# ZXMN10A11KTC

**Diodes Incorporated** · MOSFETs · TO-252

ZXMN10A11KTC from Diodes Incorporated, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; gate-source voltage limited to ±20V absolute maximum, with threshold of 2V to 4V at ID = 250µA. |
| 2 | D | passive | Drain, also connected to the exposed tab; drain-source voltage is 100V maximum with 3.5A continuous drain current at VGS = 10V. |
| 3 | S | passive | Source; continuous body-diode source current is 8.4A maximum. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Diodes Incorporated |
| Package | TO-252 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source voltage | VDSS |  |  | 100 | V | TA = 25°C | 2 |
| Gate-Source voltage | VGS | -20 |  | 20 | V | TA = 25°C | 2 |
| Continuous Drain current | ID |  |  | 3.5 | A | VGS = 10V, Note 3, TA = 25°C | 2 |
| Continuous Drain current (Note 2) | ID |  |  | 2.4 | A | VGS = 10V, Note 2 | 2 |
| Pulsed Drain current | IDM |  |  | 9.9 | A | VGS = 10V, Note 4 | 2 |
| Continuous Source current (Body diode) | IS |  |  | 8.4 | A | Note 3 | 2 |
| Pulsed Source current (Body diode) | ISM |  |  | 9.9 | A | Note 4 | 2 |
| Power dissipation | PD |  |  | 4.06 | W | Note 2, TA = 25°C | 2 |
| Power dissipation | PD |  |  | 8.5 | W | Note 3, TA = 25°C | 2 |
| Power dissipation | PD |  |  | 2.11 | W | Note 6, TA = 25°C | 2 |
| Thermal Resistance, Junction to Ambient | RθJA |  |  | 30.8 | °C/W | Note 2 | 2 |
| Thermal Resistance, Junction to Ambient | RθJA |  |  | 14.7 | °C/W | Note 3 | 2 |
| Thermal Resistance, Junction to Ambient | RθJA |  |  | 59.1 | °C/W | Note 6 | 2 |
| Thermal Resistance, Junction to Lead | RθJL |  |  | 1.1 | °C/W | Note 5 | 2 |
| Operating and storage temperature range | TJ, TSTG | -55 |  | 150 | °C |  | 2 |
| Drain-Source Breakdown Voltage | BVDSS | 100 |  |  | V | ID = 250μA, VGS = 0V | 4 |
| Zero Gate Voltage Drain Current | IDSS |  |  | 1 | µA | VDS = 100V, VGS = 0V | 4 |
| Gate-Source Leakage | IGSS | -100 |  | 100 | nA | VGS = ±20V, VDS = 0V | 4 |
| Gate Threshold Voltage | VGS(th) | 2 |  | 4 | V | ID = 250μA, VDS = VGS | 4 |
| Static Drain-Source On-Resistance | RDS(ON) |  |  | 0.35 | Ω | VGS = 10V, ID = 2.6A | 4 |
| Static Drain-Source On-Resistance | RDS(ON) |  |  | 0.45 | Ω | VGS = 6V, ID = 1.3A | 4 |
| Forward Transconductance | gfs |  | 4 |  | S | VDS = 15V, ID = 2.6A | 4 |
| Diode Forward Voltage | VSD |  | 0.85 | 0.95 | V | IS = 1.85A, VGS = 0V | 4 |
| Reverse recovery time | trr |  | 26 |  | ns | IS = 1.0A, di/dt = 100A/μs | 4 |
| Reverse recovery charge | Qrr |  | 30 |  | nC | IS = 1.0A, di/dt = 100A/μs | 4 |
| Input Capacitance | Ciss |  | 274 |  | pF | VDS = 50V, VGS = 0V, f = 1MHz | 4 |
| Output Capacitance | Coss |  | 21 |  | pF | VDS = 50V, VGS = 0V, f = 1MHz | 4 |
| Reverse Transfer Capacitance | Crss |  | 11 |  | pF | VDS = 50V, VGS = 0V, f = 1MHz | 4 |
| Total Gate Charge | Qg |  | 3.5 |  | nC | VGS = 6V, VDS = 50V, ID = 2.5A | 4 |
| Total Gate Charge | Qg |  | 5.4 |  | nC | VGS = 10V, VDS = 50V, ID = 2.5A | 4 |
| Gate-Source Charge | Qgs |  | 1.4 |  | nC | VGS = 10V, VDS = 50V, ID = 2.5A | 4 |
| Gate-Drain Charge | Qgd |  | 1.5 |  | nC | VGS = 10V, VDS = 50V, ID = 2.5A | 4 |
| Turn-On Delay Time | tD(on) |  | 2.7 |  | ns | VDD = 50V, VGS = 10V, ID = 1.0A, RG ≅ 6Ω | 4 |
| Turn-On Rise Time | tr |  | 1.7 |  | ns | VDD = 50V, VGS = 10V, ID = 1.0A, RG ≅ 6Ω | 4 |
| Turn-Off Delay Time | tD(off) |  | 7.4 |  | ns | VDD = 50V, VGS = 10V, ID = 1.0A, RG ≅ 6Ω | 4 |
| Turn-Off Fall Time | tf |  | 3.5 |  | ns | VDD = 50V, VGS = 10V, ID = 1.0A, RG ≅ 6Ω | 4 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper | tin | • Terminal Connections: See Diagram • Terminals: Matte Tin Finish annealed over Copper leadframe. | 1 |

## CAD (KiCad official)

- Symbol: `ZXMN10A11KTC`
- Footprint: `Package_TO_SOT_SMD:TO-252-2`
- 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files: `zxmn10a11ktc-etched.step` / `zxmn10a11ktc-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `zxmn10a11ktc.step` / `zxmn10a11ktc.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Diodes Incorporated datasheet](https://www.diodes.com/assets/Datasheets/ZXMN10A11KTC.pdf) (8 pp, sha256 `b4b157247df866df`, retrieved 2026-10-27, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/zxmn10a11ktc-datasheet.pdf)