SMD roundrect, 1.20 × 3.00 mm |
| Outer span | 3.70 mm (pads centred at x = ±1.25 mm) |
| Pin 1 (cathode) | +X pad, i.e. right-hand when the lens points up the page |
| Copper area | > 16 mm² per pad recommended for heat dissipation |
| Body vs land | lens face 2.225 mm in front of the pad centreline, back face 1.540 mm behind |
Lead spacing on the part is 2.54 mm (p.14) while the recommended land is drawn on a 2.50 mm pitch — the 0.04 mm difference sits well inside the 1.2 mm pad for a 1.0 mm lead, and the footprint follows the manufacturer's land drawing.
The datasheet asks for a nitrogen reflow atmosphere for best joint quality, and the package is not suitable for ultrasonic cleaning (p.15).
CAD
- Symbol
LW_A6SG-V2BA-FK0PN0— standard 2-pin LED, pin 1 K / pin 2 A. - Footprint
LED_SIDELED_LW-A6SG— emission direction is −Y, marked with an arrow and the Ø2.4 mm lens window on F.Fab; pin 1 is the +X pad. - 3D
lw-a6sg-v2ba-fk0pn0.step(+ GLB) — the official ams OSRAM geometry, 4.00 × 3.765 × 4.025 mm, origin on the land pattern, part sitting on Z = 0. - EAGLE
lw-a6sg-v2ba-fk0pn0.lbr— same package, symbol and device set.
Provenance
Everything here is traceable to the manufacturer datasheet rather than a distributor listing:
Datasheet: ams OSRAM, LW A6SG binning FK0PN0, v1.1, 2020-06-01 (25 pp, sha256
93722427bd3f7bbb, retrieved 2026-08-27)Pins and electricals: read from pp. 2–6 and 14–16; every row above cites its page.
Land pattern: p.15 Recommended Solder Pad, used as drawn.
3D model and body outline: the official ams OSRAM geometry file
LW_A6SG_20091210_geometry.STEP, kept in this repo unmodified. The shippedlw-a6sg-v2ba-fk0pn0.stepis that file moved into KiCad coordinates by a rigid rotation and translation only — no geometry is regenerated:x = -Xo y = Zo + 2.225 z = Yo + 2.575det = +1, so no mirroring.
tools/place_step.pyperforms it and pins the representation's own datum axis to identity so every reader agrees on where the part sits. The offsets come from the vendor model itself: the foot's flat contact runs Zo = −3.475 … −0.975 (centre −2.225) and its underside is at Yo = −2.575.
The vendor CAD also corrects two things a reading of the drawings alone gets wrong:
- Polarity. See the pinout note above — the cathode is the +X pad on the footprint, not the −X pad that the front view suggests.
- There is no 0.80 mm standoff. The (0.8) in the side view is the gull-wing rise, not a gap under the body: the body underside sits 0.055 mm off the board, the optical axis is 2.575 mm up, and the package is 4.025 mm tall overall.
3D footprint reference
The page's 3D model is lw-a6sg-v2ba-fk0pn0-hero-footprint.glb: the part plus nonphysical reference artwork on
the seating plane, the same contract the Adom basic-part heroes use. Copper pad boundaries are
teal dashed outlines at 50% opacity, silkscreen at 30%, and each pad carries its signal name (K, A) at 50%.
The part body sits over its own pads, so orbit underneath to see the outlines. Each group is a
layer in the viewer's Layers panel; geometry and hashes are in lw-a6sg-v2ba-fk0pn0-hero-footprint.overlay.json.
The artwork is hero-only. For board assemblies use lw-a6sg-v2ba-fk0pn0.glb or the STEP, which carry none of it.
Sourcing
| Distributor | Part number | Note |
|---|---|---|
| Mouser | 720-LWA6SGA1366 | LW A6SG-V2BA-FK0PN0 |
| Mouser | 720-LWA6SGA1198 | LW A6SG-V2BA-FK0PN0-0-20-R33 (taped) |
| DigiKey | 475-LWA6SG-V2BA-FK0PN0-0-20-R33TR-ND | taped variant, in stock |
The bare LW A6SG-V2BA-FK0PN0 ordering code is marked obsolete / not recommended for new
designs; the -0-20-R33 tape-and-reel variant is the one still stocked. Check
availability before committing a design.
Solder balls
The footprint carries the Adom solder-ball layer (KiCad User.9, named Adom.SolderBalls;
EAGLE/Fusion layer 101 SolderBalls): 88 balls, 44 on each 1.20 x 3.00 mm pad, jetted 300 um balls at 0.25 mm pitch per john/adom-solder-ball-layer-standard.
Positions are listed per pad in lw-a6sg-v2ba-fk0pn0.solder-balls.json. The GLB carries them as a solder_top layer that is hidden by default; switch on Solder balls in the 3D viewer's layers panel.
