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W25X10CLSNIG-TR

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Winbond Elec NOR FLASH, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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W25X10CLSNIG-TR

Winbond Elec · NOR FLASH · SOIC-8

W25X10CLSNIG-TR from Winbond Elec, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 /CS input Chip Select input that enables or disables the device; when high the device is deselected and DO (IO0, IO1) is high impedance, and /CS must go high-to-low before the first instruction after power-up and must track VCC at power-up.
2 DO (IO1) bidirectional Serial Data Output in standard SPI (data read on the falling edge of CLK) and IO1 in Dual SPI operation; it is at high impedance when /CS is high or /HOLD is held low while /CS is low.
3 /WP input Active-low Write Protect input that, together with the TB, BP1, BP0 and SRP status register bits, prevents the Status Register from being written and can hardware-protect all or part of the memory array.
4 GND power_in Ground reference for the device.
5 DI (IO0) bidirectional Serial Data Input in standard SPI (sampled on the rising edge of CLK) and IO0 in Dual SPI operation.
6 CLK input Serial Clock input that provides the timing for serial input and output operations, with clock operation to 104MHz.
7 /HOLD input Active-low Hold input that pauses the device while it is selected: when brought low while /CS is low, DO goes high impedance and DI and CLK are ignored until /HOLD returns high.
8 VCC power_in Power supply pin; the device operates from a single 2.3V to 3.6V supply.

Key specifications

Parameter Value
Manufacturer Winbond Elec
Package SOIC-8
Category Memory
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage VCC -0.6 4.6 V 36
Voltage Applied to Any Pin VIO -0.6 V Relative to Ground 36
Transient Voltage on any Pin VIOT -2 V <20nS Transient, Relative to Ground 36
Storage Temperature TSTG -65 150 °C 36
Electrostatic Discharge Voltage VESD -2000 2000 V Human Body Model 36
Supply Voltage VCC 2.3 2.7 V FR = 80MHz, fR = 33MHz 36
Supply Voltage VCC 2.7 3.6 V FR = 104MHz, fR = 50MHz 36
Ambient Temperature, Operating TA -40 85 °C Industrial 36
VCC (min) to /CS Low tVSL 10 µs 37
Time Delay Before Write Instruction tPUW 5 ms 37
Write Inhibit Threshold Voltage VWI 1 2 V 37
Input Capacitance CIN 6 pF VIN = 0V 38
Output Capacitance COUT 8 pF VOUT = 0V 38
Input Leakage ILI -2 2 µA 38
I/O Leakage ILO -2 2 µA 38
Standby Current ICC1 10 50 µA /CS = VCC, VIN = GND or VCC 38
Power-down Current ICC2 1 5 µA /CS = VCC, VIN = GND or VCC 38
Current Write Status Register ICC4 8 12 mA /CS = VCC 38
Current Page Program ICC5 10 15 mA /CS = VCC 38
Current Sector/Block Erase ICC6 10 15 mA /CS = VCC 38
Current Chip Erase ICC7 10 15 mA /CS = VCC 38
Input Low Voltage VIL -0.5 V 38
Output Low Voltage VOL 0.4 V IOL = 100 µA 38
Load Capacitance CL 30 pF 39
Input Rise and Fall Times TR, TF 5 ns 39
Clock frequency for all instructions, except Read Data (03h) FR 104 MHz 2.7V-3.6V VCC & Industrial Temperature 40
Clock frequency for all instructions, except Read Data (03h) FR 80 MHz 2.3V-2.7V VCC & Industrial Temperature 40
Clock freq. Read Data instruction 03h fR 50 MHz 2.7V-3.6V VCC & Industrial Temperature 40
Clock freq. Read Data instruction 03h fR 33 MHz 2.3V-2.7V VCC & Industrial Temperature 40
Clock High, Low Time, for Fast Read / other instructions except Read Data tCLH, tCLL 4 ns Fast Read (0Bh, 3Bh) / other instructions except Read Data (03h) 40
Clock High, Low Time for Read Data tCRLH, tCRLL 6 ns Read Data (03h) instruction 40
/CS Active Setup Time relative to CLK tSLCH 5 ns 40
/CS Not Active Hold Time relative to CLK tCHSL 5 ns 40
Data In Setup Time tDVCH 2 ns 40
Data In Hold Time tCHDX 5 ns 40
/CS Active Hold Time relative to CLK tCHSH 5 ns 40
/CS Deselect Time (for Array Read) tSHSL1 50 ns Array Read 40
Output Disable Time tSHQZ 7 ns 40
Clock Low to Output Valid tCLQV1 8 ns 40
Clock Low to Output Valid (for Read ID instructions) tCLQV2 8 ns Read ID instructions 40
Output Hold Time tCLQX 0 ns 41
/HOLD Active Setup Time relative to CLK tHLCH 5 ns 41
/HOLD Active Hold Time relative to CLK tCHHH 5 ns 41
/HOLD Not Active Setup Time relative to CLK tHHCH 5 ns 41
/HOLD Not Active Hold Time relative to CLK tCHHL 5 ns 41
/HOLD to Output High-Z tHLQZ 12 ns 41
/HOLD to Output Low-Z tHHQX 7 ns 41
Write Protect Setup Time Before /CS Low tWHSL 20 ns 41
Write Protect Hold Time After /CS High tSHWL 100 ns 41
/CS High to Power-down Mode tDP 3 µs 41
/CS High to Standby Mode without Electronic Signature Read tRES1 3 µs 41
/CS High to Standby Mode with Electronic Signature Read tRES2 1.8 µs 41
Write Status Register Time tW 10 15 ms 41
Byte Program Time (First Byte) tBP1 15 30 µs 41
Page Program Time tPP 0.4 0.8 ms 41
Sector Erase Time (4KB) tSE 30 300 ms 41
Block Erase Time (32KB) tBE1 120 800 ms 41
Block Erase Time (64KB) tBE2 150 1000 ms 41
Chip Erase Time tCE 0.25 1 s W25X10CL 41

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin 10.1 8-Pin SOIC 150-mil (Package Code SN)...................................................................... 43 10.2 8-Pad USON 2x3-mm (Package Code UX)............................................. 3

CAD (KiCad official)

  • Symbol: W25X10CLSNIG-TR
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: w25x10clsnig-tr-etched.step / w25x10clsnig-tr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); w25x10clsnig-tr.step / w25x10clsnig-tr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Winbond Elec datasheet (47 pp, sha256 d105927e74ebfa88, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF