LW A6SG-V2BA-FK0PN0
Public Unreviewedby adonis
ams OSRAM Standard LEDs - SMD, White SIDELED®, side-emitting. Datasheet-verified pinout, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
Open full view ↗PCB Footprint
Open full view ↗Datasheet
Open in new tab ↗README
markdownLW A6SG-V2BA-FK0PN0
ams OSRAM · Standard LEDs - SMD, White SIDELED® · SIDELED®
A white, side-emitting SIDELED® from ams OSRAM: light leaves through the domed lens on one vertical face, parallel to the board, rather than upward. ThinGaN chip, diffused silicone resin, 120° Lambertian, binned to Cx = Cy = 0.33 and 900–2240 mcd at 20 mA. Ordering code Q65113A1198.
Pinout, land pattern and body dimensions are read off the manufacturer datasheet; the symbol, footprint and 3D model are generated from those numbers.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode. On this footprint - a view looking DOWN at the board - the cathode is the RIGHT-hand pad when the lens faces up the page. The datasheet's front view (p.14) labels the LEFT lead 'Cathode', but a front view and a top view see the lead axis from opposite sides. The vendor CAD settles it: the cathode marking on the top face sits over this pad. Return LED current here. |
| 2 | A | passive | Anode. Drive at IF = 20 mA typical, 5 mA min to 50 mA max (p.3). VF is 2.90 V min / 3.00 V typ / 3.50 V max at 20 mA (p.4), so size the series resistor from VF max, not typ. Never connect to a fixed supply without current limiting. |
Pin 1 is the cathode, and on this footprint it is the RIGHT-hand pad when the lens points up the page. The datasheet's front view (p.14) labels the left lead "Cathode", but a front view looks at the part from the lens side while a footprint looks down at the board — the two see the lead axis from opposite sides, so the cathode swaps ends between them. The vendor CAD is unambiguous: the cathode marking on the top face has no mirror partner and sits over the +X pad. The footprint repeats it as a filled silkscreen triangle behind that pad.
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | ams OSRAM |
| Package | SIDELED®, 2-lead gull-wing, side-emitting |
| Category | LED |
| Pins | 2 |
| Colour | White, Cx = 0.33 / Cy = 0.33 (CIE 1931) |
| Luminous intensity | 900 … 2240 mcd at IF = 20 mA |
| Forward voltage | 3.00 V typ, 3.50 V max at IF = 20 mA |
| Forward current | 20 mA typ, 50 mA max (5 mA min) |
| Viewing angle | 120° (2φ at 50 % IV) |
| Body size | 4.00 × 3.765 × 4.025 mm overall |
| Optical axis | 2.575 mm above the board |
Electrical and optical
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions |
|---|---|---|---|---|---|---|
| Forward voltage | VF | 2.90 | 3.00 | 3.50 | V | IF = 20 mA (p.4) |
| Forward current | IF | 5 | 20 | 50 | mA | TS = 25 °C (p.3) |
| Surge current | IFS | — | — | 300 | mA | t ≤ 10 µs, D = 0.005 (p.3) |
| Reverse voltage | VR | — | — | 5 | V | TS = 25 °C (p.3) |
| Reverse current | IR | — | 0.01 | 10 | µA | VR = 5 V (p.4) |
| Luminous intensity | IV | 900 | — | 2240 | mcd | IF = 20 mA, bins V2…BA (p.2, p.5) |
| Chromaticity | Cx / Cy | — | 0.33 / 0.33 | — | — | CIE 1931, bin group FK0PN0 (p.4) |
| Thermal resistance | RthJS | — | — | 220 | K/W | junction to solder point, real (p.4) |
| Thermal resistance | RthJA | — | — | 380 | K/W | junction to ambient, real (p.4) |
| Junction temperature | Tj | — | — | 125 | °C | p.3 |
| Operating temperature | Top | -40 | — | 110 | °C | p.3 |
Brightness bins for this ordering code: V2 (900–1120 mcd), AA (1120–1400), AB (1400–1800), BA (1800–2240), all at IF = 20 mA (p.5). Chromaticity bin group FK0…PN0 (p.6–8). MSL 2 per JEDEC J-STD-020E, reflow peak 245 °C (p.16). ESD 2 kV HBM Class 2. Corrosion robustness class 1B. Approximate weight 67.0 mg.
