# ZX5605UC

**XCH(旭昌辉)** · IC · SOT-563

ZX5605UC from XCH(旭昌辉), in a SOT-563. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | I/O1 | passive | Protected I/O line (steering-diode pair to the internal rails) with 5.0V reverse working voltage to ground and 0.5pF typ. (0.8pF max) capacitance to ground. |
| 2 | GND | power_in | Ground, connected to the lower diode rail and the anode of the central avalanche TVS diode; the reference for all I/O-to-ground ratings. |
| 3 | I/O2 | passive | Protected I/O line (steering-diode pair to the internal rails) with 5.0V reverse working voltage to ground and 0.5pF typ. (0.8pF max) capacitance to ground. |
| 4 | I/O3 | passive | Protected I/O line (steering-diode pair to the internal rails) with 5.0V reverse working voltage to ground and 0.5pF typ. (0.8pF max) capacitance to ground. |
| 5 | VP | passive | Upper internal rail connected to the cathode of the central avalanche TVS diode (5V working voltage); the datasheet says it protects five I/O lines but does not name this pin. |
| 6 | I/O4 | passive | Protected I/O line (steering-diode pair to the internal rails) with 5.0V reverse working voltage to ground and 0.5pF typ. (0.8pF max) capacitance to ground. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | XCH(旭昌辉) |
| Package | SOT-563 |
| Category |  |
| Pins | 6 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Peak Pulse Power | PPK |  |  | 150 | Watts | tp = 8/20μs | 1 |
| Operating Temperature | TJ | -55 |  | 125 | ℃ |  | 1 |
| Storage Temperature | TSTG | -55 |  | 150 | ℃ |  | 1 |
| Lead Soldering Temperature | TL |  |  | 260 | ℃ | 10sec. | 1 |
| Reverse Breakdown Voltage | VBR | 6 |  |  | V | IT = 1mA, Any I/O to Ground | 2 |
| Reverse Leakage Current | IR |  |  | 1 | μA | VRWM = 5V, Any I/O to Ground | 2 |
| Reverse Working Voltage | VRWM |  |  | 5 | V | Any I/O to Ground | 2 |
| Clamping Voltage | VC |  |  | 9.8 | V | IPP = 1A, tp =8/20μs, any I/O pin to Ground | 2 |
| Clamping Voltage | VC |  |  | 15 | V | IPP = 3A, tp =8/20μs, any I/O pin to Ground | 2 |
| Junction Capacitance (between I/O pins) | CJ |  | 0.3 | 0.5 | pF | VR = 0V, f = 1MHz, between I/O pins | 2 |
| Junction Capacitance (any I/O pin to ground) | CJ |  | 0.5 | 0.8 | pF | VR = 0V, f = 1MHz, any I/O pin to Ground | 2 |

## CAD (KiCad official)

- Symbol: `ZX5605UC`
- Footprint: `Package_TO_SOT_SMD:SOT-563`
- 3D model: SOT-563 (KiCad packages3D, STEP)
- 3D model files: `zx5605uc-etched.step` / `zx5605uc-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `zx5605uc.step` / `zx5605uc.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [XCH(旭昌辉) datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8603363127325585408) (5 pp, sha256 `309f9d2a71ebc5f6`, retrieved 2026-10-21, tier: lcsc)
- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/zx5605uc-datasheet.pdf)