component
XB8089AF
Public Made by Adomby adom
XySemi Battery Management, SOP-8-EP. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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XB8089AF
XySemi · Battery Management · SOP-8-EP
XB8089AF from XySemi, in a SOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VM | input | Negative terminal of the battery pack; the internal FET switch connects this pin to GND, and the datasheet gives an input pin voltage limit of -6 to 10 V. |
| 2 | VM | input | Negative terminal of the battery pack; the internal FET switch connects this pin to GND, and the datasheet gives an input pin voltage limit of -6 to 10 V. |
| 3 | VM | input | Negative terminal of the battery pack; the internal FET switch connects this pin to GND, and the datasheet gives an input pin voltage limit of -6 to 10 V. |
| 4 | VM | input | Negative terminal of the battery pack; the internal FET switch connects this pin to GND, and the datasheet gives an input pin voltage limit of -6 to 10 V. |
| 5 | GND | power_in | Ground; connect to the negative terminal of the battery. |
| 6 | VDD | power_in | Power supply input; the datasheet gives a VDD input pin voltage limit of -0.3 to 6 V. |
| 7 | GND | power_in | Ground; connect to the negative terminal of the battery. |
| 8 | GND | power_in | Ground; connect to the negative terminal of the battery. |
| 9 | EPAD | power_in | Exposed pad that must be connected to the IC's GND to improve heat release and drive capability; the datasheet gives no electrical limit for it. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | XySemi |
| Package | SOP-8-EP |
| Category | Power Management (PMIC) |
| Pins | 9 |
CAD (KiCad official)
- Symbol:
XB8089AF - Footprint:
Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm - 3D model: SOP-8-EP (KiCad packages3D, STEP)
- 3D model files:
xb8089af-etched.step/xb8089af-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);xb8089af.step/xb8089af.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: XySemi datasheet (12 pp, sha256
8b9a22c336dfcddb, retrieved 2026-10-09, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).