Land pattern
From the datasheet's Recommended Solder Pad drawing (p.15):
| Value | |
|---|---|
| Pads | 2 × SMD roundrect, 1.20 × 3.00 mm |
| Outer span | 3.70 mm (pads centred at x = ±1.25 mm) |
| Pin 1 (cathode) | +X pad, i.e. right-hand when the lens points up the page |
| Copper area | > 16 mm² per pad recommended for heat dissipation |
| Body vs land | lens face 2.225 mm in front of the pad centreline, back face 1.540 mm behind |
Lead spacing on the part is 2.54 mm (p.14) while the recommended land is drawn on a 2.50 mm pitch — the 0.04 mm difference sits well inside the 1.2 mm pad for a 1.0 mm lead, and the footprint follows the manufacturer's land drawing.
The datasheet asks for a nitrogen reflow atmosphere for best joint quality, and the package is not suitable for ultrasonic cleaning (p.15).
CAD
- Symbol
LW_A6SG-V2BA-FK0PN0— standard 2-pin LED, pin 1 K / pin 2 A. - Footprint
LED_SIDELED_LW-A6SG— emission direction is −Y, marked with an arrow and the Ø2.4 mm lens window on F.Fab; pin 1 is the +X pad. - 3D
lw-a6sg-v2ba-fk0pn0.step(+ GLB) — the official ams OSRAM geometry, 4.00 × 3.765 × 4.025 mm, origin on the land pattern, part sitting on Z = 0. - EAGLE
lw-a6sg-v2ba-fk0pn0.lbr— same package, symbol and device set.
Provenance
Everything here is traceable to the manufacturer datasheet rather than a distributor listing:
Datasheet: ams OSRAM, LW A6SG binning FK0PN0, v1.1, 2020-06-01 (25 pp, sha256
93722427bd3f7bbb, retrieved 2026-08-27)Pins and electricals: read from pp. 2–6 and 14–16; every row above cites its page.
Land pattern: p.15 Recommended Solder Pad, used as drawn.
3D model and body outline: the official ams OSRAM geometry file
LW_A6SG_20091210_geometry.STEP, kept in this repo unmodified. The shippedlw-a6sg-v2ba-fk0pn0.stepis that file moved into KiCad coordinates by a rigid rotation and translation only — no geometry is regenerated:x = -Xo y = Zo + 2.225 z = Yo + 2.575det = +1, so no mirroring.
tools/place_step.pyperforms it and pins the representation's own datum axis to identity so every reader agrees on where the part sits. The offsets come from the vendor model itself: the foot's flat contact runs Zo = −3.475 … −0.975 (centre −2.225) and its underside is at Yo = −2.575.
The vendor CAD also corrects two things a reading of the drawings alone gets wrong:
- Polarity. See the pinout note above — the cathode is the +X pad on the footprint, not the −X pad that the front view suggests.
- There is no 0.80 mm standoff. The (0.8) in the side view is the gull-wing rise, not a gap under the body: the body underside sits 0.055 mm off the board, the optical axis is 2.575 mm up, and the package is 4.025 mm tall overall.
Sourcing
| Distributor | Part number | Note |
|---|---|---|
| Mouser | 720-LWA6SGA1366 | LW A6SG-V2BA-FK0PN0 |
| Mouser | 720-LWA6SGA1198 | LW A6SG-V2BA-FK0PN0-0-20-R33 (taped) |
| DigiKey | 475-LWA6SG-V2BA-FK0PN0-0-20-R33TR-ND | taped variant, in stock |
The bare LW A6SG-V2BA-FK0PN0 ordering code is marked obsolete / not recommended for new
designs; the -0-20-R33 tape-and-reel variant is the one still stocked. Check
availability before committing a design.