# XB8089AF

**XySemi** · Battery Management · SOP-8-EP

XB8089AF from XySemi, in a SOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VM | input | Negative terminal of the battery pack; the internal FET switch connects this pin to GND, and the datasheet gives an input pin voltage limit of -6 to 10 V. |
| 2 | VM | input | Negative terminal of the battery pack; the internal FET switch connects this pin to GND, and the datasheet gives an input pin voltage limit of -6 to 10 V. |
| 3 | VM | input | Negative terminal of the battery pack; the internal FET switch connects this pin to GND, and the datasheet gives an input pin voltage limit of -6 to 10 V. |
| 4 | VM | input | Negative terminal of the battery pack; the internal FET switch connects this pin to GND, and the datasheet gives an input pin voltage limit of -6 to 10 V. |
| 5 | GND | power_in | Ground; connect to the negative terminal of the battery. |
| 6 | VDD | power_in | Power supply input; the datasheet gives a VDD input pin voltage limit of -0.3 to 6 V. |
| 7 | GND | power_in | Ground; connect to the negative terminal of the battery. |
| 8 | GND | power_in | Ground; connect to the negative terminal of the battery. |
| 9 | EPAD | power_in | Exposed pad that must be connected to the IC's GND to improve heat release and drive capability; the datasheet gives no electrical limit for it. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | XySemi |
| Package | SOP-8-EP |
| Category | Power Management (PMIC) |
| Pins | 9 |

## CAD (KiCad official)

- Symbol: `XB8089AF`
- Footprint: `Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm`
- 3D model: SOP-8-EP (KiCad packages3D, STEP)
- 3D model files: `xb8089af-etched.step` / `xb8089af-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `xb8089af.step` / `xb8089af.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [XySemi datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588904128928501760) (12 pp, sha256 `8b9a22c336dfcddb`, retrieved 2026-10-09, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/xb8089af-datasheet.pdf)