component
Z0409MB
Public Made by Adomby adom
STMicroelectronics Thyristors (SCR)/Modules, DPAK. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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z0409mb: specified limits as data (metadata.characteristics, 27 rows from the datasheet)
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25d ago
Z0409MB
STMicroelectronics · Thyristors (SCR)/Modules · DPAK
Z0409MB from STMicroelectronics, in a DPAK. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate terminal for triggering the triac with maximum peak gate current 1.2 A (tp = 20 µs) and maximum power dissipation 0.5 W. |
| 2 | A1 | bidirectional | Anode 1 main current terminal rated for maximum 4 A RMS on-state current and 600 V repetitive peak off-state voltage (Tj = 125 °C). |
| 3 | A2 | bidirectional | Anode 2 main current terminal rated for maximum 4 A RMS on-state current and 600 V repetitive peak off-state voltage (Tj = 125 °C), connected to package tab for heat dissipation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | STMicroelectronics |
| Package | DPAK |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Gate trigger current | IGT(1) | 10 | mA | VD = 12 V, RL = 33 Ω | 2 | ||
| Gate trigger voltage | VGT | 1.3 | V | VD = 12 V, RL = 33 Ω | 2 | ||
| Gate non-trigger voltage | VGD | 0.2 | V | VD = VDRM, RL = 3.3 kΩ, Tj = 125 °C | 2 | ||
| Latching current, quadrants I-III-IV | IL | 15 | mA | IG = 1.2 x IGT, I-III-IV | 2 | ||
| Latching current, quadrant II | IL | 25 | mA | IG = 1.2 x IGT, II | 2 | ||
| Holding current | IH(2) | 10 | mA | IT = 500 mA, gate open | 2 | ||
| Critical rate of rise of off-state voltage | dV/dt(2) | 100 | V/µs | VD = 67 % VDRM; VR = 67 % VRRM, gate open, Tj = 110 °C | 2 | ||
| Critical rate of decrease of main current (commutation) | (dV/dt)c(2) | 2 | V/µs | (dI/dt)c = 1.8 A/ms, Tj = 110 °C | 2 | ||
| On-state voltage | VTM(1) | 2 | V | ITM = 5.5 A, tp = 380 µs, Tj = 25 °C | 2 | ||
| Threshold voltage | VTO(1) | 0.95 | V | Tj = 125 °C | 2 | ||
| Dynamic resistance | RD(1) | 180 | mΩ | Tj = 125 °C | 2 | ||
| Repetitive peak off-state current | IDRM/IRRM | 5 | µA | VD = VR = VDRM = VRRM, Tj = 25 °C | 2 | ||
| Repetitive peak off-state current | IDRM/IRRM | 0.5 | mA | VD = VR = VDRM = VRRM, Tj = 125 °C | 2 | ||
| RMS on-state current (full sine wave) | IT(RMS) | 4 | A | Tc = 107 °C | 2 | ||
| Non repetitive surge peak on-state current | ITSM | 16 | A | t = 16.7 ms, Tj initial = 25 °C | 2 | ||
| Non repetitive surge peak on-state current | ITSM | 15 | A | t = 20 ms, Tj initial = 25 °C | 2 | ||
| I2t value for fusing | I2t | 1.5 | A2s | tp = 10 ms | 2 | ||
| Critical rate of rise of on-state current | dl/dt | 50 | A/µs | IG = 2 x IGT, tr ≤ 100 ns, f = 120 Hz, Tj = 125 °C | 2 | ||
| Repetitive peak off-state voltage | VDRM/VRRM | 600 | V | Tj = 125 °C | 2 | ||
| Non repetitive peak off-state voltage | VDSM/VRSM | 750 | V | 10 ms | 2 | ||
| Maximum peak gate current | IGM | 1.2 | A | tp = 20 µs, Tj = 125 °C | 2 | ||
| Maximum gate power dissipation | PGM | 0.5 | W | 2 | |||
| Storage temperature range | Tstg | -40 | 125 | °C | 2 | ||
| Operating junction temperature range | Tj | -40 | 125 | °C | 2 | ||
| Maximum lead temperature for soldering | TL | 260 | °C | during 10 s | 2 | ||
| Thermal resistance junction to case (AC) | Rth(j-c) | 3 | °C/W | AC | 3 | ||
| Thermal resistance junction to ambient | Rth(j-a) | 70 | °C/W | SCU = 0.5 cm² | 3 |
CAD (KiCad official)
- Symbol:
Z0409MB - Footprint:
Package_TO_SOT_SMD:TO-252-2 - 3D model: DPAK (KiCad packages3D, STEP)
- 3D model files:
z0409mb-etched.step/z0409mb-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);z0409mb.step/z0409mb.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: STMicroelectronics datasheet (11 pp, sha256
7de39d7020a24040, retrieved 2026-09-23, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.2, primaryclaude-haiku-4-5-20251001(text), consensusclaude-sonnet-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# Z0409MB
