# XL285-2.5

**XINLUDA** · Voltage Reference · SOIC-8

XL285-2.5 from XINLUDA, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No connection. |
| 2 | NC | unconnected | No connection. |
| 3 | NC | unconnected | No connection. |
| 4 | - | passive | Negative (anode) terminal of the 2.5V micropower reference diode, operating over a 20 μA to 20 mA reverse current range. |
| 5 | NC | unconnected | No connection. |
| 6 | NC | unconnected | No connection. |
| 7 | NC | unconnected | No connection. |
| 8 | + | passive | Positive (cathode) terminal of the 2.5V micropower reference diode, operating over a 20 μA to 20 mA reverse current range with 30 mA absolute maximum reverse current. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | XINLUDA |
| Package | SOIC-8 |
| Category | Power Management (PMIC) |
| Pins | 8 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Breakdown Voltage (minimum) | VR | 2.462 | 2.5 |  | V | TA = 25°C, 20 μA ≤ IR ≤ 20 mA | 4 |
| Reverse Breakdown Voltage (maximum) | VR |  | 2.5 | 2.538 | V | TA = 25°C, 20 μA ≤ IR ≤ 20 mA | 4 |
| Minimum Operating Current | IMIN |  | 13 | 20 | μA |  | 4 |
| Reverse Breakdown Voltage Change with Current | ΔVR |  | 1 | 1.5 | mV | 20 μA ≤ IR ≤ 1 mA | 4 |
| Reverse Breakdown Voltage Change with Current | ΔVR |  | 10 | 20 | mV | 1 mA ≤ IR ≤ 20 mA | 4 |
| Reverse Dynamic Impedance | ZR |  |  | 1 | Ω | IR = 100 μA, f = 20 Hz | 4 |
| Average Temperature Coefficient (All others, no X/Y suffix) | TC |  |  | 150 | ppm/°C | IR = 100 μA | 4 |
| Reverse Current | IR |  |  | 30 | mA |  | 2 |
| Forward Current | IF |  |  | 10 | mA |  | 2 |
| Operating Temperature Range (XL285-2.5) | TA | -40 |  | 85 | °C |  | 2 |
| Storage Temperature | TSTG | -55 |  | 150 | °C |  | 2 |
| ESD Susceptibility |  | 2 |  |  | kV | Human body model, 100 pF through 1.5 kΩ | 2 |
| Maximum Junction Temperature (XL285) | TJMAX |  |  | 125 | °C | For elevated temperature operation | 2 |
| Soldering Temperature, Vapor Phase |  |  |  | 215 | °C | SOP and SOT-23, vapor phase, 60 sec | 2 |
| Soldering Temperature, Infrared |  |  |  | 220 | °C | SOP and SOT-23, infrared, 15 sec | 2 |
| Thermal Resistance, Junction to Ambient (SOP-8) | θJA |  | 165 |  | °C/W | SOP-8, junction to ambient | 2 |

## CAD (KiCad official)

- Symbol: `XL285-2.5`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files: `xl285-2-5-etched.step` / `xl285-2-5-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `xl285-2-5.step` / `xl285-2-5.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [XINLUDA datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8757797135163240448) (12 pp, sha256 `de57b1e1a4a5153a`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/xl285-2-5-datasheet.pdf)