# LW A6SG-V2BA-FK0PN0
**ams OSRAM** · Standard LEDs - SMD, White SIDELED® · SIDELED®
A white, side-emitting SIDELED® from ams OSRAM: light leaves through the domed
lens on one *vertical* face, parallel to the board, rather than upward. ThinGaN
chip, diffused silicone resin, 120° Lambertian, binned to Cx = Cy = 0.33 and
900–2240 mcd at 20 mA. Ordering code Q65113A1198.
Pinout, land pattern and body dimensions are read off the manufacturer
datasheet; the symbol, footprint and 3D model are generated from those numbers.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode. On this footprint - a view looking DOWN at the board - the cathode is the RIGHT-hand pad when the lens faces up the page. The datasheet's front view (p.14) labels the LEFT lead 'Cathode', but a front view and a top view see the lead axis from opposite sides. The vendor CAD settles it: the cathode marking on the top face sits over this pad. Return LED current here. |
| 2 | A | passive | Anode. Drive at IF = 20 mA typical, 5 mA min to 50 mA max (p.3). VF is 2.90 V min / 3.00 V typ / 3.50 V max at 20 mA (p.4), so size the series resistor from VF max, not typ. Never connect to a fixed supply without current limiting. |
**Pin 1 is the cathode, and on this footprint it is the RIGHT-hand pad when the
lens points up the page.** The datasheet's front view (p.14) labels the *left*
lead "Cathode", but a front view looks at the part from the lens side while a
footprint looks down at the board — the two see the lead axis from opposite
sides, so the cathode swaps ends between them. The vendor CAD is unambiguous:
the cathode marking on the top face has no mirror partner and sits over the +X
pad. The footprint repeats it as a filled silkscreen triangle behind that pad.
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | ams OSRAM |
| Package | SIDELED®, 2-lead gull-wing, side-emitting |
| Category | LED |
| Pins | 2 |
| Colour | White, Cx = 0.33 / Cy = 0.33 (CIE 1931) |
| Luminous intensity | 900 … 2240 mcd at IF = 20 mA |
| Forward voltage | 3.00 V typ, 3.50 V max at IF = 20 mA |
| Forward current | 20 mA typ, 50 mA max (5 mA min) |
| Viewing angle | 120° (2φ at 50 % IV) |
| Body size | 4.00 × 3.765 × 4.025 mm overall |
| Optical axis | 2.575 mm above the board |
## Electrical and optical
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions |
|---|---|---|---|---|---|---|
| Forward voltage | VF | 2.90 | 3.00 | 3.50 | V | IF = 20 mA (p.4) |
| Forward current | IF | 5 | 20 | 50 | mA | TS = 25 °C (p.3) |
| Surge current | IFS | — | — | 300 | mA | t ≤ 10 µs, D = 0.005 (p.3) |
| Reverse voltage | VR | — | — | 5 | V | TS = 25 °C (p.3) |
| Reverse current | IR | — | 0.01 | 10 | µA | VR = 5 V (p.4) |
| Luminous intensity | IV | 900 | — | 2240 | mcd | IF = 20 mA, bins V2…BA (p.2, p.5) |
| Chromaticity | Cx / Cy | — | 0.33 / 0.33 | — | — | CIE 1931, bin group FK0PN0 (p.4) |
| Thermal resistance | RthJS | — | — | 220 | K/W | junction to solder point, real (p.4) |
| Thermal resistance | RthJA | — | — | 380 | K/W | junction to ambient, real (p.4) |
| Junction temperature | Tj | — | — | 125 | °C | p.3 |
| Operating temperature | Top | -40 | — | 110 | °C | p.3 |
Brightness bins for this ordering code: V2 (900–1120 mcd), AA (1120–1400),
AB (1400–1800), BA (1800–2240), all at IF = 20 mA (p.5). Chromaticity bin
group FK0…PN0 (p.6–8). MSL 2 per JEDEC J-STD-020E, reflow peak 245 °C
(p.16). ESD 2 kV HBM Class 2. Corrosion robustness class 1B. Approximate
weight 67.0 mg.
## Land pattern
From the datasheet's *Recommended Solder Pad* drawing (p.15):
| | Value |
|---|---|
| Pads | 2 × SMD roundrect, 1.20 × 3.00 mm |
| Outer span | 3.70 mm (pads centred at x = ±1.25 mm) |
| Pin 1 (cathode) | +X pad, i.e. right-hand when the lens points up the page |
| Copper area | > 16 mm² per pad recommended for heat dissipation |
| Body vs land | lens face 2.225 mm in front of the pad centreline, back face 1.540 mm behind |
Lead spacing on the part is 2.54 mm (p.14) while the recommended land is drawn
on a 2.50 mm pitch — the 0.04 mm difference sits well inside the 1.2 mm pad for
a 1.0 mm lead, and the footprint follows the manufacturer's land drawing.