**STMicroelectronics** · Thyristors (SCR)/Modules · DPAK
Z0409MB from STMicroelectronics, in a DPAK. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate terminal for triggering the triac with maximum peak gate current 1.2 A (tp = 20 µs) and maximum power dissipation 0.5 W. |
| 2 | A1 | bidirectional | Anode 1 main current terminal rated for maximum 4 A RMS on-state current and 600 V repetitive peak off-state voltage (Tj = 125 °C). |
| 3 | A2 | bidirectional | Anode 2 main current terminal rated for maximum 4 A RMS on-state current and 600 V repetitive peak off-state voltage (Tj = 125 °C), connected to package tab for heat dissipation. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | STMicroelectronics |
| Package | DPAK |
| Category | Transistors/Thyristors |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Gate trigger current | IGT(1) | | | 10 | mA | VD = 12 V, RL = 33 Ω | 2 |
| Gate trigger voltage | VGT | | | 1.3 | V | VD = 12 V, RL = 33 Ω | 2 |
| Gate non-trigger voltage | VGD | 0.2 | | | V | VD = VDRM, RL = 3.3 kΩ, Tj = 125 °C | 2 |
| Latching current, quadrants I-III-IV | IL | | | 15 | mA | IG = 1.2 x IGT, I-III-IV | 2 |
| Latching current, quadrant II | IL | | | 25 | mA | IG = 1.2 x IGT, II | 2 |
| Holding current | IH(2) | | | 10 | mA | IT = 500 mA, gate open | 2 |
| Critical rate of rise of off-state voltage | dV/dt(2) | 100 | | | V/µs | VD = 67 % VDRM; VR = 67 % VRRM, gate open, Tj = 110 °C | 2 |
| Critical rate of decrease of main current (commutation) | (dV/dt)c(2) | 2 | | | V/µs | (dI/dt)c = 1.8 A/ms, Tj = 110 °C | 2 |
| On-state voltage | VTM(1) | | | 2 | V | ITM = 5.5 A, tp = 380 µs, Tj = 25 °C | 2 |
| Threshold voltage | VTO(1) | | | 0.95 | V | Tj = 125 °C | 2 |
| Dynamic resistance | RD(1) | | | 180 | mΩ | Tj = 125 °C | 2 |
| Repetitive peak off-state current | IDRM/IRRM | | | 5 | µA | VD = VR = VDRM = VRRM, Tj = 25 °C | 2 |
| Repetitive peak off-state current | IDRM/IRRM | | | 0.5 | mA | VD = VR = VDRM = VRRM, Tj = 125 °C | 2 |
| RMS on-state current (full sine wave) | IT(RMS) | | | 4 | A | Tc = 107 °C | 2 |
| Non repetitive surge peak on-state current | ITSM | | | 16 | A | t = 16.7 ms, Tj initial = 25 °C | 2 |
| Non repetitive surge peak on-state current | ITSM | | | 15 | A | t = 20 ms, Tj initial = 25 °C | 2 |
| I2t value for fusing | I2t | | | 1.5 | A2s | tp = 10 ms | 2 |
| Critical rate of rise of on-state current | dl/dt | | | 50 | A/µs | IG = 2 x IGT, tr ≤ 100 ns, f = 120 Hz, Tj = 125 °C | 2 |
| Repetitive peak off-state voltage | VDRM/VRRM | | | 600 | V | Tj = 125 °C | 2 |
| Non repetitive peak off-state voltage | VDSM/VRSM | | | 750 | V | 10 ms | 2 |
| Maximum peak gate current | IGM | | | 1.2 | A | tp = 20 µs, Tj = 125 °C | 2 |
| Maximum gate power dissipation | PGM | | | 0.5 | W | | 2 |
| Storage temperature range | Tstg | -40 | | 125 | °C | | 2 |
| Operating junction temperature range | Tj | -40 | | 125 | °C | | 2 |
| Maximum lead temperature for soldering | TL | | | 260 | °C | during 10 s | 2 |
| Thermal resistance junction to case (AC) | Rth(j-c) | | | 3 | °C/W | AC | 3 |
| Thermal resistance junction to ambient | Rth(j-a) | | 70 | | °C/W | SCU = 0.5 cm² | 3 |
## CAD (KiCad official)
- Symbol: `Z0409MB`
- Footprint: `Package_TO_SOT_SMD:TO-252-2`
- 3D model: DPAK (KiCad packages3D, STEP)
- 3D model files: `z0409mb-etched.step` / `z0409mb-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `z0409mb.step` / `z0409mb.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [STMicroelectronics datasheet](https://www.st.com/resource/en/datasheet/z0409mb.pdf) (11 pp, sha256 `7de39d7020a24040`, retrieved 2026-09-23, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.2`, primary `claude-haiku-4-5-20251001` (text), consensus `claude-sonnet-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/z0409mb-datasheet.pdf)