component
WGD4N65SE
Public Made by Adomby adom
Wild Goose MOSFETs, TO-252. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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WGD4N65SE
Wild Goose · MOSFETs · TO-252
WGD4N65SE from Wild Goose, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate of the 650 V N-channel MOSFET; the datasheet specifies gate-body leakage with VGS = ±30 V and a gate threshold (VGS(TH)) of 2 V to 4 V at ID = 250 µA. |
| 2 | D | passive | Drain of the MOSFET (also the tab), rated for a drain-source breakdown voltage BVDSS of 650 V minimum and a drain current ID of 4.0 A at Tj = 25 ℃. |
| 3 | S | passive | Source of the MOSFET, the reference terminal for VGS and VDS, with a maximum body-diode forward current IS of 4 A. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Wild Goose |
| Package | TO-252 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDSS | 650 | V | 1 | |||
| Drain Current, Tj=25℃ | ID | 4 | A | Tj=25℃ | 1 | ||
| Drain Current, Tj=100℃ | ID | 2.7 | A | Tj=100℃ | 1 | ||
| Gate Threshold Voltage (as printed in absolute maximum table) | VGS(TH) | 30 | V | 1 | |||
| Single Pulse Avalanche Energy (note1) | EAS | 120 | mJ | 1 | |||
| Avalanche Current (note2) | IAR | 4 | A | 1 | |||
| Power Dissipation | PD | 50 | W | Tj=25℃ | 1 | ||
| Junction Temperature (Max) | Tj | 150 | ℃ | 1 | |||
| Storage Temperature | Tstg | -55 | 150 | ℃ | 1 | ||
| Maximum lead temperature for soldering purpose | TL | 300 | ℃ | 1/8in from case for 5 seconds | 1 | ||
| Thermal Resistance, Junction to Case | RθJC | 2.4 | ℃/W | 1 | |||
| Thermal Resistance, Junction to Ambient | RθJA | 62.5 | ℃/W | 1 | |||
| Drain-Source Breakdown Voltage | BVDSS | 650 | V | ID=250μA, VGS=0 | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | 10 | μA | VDS=650V, VGS=0V | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | 100 | μA | VDS=520V, Tj=125℃ | 2 | ||
| Gate-body leakage Current, Forward | IGSSF | 100 | nA | VGS=+30V, VDS=0V | 2 | ||
| Gate-body leakage Current, Reverse | IGSSR | -100 | nA | VGS=-30V, VDS=0V | 2 | ||
| Gate Threshold Voltage | VGS(TH) | 2 | 4 | V | ID=250μA, VDS=VGS | 2 | |
| Static Drain-Source On-Resistance | RDS(ON) | 2.5 | Ω | ID=2.0A, VGS=10V | 2 | ||
| Max. Diode Forward Current | Is | 4 | A | 2 | |||
| Max. Pulsed Forward Current | ISM | 16 | A | 2 | |||
| Diode Forward Voltage | VSD | 1.4 | V | ID=4A | 2 | ||
| Breakdown Voltage Temperature Coefficient | ΔBVDSS/ΔTJ | 0.67 | V/℃ | ID=250μA, Reference to 25℃ | 2 | ||
| Input Capacitance | Ciss | 560 | pF | VDS=25V, VGS=0, f=1.0MHz | 2 | ||
| Output Capacitance | Coss | 48 | pF | VDS=25V, VGS=0, f=1.0MHz | 2 | ||
| Reverse Transfer Capacitance | Crss | 5.4 | pF | VDS=25V, VGS=0, f=1.0MHz | 2 | ||
| Turn-On Delay Time | Td(on) | 25 | nS | VDD=325V, ID=4A, RG=25Ω | 2 | ||
| Turn-On Rise Time | Tr | 45 | nS | VDD=325V, ID=4A, RG=25Ω | 2 | ||
| Turn-Off Delay Time | Td(off) | 25 | nS | VDD=325V, ID=4A, RG=25Ω | 2 | ||
| Turn-Off Rise Time | Tf | 35 | nS | VDD=325V, ID=4A, RG=25Ω | 2 | ||
| Gate-Source Charge | Qgs | 2.8 | nC | VDS=520V, VGS=10V, ID=4A | 2 | ||
| Gate-Drain Charge | Qgd | 4.5 | nC | VDS=520V, VGS=10V, ID=4A | 2 | ||
| Reverse Recovery Time | Trr | 393 | nS | IS=4A, VGS=0V, diF/dt=100A/μs | 2 | ||
| Reverse Recovery Charge | Qrr | 1.5 | μC | IS=4A, VGS=0V, diF/dt=100A/μs | 2 |
CAD (KiCad official)
- Symbol:
WGD4N65SE - Footprint:
Package_TO_SOT_SMD:TO-252-2 - 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files:
wgd4n65se-etched.step/wgd4n65se-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);wgd4n65se.step/wgd4n65se.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Wild Goose datasheet (7 pp, sha256
0626c44c63d6ae05, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# WGD4N65SE
