component
XL7026E1
Public Made by Adomby adom
XLSEMI DC-DC Converters, SOP-8-EP. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownXL7026E1
XLSEMI · DC-DC Converters · SOP-8-EP
XL7026E1 from XLSEMI, in a SOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | FB | input | Feedback pin. Sensed against the internal 1.25 V reference through an external resistor divider from VOUT to set the output voltage (VOUT = 1.25 * (1 + R2/R1)). |
| 2 | VREG | power_in | Chip supply pin. Requires a 10 µF decoupling capacitor between VREG and GND to filter noise. An external 7-9 V bias can be applied to this pin to reduce internal power dissipation. |
| 3 | VC | passive | Internal voltage-regulator bypass pin. Requires a 1 µF ceramic capacitor connected between VC and VIN. |
| 4 | VIN | power_in | Main power input, DC 12-90 V (demo tested up to 84 V). Bypass to GND with an electrolytic capacitor placed close to the pin to suppress switching noise and inrush spikes. |
| 5 | SW | power_out | Power-switch output pin. Connects to the external inductor and freewheeling Schottky diode of the buck converter. Tied together with pin 6 for current handling. |
| 6 | SW | power_out | Power-switch output pin (paralleled with pin 5). Connects to the switching node of the buck converter. |
| 7 | OGND | power_in | Power/output ground return for the internal power stage. Tie to the ground plane at the input capacitor return. |
| 8 | GND | power_in | Signal ground reference for the control circuitry. |
| 9 | EP | power_in | Exposed thermal pad on the bottom of the SOP8-EP package. Solder to the ground copper pour for heat sinking; connect to GND. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | XLSEMI |
| Package | SOP-8-EP |
| Category | PMIC |
| Pins | 9 |
Ordering variants
Same part, different packaging or reel option.
XL7026E1
CAD (KiCad official)
- Symbol:
XL7026E1 - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOP-8-EP (KiCad packages3D, STEP)
- 3D model files:
xl7026e1-etched.step/xl7026e1-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);xl7026e1.step/xl7026e1.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: XLSEMI datasheet (8 pp, sha256
56a8aedb64fd6229, retrieved 2026-08-17, tier: manufacturer) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).