The datasheet asks for a nitrogen reflow atmosphere for best joint quality, and
the package is **not** suitable for ultrasonic cleaning (p.15).
## CAD
- **Symbol** `LW_A6SG-V2BA-FK0PN0` — standard 2-pin LED, pin 1 K / pin 2 A.
- **Footprint** `LED_SIDELED_LW-A6SG` — emission direction is **−Y**, marked with an arrow
and the Ø2.4 mm lens window on F.Fab; pin 1 is the +X pad.
- **3D** `lw-a6sg-v2ba-fk0pn0.step` (+ GLB) — the official ams OSRAM geometry, 4.00 ×
3.765 × 4.025 mm, origin on the land pattern, part sitting on Z = 0.
- **EAGLE** `lw-a6sg-v2ba-fk0pn0.lbr` — same package, symbol and device set.
## Provenance
Everything here is traceable to the manufacturer datasheet rather than a
distributor listing:
- **Datasheet:** [ams OSRAM, *LW A6SG binning FK0PN0*, v1.1, 2020-06-01](docs/lw-a6sg-v2ba-fk0pn0-datasheet.pdf)
(25 pp, sha256 `93722427bd3f7bbb`, retrieved 2026-08-27)
- **Pins and electricals:** read from pp. 2–6 and 14–16; every row above cites
its page.
- **Land pattern:** p.15 *Recommended Solder Pad*, used as drawn.
- **3D model and body outline:** the official ams OSRAM geometry file
`LW_A6SG_20091210_geometry.STEP`, kept in this repo unmodified. The shipped
`lw-a6sg-v2ba-fk0pn0.step` is that file moved into KiCad coordinates by a **rigid
rotation and translation only** — no geometry is regenerated:
```
x = -Xo y = Zo + 2.225 z = Yo + 2.575
```
det = +1, so no mirroring. `tools/place_step.py` performs it and pins the
representation's own datum axis to identity so every reader agrees on where
the part sits. The offsets come from the vendor model itself: the foot's flat
contact runs Zo = −3.475 … −0.975 (centre −2.225) and its underside is at
Yo = −2.575.
The vendor CAD also corrects two things a reading of the drawings alone gets
wrong:
1. **Polarity.** See the pinout note above — the cathode is the +X pad on the
footprint, not the −X pad that the front view suggests.
2. **There is no 0.80 mm standoff.** The (0.8) in the side view is the
gull-wing rise, not a gap under the body: the body underside sits 0.055 mm
off the board, the optical axis is 2.575 mm up, and the package is 4.025 mm
tall overall.
## 3D footprint reference
The page's 3D model is `lw-a6sg-v2ba-fk0pn0-hero-footprint.glb`: the part plus nonphysical reference artwork on
the seating plane, the same contract the Adom basic-part heroes use. Copper pad boundaries are
teal dashed outlines at 50% opacity, silkscreen at 30%, and each pad carries its signal name (K, A) at 50%.
The part body sits over its own pads, so orbit underneath to see the outlines. Each group is a
layer in the viewer's Layers panel; geometry and hashes are in `lw-a6sg-v2ba-fk0pn0-hero-footprint.overlay.json`.
The artwork is hero-only. For board assemblies use `lw-a6sg-v2ba-fk0pn0.glb` or the STEP, which carry none of it.
## Sourcing
| Distributor | Part number | Note |
|---|---|---|
| Mouser | 720-LWA6SGA1366 | LW A6SG-V2BA-FK0PN0 |
| Mouser | 720-LWA6SGA1198 | LW A6SG-V2BA-FK0PN0-0-20-R33 (taped) |
| DigiKey | 475-LWA6SG-V2BA-FK0PN0-0-20-R33TR-ND | taped variant, in stock |
The bare `LW A6SG-V2BA-FK0PN0` ordering code is marked **obsolete / not recommended for new
designs**; the `-0-20-R33` tape-and-reel variant is the one still stocked. Check
availability before committing a design.
[Datasheet PDF](docs/lw-a6sg-v2ba-fk0pn0-datasheet.pdf)
## Solder balls
The footprint carries the Adom solder-ball layer (KiCad `User.9`, named `Adom.SolderBalls`;
EAGLE/Fusion layer 101 `SolderBalls`): 88 balls, 44 on each 1.20 x 3.00 mm pad, jetted 300 um balls at 0.25 mm pitch per [john/adom-solder-ball-layer-standard](https://wiki.adom.inc/john/adom-solder-ball-layer-standard).
Positions are listed per pad in `lw-a6sg-v2ba-fk0pn0.solder-balls.json`. The GLB carries them as a `solder_top` layer that is hidden by default; switch on *Solder balls* in the 3D viewer's layers panel.