# ZXTN26070CV-7

**Diodes Incorporated** · Bipolar (BJT) · SOT-563

ZXTN26070CV-7 from Diodes Incorporated, in a SOT-563. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | C | passive | Collector, tied internally with pins 2, 5 and 6; the datasheet rates VCEO at 70V and continuous IC at 2A. |
| 2 | C | passive | Collector, tied internally with pins 1, 5 and 6; the datasheet rates VCBO at 150V and peak pulse ICM at 5A. |
| 3 | B | passive | Base; the datasheet rates VEBO at 7V and base current IB at 500mA. |
| 4 | E | passive | Emitter of the NPN transistor, as shown in the device schematic. |
| 5 | C | passive | Collector, tied internally with pins 1, 2 and 6; the datasheet gives VCE(sat) below 30mV at IC=100mA. |
| 6 | C | passive | Collector, tied internally with pins 1, 2 and 5; the datasheet rates total power dissipation at 0.6W to 1W depending on the PCB mounting. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Diodes Incorporated |
| Package | SOT-563 |
| Category | Transistors/Thyristors |
| Pins | 6 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Collector-Base Breakdown Voltage | BVCBO | 150 | 190 |  | V | IC = 100µA | 4 |
| Collector-Emitter Breakdown Voltage | BVCEO | 70 | 80 |  | V | IC = 10mA | 4 |
| Emitter-Base Breakdown Voltage | BVEBO | 7 | 8.3 |  | V | IE = 100µA | 4 |
| Collector-Base Cut Off Current | ICBO |  |  | 100 | nA | VCB = 60V , VCES = 60V | 4 |
| Collector-Emitter Cut Off Current | ICES |  |  | 100 | nA | VCB = 60V , VCES = 60V | 4 |
| Emitter Cut Off Current | IEBO |  |  | 100 | nA | VEB = 5.6V | 4 |
| DC Current Gain | hFE | 190 | 320 |  |  | IC = 10mA, VCE = 5V | 4 |
| DC Current Gain | hFE | 200 | 340 |  |  | IC = 100mA, VCE = 5V | 4 |
| DC Current Gain | hFE | 75 | 110 |  |  | IC = 2A, VCE = 5V | 4 |
| Collector-Emitter Saturation Voltage | VCE(sat) |  | 22 | 30 | mV | IC = 0.1A, IB = 10mA | 4 |
| Collector-Emitter Saturation Voltage | VCE(sat) |  | 110 | 150 | mV | IC = 0.5A, IB = 10mA | 4 |
| Collector-Emitter Saturation Voltage | VCE(sat) |  | 147 | 200 | mV | IC = 1A, IB = 50mA | 4 |
| Collector-Emitter Saturation Voltage | VCE(sat) |  | 135 | 165 | mV | IC = 1A, IB = 100mA | 4 |
| Collector-Emitter Saturation Voltage | VCE(sat) |  | 265 | 330 | mV | IC = 2A, IB = 200mA | 4 |
| Base-Emitter Turn-On Voltage | VBE(on) |  | 0.85 | 1 | V | IC = 1A, VCE = 2V | 4 |
| Base-Emitter Saturation Voltage | VBE(sat) |  | 0.9 | 1.1 | V | IC = 1A, IB = 50mA | 4 |
| Collector-Base Voltage | VCBO |  |  | 150 | V |  | 2 |
| Collector-Emitter Voltage | VCEO |  |  | 70 | V |  | 2 |
| Emitter-Base Voltage | VEBO |  |  | 7 | V |  | 2 |
| Continuous Collector Current | IC |  |  | 2 | A |  | 2 |
| Peak Pulse Collector Current | ICM |  |  | 5 | A | single pulse | 2 |
| Base Current | IB |  |  | 500 | mA |  | 2 |
| Total Power Dissipation | PD |  |  | 0.6 | W | Note 5: surface mounted, minimum recommended pad layout, still air | 2 |
| Total Power Dissipation | PD |  |  | 1 | W | Note 6: mounted on 25mm x 25mm x 1.6mm FR4 PCB, high coverage single sided 2 oz copper, still air | 2 |
| Thermal Resistance, Junction to Ambient | RθJA |  |  | 208 | °C/W | Note 5: surface mounted, minimum recommended pad layout, still air | 2 |
| Thermal Resistance, Junction to Ambient | RθJA |  |  | 121 | °C/W | Note 6: mounted on 25mm x 25mm x 1.6mm FR4 PCB, high coverage single sided 2 oz copper, still air | 2 |
| Thermal Resistance, Junction to Lead | RθJL |  |  | 37 | °C/W | Note 7: junction to solder-point at end of collector lead | 2 |
| Operating and Storage Temperature Range | TJ, TSTG | -55 |  | 150 | °C |  | 2 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts |  | tin | • Terminals: Finish, Matte Tin Plated Leads, Solderable per MIL-STD-202, Method 208 | 1 |

## CAD (KiCad official)

- Symbol: `ZXTN26070CV-7`
- Footprint: `Package_TO_SOT_SMD:SOT-563`
- 3D model: SOT-563 (KiCad packages3D, STEP)
- 3D model files: `zxtn26070cv-7-etched.step` / `zxtn26070cv-7-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `zxtn26070cv-7.step` / `zxtn26070cv-7.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Diodes Incorporated datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588912105911701504) (7 pp, sha256 `242a53cb00bd6f0e`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/zxtn26070cv-7-datasheet.pdf)