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ZX5605UC

XCH(旭昌辉) · IC · SOT-563

ZX5605UC from XCH(旭昌辉), in a SOT-563. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 I/O1 passive Protected I/O line (steering-diode pair to the internal rails) with 5.0V reverse working voltage to ground and 0.5pF typ. (0.8pF max) capacitance to ground.
2 GND power_in Ground, connected to the lower diode rail and the anode of the central avalanche TVS diode; the reference for all I/O-to-ground ratings.
3 I/O2 passive Protected I/O line (steering-diode pair to the internal rails) with 5.0V reverse working voltage to ground and 0.5pF typ. (0.8pF max) capacitance to ground.
4 I/O3 passive Protected I/O line (steering-diode pair to the internal rails) with 5.0V reverse working voltage to ground and 0.5pF typ. (0.8pF max) capacitance to ground.
5 VP passive Upper internal rail connected to the cathode of the central avalanche TVS diode (5V working voltage); the datasheet says it protects five I/O lines but does not name this pin.
6 I/O4 passive Protected I/O line (steering-diode pair to the internal rails) with 5.0V reverse working voltage to ground and 0.5pF typ. (0.8pF max) capacitance to ground.

Key specifications

Parameter Value
Manufacturer XCH(旭昌辉)
Package SOT-563
Category
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Pulse Power PPK 150 Watts tp = 8/20μs 1
Operating Temperature TJ -55 125 ℃ 1
Storage Temperature TSTG -55 150 ℃ 1
Lead Soldering Temperature TL 260 ℃ 10sec. 1
Reverse Breakdown Voltage VBR 6 V IT = 1mA, Any I/O to Ground 2
Reverse Leakage Current IR 1 μA VRWM = 5V, Any I/O to Ground 2
Reverse Working Voltage VRWM 5 V Any I/O to Ground 2
Clamping Voltage VC 9.8 V IPP = 1A, tp =8/20μs, any I/O pin to Ground 2
Clamping Voltage VC 15 V IPP = 3A, tp =8/20μs, any I/O pin to Ground 2
Junction Capacitance (between I/O pins) CJ 0.3 0.5 pF VR = 0V, f = 1MHz, between I/O pins 2
Junction Capacitance (any I/O pin to ground) CJ 0.5 0.8 pF VR = 0V, f = 1MHz, any I/O pin to Ground 2

CAD (KiCad official)

  • Symbol: ZX5605UC
  • Footprint: Package_TO_SOT_SMD:SOT-563
  • 3D model: SOT-563 (KiCad packages3D, STEP)
  • 3D model files: zx5605uc-etched.step / zx5605uc-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); zx5605uc.step / zx5605uc.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: XCH(旭昌辉) datasheet (5 pp, sha256 309f9d2a71ebc5f6, retrieved 2026-10-21, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF