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XL285-2.5

Public Made by Adom

by adom

XINLUDA Voltage Reference, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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XL285-2.5

XINLUDA · Voltage Reference · SOIC-8

XL285-2.5 from XINLUDA, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected No connection.
2 NC unconnected No connection.
3 NC unconnected No connection.
4 - passive Negative (anode) terminal of the 2.5V micropower reference diode, operating over a 20 μA to 20 mA reverse current range.
5 NC unconnected No connection.
6 NC unconnected No connection.
7 NC unconnected No connection.
8 + passive Positive (cathode) terminal of the 2.5V micropower reference diode, operating over a 20 μA to 20 mA reverse current range with 30 mA absolute maximum reverse current.

Key specifications

Parameter Value
Manufacturer XINLUDA
Package SOIC-8
Category Power Management (PMIC)
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Breakdown Voltage (minimum) VR 2.462 2.5 V TA = 25°C, 20 μA ≤ IR ≤ 20 mA 4
Reverse Breakdown Voltage (maximum) VR 2.5 2.538 V TA = 25°C, 20 μA ≤ IR ≤ 20 mA 4
Minimum Operating Current IMIN 13 20 μA 4
Reverse Breakdown Voltage Change with Current ΔVR 1 1.5 mV 20 μA ≤ IR ≤ 1 mA 4
Reverse Breakdown Voltage Change with Current ΔVR 10 20 mV 1 mA ≤ IR ≤ 20 mA 4
Reverse Dynamic Impedance ZR 1 Ω IR = 100 μA, f = 20 Hz 4
Average Temperature Coefficient (All others, no X/Y suffix) TC 150 ppm/°C IR = 100 μA 4
Reverse Current IR 30 mA 2
Forward Current IF 10 mA 2
Operating Temperature Range (XL285-2.5) TA -40 85 °C 2
Storage Temperature TSTG -55 150 °C 2
ESD Susceptibility 2 kV Human body model, 100 pF through 1.5 kΩ 2
Maximum Junction Temperature (XL285) TJMAX 125 °C For elevated temperature operation 2
Soldering Temperature, Vapor Phase 215 °C SOP and SOT-23, vapor phase, 60 sec 2
Soldering Temperature, Infrared 220 °C SOP and SOT-23, infrared, 15 sec 2
Thermal Resistance, Junction to Ambient (SOP-8) θJA 165 °C/W SOP-8, junction to ambient 2

CAD (KiCad official)

  • Symbol: XL285-2.5
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: xl285-2-5-etched.step / xl285-2-5-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); xl285-2-5.step / xl285-2-5.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: XINLUDA datasheet (12 pp, sha256 de57b1e1a4a5153a, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF