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ZXGD3113W6-7

Diodes Incorporated · Pre-ordered Chips · SOT-23-6

ZXGD3113W6-7 from Diodes Incorporated, in a SOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 REF input Reference pin connected to VCC via resistor RREF, which sets the source current into this pin (RREF ≈ (VCC - 0.7)/IREF, max IREF 25 mA).
2 BIAS input Bias pin connected to VCC via resistor RBIAS, which sets the source current into this pin (RBIAS ≈ (VCC - 0.5)/IBIAS, max IBIAS 100 mA).
3 VCC power_in Supply pin (3.5V to 40V range, 40 V absolute maximum) that should be decoupled closely to ground with a ceramic capacitor.
4 GATE output Gate drive pin that sources and sinks current to and from the synchronous MOSFET gate (peak source 1.5 A, peak sink 3 A absolute max).
5 GND power_in Ground reference point, connected to the synchronous MOSFET Source terminal.
6 DRAIN input Drain sense pin connected to the Drain of the synchronous MOSFET, with voltage range of -3 V to 160 V.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-23-6
Category Interface ICs
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage, Relative to GND VCC 40 V 3
Drain Pin Voltage VD -3 160 V 3
Gate Output Voltage VG -3 V -3 to VCC +3 3
Gate Driver Peak Source Current ISOURCE 1.5 A 3
Gate Driver Peak Sink Current ISINK 3 A 3
Reference Current IREF 25 mA 3
Bias Current IBIAS 100 mA 3
Power Dissipation PD 500 mW Note 5 3
Power Dissipation PD 731 mW Note 6 3
Power Dissipation PD 868 mW Note 7 3
Power Dissipation PD 1016 mW Note 8 3
Thermal Resistance, Junction to Ambient RθJA 250 °C/W Note 5 3
Thermal Resistance, Junction to Ambient RθJA 171 °C/W Note 6 3
Thermal Resistance, Junction to Ambient RθJA 144 °C/W Note 7 3
Thermal Resistance, Junction to Ambient RθJA 123 °C/W Note 8 3
Thermal Resistance, Junction to Lead RθJL 105 °C/W Note 9 3
Operating Temperature Range TJ -40 150 °C 3
Storage Temperature Range TSTG -55 150 °C 3
Quiescent Current IQ 6.2 mA VD ≥ 0V; VCC = 19V; RBIAS = 4.7kΩ; RREF = 8.2kΩ 4
Turn-Off Threshold Voltage VT -20 -10 0 mV VG = 1V 4
Gate Output Voltage (off) VG(OFF) 0 0.73 1 V VD ≥ 1V 4
Gate Output Voltage VG 12.5 13.8 V VD = -50mV (max printed as VCC) 4
Gate Output Voltage VG 17 17.8 V VD = -100mV (max printed as VCC) 4
Turn-On Propagation Delay tD(RISE) 250 ns CLOAD = 10nF 4
Turn-Off Propagation Delay tD(FALL) 27 ns CLOAD = 10nF 4
Gate Rise Time tR 187 ns From 10% of VG to 10V 4
Gate Rise Time tR 360 ns From 10% to 90% of VG 4
Gate Fall Time tF 210 ns From 90% to 10% of VG 4
Source Current ISOURCE 0.5 A Capacitive Load of 10nF 4
Sink Current ISINK 1.5 A Capacitive Load of 10nF 4

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin  Terminals: Matte Tin Finish, Solderable per MIL-STD-202, Method 208 1

CAD (KiCad official)

  • Symbol: ZXGD3113W6-7
  • Footprint: Package_TO_SOT_SMD:SOT-23-6
  • 3D model: SOT-23-6 (KiCad packages3D, STEP)
  • 3D model files: zxgd3113w6-7-etched.step / zxgd3113w6-7-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); zxgd3113w6-7.step / zxgd3113w6-7.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (8 pp, sha256 9669f4538b4820ad, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF