component
VBQA2157N
Public Made by Adomby adom
VBsemi Elec MOSFETs, DFN5x6-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 10d ago |
| viewers | 10d ago |
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| page.json | 10d ago |
| README.md | 10d ago |
| vbqa2157n-etched.glb | 10d ago |
| vbqa2157n-etched.step | 10d ago |
| vbqa2157n-hero.glb | 10d ago |
| vbqa2157n-hero.overlay.json | 10d ago |
| vbqa2157n.glb | 10d ago |
| vbqa2157n.kicad_mod | 10d ago |
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| vbqa2157n.lbr | 10d ago |
| vbqa2157n.step | 10d ago |
VBQA2157N
VBsemi Elec · MOSFETs · DFN5x6-8
VBQA2157N from VBsemi Elec, in a DFN5x6-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | S | passive | Source of the P-channel MOSFET; the drain-source voltage is rated at -150 V. |
| 2 | S | passive | Source of the P-channel MOSFET, tied to the same net as pins 1 and 3. |
| 3 | S | passive | Source of the P-channel MOSFET, tied to the same net as pins 1 and 2. |
| 4 | G | input | Gate of the P-channel MOSFET; the gate-source voltage is rated at ±20 V. |
| 5 | D | passive | Drain of the P-channel MOSFET; continuous drain current is -22 A at TC = 25 °C. |
| 6 | D | passive | Drain of the P-channel MOSFET, tied to the same net as pins 5, 7 and 8. |
| 7 | D | passive | Drain of the P-channel MOSFET, tied to the same net as pins 5, 6 and 8. |
| 8 | D | passive | Drain of the P-channel MOSFET, tied to the same net as pins 5, 6 and 7. |
| 9 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | VBsemi Elec |
| Package | DFN5x6-8 |
| Category | Transistors/Thyristors |
| Pins | 9 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | -150 | V | 1 | |||
| Gate-Source Voltage | VGS | -20 | 20 | V | 1 | ||
| Continuous Drain Current | ID | -22 | A | TJ = 150 °C; TC = 25 °C | 1 | ||
| Continuous Drain Current | ID | -18 | A | TJ = 150 °C; TC = 70 °C | 1 | ||
| Continuous Drain Current | ID | -20 | A | TJ = 150 °C; TA = 25 °C | 1 | ||
| Continuous Drain Current | ID | -18.1 | A | TJ = 150 °C; TA = 70 °C; surface mounted on 1 in x 1 in FR4 board | 1 | ||
| Pulsed Drain Current | IDM | -45 | A | 1 | |||
| Avalanche Current Pulse | IAS | 12 | A | L = 0.1 mH | 1 | ||
| Single Pulse Avalanche Energy | EAS | 12 | mJ | 1 | |||
| Continuous Source-Drain Diode Current | IS | 7.5 | A | TC = 25 °C | 1 | ||
| Continuous Source-Drain Diode Current | IS | 2.4 | A | TA = 25 °C; surface mounted on 1 in x 1 in FR4 board | 1 | ||
| Maximum Power Dissipation | PD | 10 | W | TC = 25 °C | 1 | ||
| Maximum Power Dissipation | PD | 7 | W | TC = 70 °C | 1 | ||
| Maximum Power Dissipation | PD | 1.3 | W | TA = 25 °C | 1 | ||
| Maximum Power Dissipation | PD | 2 | W | TA = 70 °C; surface mounted on 1 in x 1 in FR4 board | 1 | ||
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 | 150 | °C | 1 | ||
| Maximum Junction-to-Ambient | RthJA | 33 | 40 | °C/W | Steady state; surface mounted on 1 in x 1 in FR4 board | 1 | |
| Maximum Junction-to-Case | RthJC | 0.98 | 1.2 | °C/W | Steady state | 1 | |
| Drain-Source Breakdown Voltage | VDS | -150 | V | VGS = 0 V, ID = -250 µA | 2 | ||
| Gate-Source Threshold Voltage | VGS(th) | -1.5 | -3 | V | VDS = VGS, ID = -250 µA | 2 | |
| Gate-Source Leakage | IGSS | -100 | 100 | nA | VDS = 0 V, VGS = ±20 V | 2 | |
| Zero Gate Voltage Drain Current | IDSS | -1 | µA | VDS = -100 V, VGS = 0 V | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | -10 | µA | VDS = -120 V, VGS = 0 V, TJ = 55 °C | 2 | ||
| On-State Drain Current | ID(on) | -20 | A | VDS = -5 V, VGS = -10 V | 2 | ||
| Drain-Source On-State Resistance | RDS(on) | 0.065 | Ω | VGS = -10 V, ID = -5 A | 2 | ||
| Drain-Source On-State Resistance | RDS(on) | 0.07 | Ω | VGS = -4.5 V, ID = -5 A | 2 | ||
| Turn-On Delay Time | td(on) | 10 | 15 | ns | VDD = -2 V, RL = 2 Ω, ID ≅ -5 A, VGEN = -10 V, Rg = 1 Ω | 2 | |
| Rise Time | tr | 7 | 15 | ns | VDD = -2 V, RL = 2 Ω, ID ≅ -5 A, VGEN = -10 V, Rg = 1 Ω | 2 | |
| Turn-Off Delay Time | td(off) | 70 | 110 | ns | VDD = -2 V, RL = 2 Ω, ID ≅ -5 A, VGEN = -10 V, Rg = 1 Ω | 2 | |
| Fall Time | tf | 40 | 60 | ns | VDD = -2 V, RL = 2 Ω, ID ≅ -5 A, VGEN = -10 V, Rg = 1 Ω | 2 | |
| Total Gate Charge | Qg | 76 | 115 | nC | VDS = -30 V, VGS = -10 V, ID = -5 A | 2 | |
| Total Gate Charge | Qg | 38 | 60 | nC | VDS = -30 V, VGS = -4.5 V, ID = -5 A | 2 | |
| Body Diode Voltage | VSD | -1 | -1.5 | V | IS = -3 A | 2 | |
| Body Diode Reverse Recovery Time | trr | 45 | 68 | ns | IF = -5 A, di/dt = 10 A/µs, TJ = 25 °C | 2 | |
| Body Diode Reverse Recovery Charge | Qrr | 59 | 120 | nC | IF = -5 A, di/dt = 10 A/µs, TJ = 25 °C | 2 | |
| VDS Temperature Coefficient | VDS/TJ | 68 | mV/°C | ID = -250 µA | 2 | ||
| VGS(th) Temperature Coefficient | VGS(th)/TJ | -5.2 | mV/°C | 2 |
CAD (KiCad official)
- Symbol:
VBQA2157N - Footprint:
Package_DFN_QFN:DFN-S-8-1EP_6x5mm_P1.27mm - 3D model: DFN5x6-8 (KiCad packages3D, STEP)
- 3D model files:
vbqa2157n-etched.step/vbqa2157n-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);vbqa2157n.step/vbqa2157n.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: VBsemi Elec datasheet (7 pp, sha256
c1e950b9e96a377c, retrieved 2026-10-29, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).