**Wild Goose** · MOSFETs · TO-252
WGD4N65SE from Wild Goose, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate of the 650 V N-channel MOSFET; the datasheet specifies gate-body leakage with VGS = ±30 V and a gate threshold (VGS(TH)) of 2 V to 4 V at ID = 250 µA. |
| 2 | D | passive | Drain of the MOSFET (also the tab), rated for a drain-source breakdown voltage BVDSS of 650 V minimum and a drain current ID of 4.0 A at Tj = 25 ℃. |
| 3 | S | passive | Source of the MOSFET, the reference terminal for VGS and VDS, with a maximum body-diode forward current IS of 4 A. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Wild Goose |
| Package | TO-252 |
| Category | Transistors/Thyristors |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDSS | | | 650 | V | | 1 |
| Drain Current, Tj=25℃ | ID | | | 4 | A | Tj=25℃ | 1 |
| Drain Current, Tj=100℃ | ID | | | 2.7 | A | Tj=100℃ | 1 |
| Gate Threshold Voltage (as printed in absolute maximum table) | VGS(TH) | | | 30 | V | | 1 |
| Single Pulse Avalanche Energy (note1) | EAS | | | 120 | mJ | | 1 |
| Avalanche Current (note2) | IAR | | | 4 | A | | 1 |
| Power Dissipation | PD | | | 50 | W | Tj=25℃ | 1 |
| Junction Temperature (Max) | Tj | | | 150 | ℃ | | 1 |
| Storage Temperature | Tstg | -55 | | 150 | ℃ | | 1 |
| Maximum lead temperature for soldering purpose | TL | | | 300 | ℃ | 1/8in from case for 5 seconds | 1 |
| Thermal Resistance, Junction to Case | RθJC | | | 2.4 | ℃/W | | 1 |
| Thermal Resistance, Junction to Ambient | RθJA | | | 62.5 | ℃/W | | 1 |
| Drain-Source Breakdown Voltage | BVDSS | 650 | | | V | ID=250μA, VGS=0 | 2 |
| Zero Gate Voltage Drain Current | IDSS | | | 10 | μA | VDS=650V, VGS=0V | 2 |
| Zero Gate Voltage Drain Current | IDSS | | | 100 | μA | VDS=520V, Tj=125℃ | 2 |
| Gate-body leakage Current, Forward | IGSSF | | | 100 | nA | VGS=+30V, VDS=0V | 2 |
| Gate-body leakage Current, Reverse | IGSSR | | | -100 | nA | VGS=-30V, VDS=0V | 2 |
| Gate Threshold Voltage | VGS(TH) | 2 | | 4 | V | ID=250μA, VDS=VGS | 2 |
| Static Drain-Source On-Resistance | RDS(ON) | | | 2.5 | Ω | ID=2.0A, VGS=10V | 2 |
| Max. Diode Forward Current | Is | | | 4 | A | | 2 |
| Max. Pulsed Forward Current | ISM | | | 16 | A | | 2 |
| Diode Forward Voltage | VSD | | | 1.4 | V | ID=4A | 2 |
| Breakdown Voltage Temperature Coefficient | ΔBVDSS/ΔTJ | | 0.67 | | V/℃ | ID=250μA, Reference to 25℃ | 2 |
| Input Capacitance | Ciss | | 560 | | pF | VDS=25V, VGS=0, f=1.0MHz | 2 |
| Output Capacitance | Coss | | 48 | | pF | VDS=25V, VGS=0, f=1.0MHz | 2 |
| Reverse Transfer Capacitance | Crss | | 5.4 | | pF | VDS=25V, VGS=0, f=1.0MHz | 2 |
| Turn-On Delay Time | Td(on) | | 25 | | nS | VDD=325V, ID=4A, RG=25Ω | 2 |
| Turn-On Rise Time | Tr | | 45 | | nS | VDD=325V, ID=4A, RG=25Ω | 2 |
| Turn-Off Delay Time | Td(off) | | 25 | | nS | VDD=325V, ID=4A, RG=25Ω | 2 |
| Turn-Off Rise Time | Tf | | 35 | | nS | VDD=325V, ID=4A, RG=25Ω | 2 |
| Gate-Source Charge | Qgs | | 2.8 | | nC | VDS=520V, VGS=10V, ID=4A | 2 |
| Gate-Drain Charge | Qgd | | 4.5 | | nC | VDS=520V, VGS=10V, ID=4A | 2 |
| Reverse Recovery Time | Trr | | 393 | | nS | IS=4A, VGS=0V, diF/dt=100A/μs | 2 |
| Reverse Recovery Charge | Qrr | | 1.5 | | μC | IS=4A, VGS=0V, diF/dt=100A/μs | 2 |
## CAD (KiCad official)
- Symbol: `WGD4N65SE`
- Footprint: `Package_TO_SOT_SMD:TO-252-2`
- 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files: `wgd4n65se-etched.step` / `wgd4n65se-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `wgd4n65se.step` / `wgd4n65se.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Wild Goose datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8603016945314770944) (7 pp, sha256 `0626c44c63d6ae05`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/wgd4n65se-datasheet.pdf)