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WNM3008-3

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by adom

WILLSEMI Will Semicon MOSFETs, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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WNM3008-3

WILLSEMI Will Semicon · MOSFETs · SOT-23

WNM3008-3 from WILLSEMI Will Semicon, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate of the N-channel MOSFET; the datasheet gives a Gate-Source Voltage rating of ±20 V (printed as 'f20').
2 S passive Source of the N-channel MOSFET; the 30 V Drain-Source Voltage and ±20 V Gate-Source Voltage ratings are referenced to this terminal.
3 D passive Drain of the N-channel MOSFET; the datasheet rates Drain-Source Voltage VDS at 30 V and continuous drain current ID at 3.1 A (TA=25°C, 10 s).

Key specifications

Parameter Value
Manufacturer WILLSEMI Will Semicon
Package SOT-23
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS 30 V 2
Gate-Source Voltage VGS -20 20 V 2
Continuous Drain Current (note a) ID 3.1 A TA=25°C, t≤10 s 2
Continuous Drain Current (note a) ID 2.8 A TA=25°C, steady state 2
Continuous Drain Current (note a) ID 2.5 A TA=70°C, t≤10 s 2
Continuous Drain Current (note a) ID 2.3 A TA=70°C, steady state 2
Maximum Power Dissipation (note a) PD 0.8 W TA=25°C, t≤10 s 2
Maximum Power Dissipation (note a) PD 0.7 W TA=25°C, steady state 2
Maximum Power Dissipation (note a) PD 0.5 W TA=70°C, t≤10 s 2
Maximum Power Dissipation (note a) PD 0.4 W TA=70°C, steady state 2
Continuous Drain Current (note b) ID 2.8 A TA=25°C, t≤10 s 2
Continuous Drain Current (note b) ID 2.6 A TA=25°C, steady state 2
Continuous Drain Current (note b) ID 2.2 A TA=70°C, t≤10 s 2
Continuous Drain Current (note b) ID 2.1 A TA=70°C, steady state 2
Maximum Power Dissipation (note b) PD 0.6 W TA=25°C, t≤10 s 2
Maximum Power Dissipation (note b) PD 0.5 W TA=25°C, steady state 2
Maximum Power Dissipation (note b) PD 0.4 W TA=70°C, t≤10 s 2
Maximum Power Dissipation (note b) PD 0.3 W TA=70°C, steady state 2
Pulsed Drain Current IDM 10 A Pulse width<380μs, duty cycle<2% 2
Operating Junction Temperature TJ 150 °C 2
Lead Temperature TL 260 °C 2
Storage Temperature Range Tstg -55 150 °C 2
Junction-to-Ambient Thermal Resistance (note a) RθJA 125 150 °C/W t≤10 s, surface mounted on FR-4, 1 sq in pad 2
Junction-to-Ambient Thermal Resistance (note a) RθJA 140 175 °C/W Steady state, surface mounted on FR-4, 1 sq in pad 2
Junction-to-Ambient Thermal Resistance (note b) RθJA 150 180 °C/W t≤10 s, surface mounted on FR-4, minimum pad 2
Junction-to-Ambient Thermal Resistance (note b) RθJA 165 210 °C/W Steady state, surface mounted on FR-4, minimum pad 2
Junction-to-Case Thermal Resistance RθJC 60 76 °C/W Steady state 2
Drain-to-Source Breakdown Voltage BVDSS 30 V VGS = 0 V, ID = 250uA 3
Zero Gate Voltage Drain Current IDSS 1 uA VDS = 24V, VGS = 0V 3
Gate-to-source Leakage Current IGSS -100 100 nA VDS = 0 V, VGS = ±20V 3
Gate Threshold Voltage VGS(TH) 0.8 1.4 2 V VGS = VDS, ID = 250uA 3
Drain-to-source On-resistance RDS(on) 44 62 mΩ VGS = 10V, ID = 3.1A 3
Drain-to-source On-resistance RDS(on) 57 77 mΩ VGS = 4.5V, ID = 2.0A 3
Drain-to-source On-resistance RDS(on) 180 235 mΩ VGS = 2.5V, ID = 1.0A 3
Forward Transconductance gFS 5 S VDS = 4.5V, ID = 2.8A 3
Forward Voltage VSD 0.8 1.5 V VGS = 0 V, IS = 1.5A 3

CAD (KiCad official)

  • Symbol: WNM3008-3
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: wnm3008-3-etched.step / wnm3008-3-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); wnm3008-3.step / wnm3008-3.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: WILLSEMI Will Semicon datasheet (7 pp, sha256 254f7d1e5ce62d23, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF