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VBQA1102N

Public Made by Adom

by adom

VBsemi Elec MOSFETs, DFN5x6-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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VBQA1102N

VBsemi Elec · MOSFETs · DFN5x6-8

VBQA1102N from VBsemi Elec, in a DFN5x6-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S passive Source terminal of the N-channel MOSFET (pin 1, marked with a dot).
2 S passive Source terminal of the N-channel MOSFET.
3 S passive Source terminal of the N-channel MOSFET.
4 G input Gate terminal; VGS is rated at ±20 V maximum.
5 D passive Drain terminal; VDS is rated at 100 V maximum.
6 D passive Drain terminal; VDS is rated at 100 V maximum.
7 D passive Drain terminal; VDS is rated at 100 V maximum.
8 D passive Drain terminal; VDS is rated at 100 V maximum.
9 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer VBsemi Elec
Package DFN5x6-8
Category Transistors/Thyristors
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Gate-source voltage VGS -20 20 V 1
Drain-source voltage VDS 100 V 1
Continuous drain current ID 30 A TJ = 150 °C; TC = 25 °C 1
Continuous drain current ID 19 A TJ = 150 °C; TC = 70 °C 1
Continuous drain current ID 10 A TJ = 150 °C; TA = 25 °C; notes b, c 1
Continuous drain current ID 8.5 A TJ = 150 °C; TA = 70 °C; notes b, c 1
Pulsed drain current IDM 75 A t = 100 μs 1
Continuous source-drain diode current IS 56 A TC = 25 °C 1
Continuous source-drain diode current IS 4.5 A TA = 25 °C; notes b, c 1
Single pulse avalanche current IAS 20 A L = 0.1 mH 1
Single pulse avalanche energy EAS 20 mJ 1
Maximum power dissipation PD 60 W TC = 25 °C 1
Maximum power dissipation PD 40 W TC = 70 °C 1
Maximum power dissipation PD 5 W TA = 25 °C; notes b, c 1
Maximum power dissipation PD 3.2 W TA = 70 °C; notes b, c 1
Operating junction and storage temperature range TJ, Tstg -55 150 °C 1
Soldering recommendations (peak temperature) 260 °C note c (t = 10 s) 1
Maximum junction-to-ambient thermal resistance RthJA 20 25 °C/W t ≤ 10 s; note b 1
Drain-source breakdown voltage VDS 100 V VGS = 0 V, ID = 250 μA 2
Gate-source threshold voltage VGS(th) 3 5 V VDS = VGS, ID = 250 μA 2
Gate-source leakage IGSS 100 nA VDS = 0 V, VGS = ± 20 V 2
Zero gate voltage drain current IDSS 1 μA VDS = 100 V, VGS = 0 V 2
Zero gate voltage drain current IDSS 15 μA VDS = 100 V, VGS = 0 V, TJ = 70 °C 2
On-state drain current ID(on) 40 A VDS ≥ 10 V, VGS = 10 V 2
Gate resistance Rg 0.2 0.76 1.4 Ω f = 1 MHz 2
Turn-on delay time (VGEN = 10 V) td(on) 12 24 ns VDD = 50 V, RL = 5, ID ≈ 10 A, VGEN = 10 V, Rg = 1 2
Rise time (VGEN = 10 V) tr 5 10 ns VDD = 50 V, RL = 5, ID ≈ 10 A, VGEN = 10 V, Rg = 1 2
Turn-off delay time (VGEN = 10 V) td(off) 19 38 ns VDD = 50 V, RL = 5, ID ≈ 10 A, VGEN = 10 V, Rg = 1 2
Fall time (VGEN = 10 V) tf 5 10 ns VDD = 50 V, RL = 5, ID ≈ 10 A, VGEN = 10 V, Rg = 1 2
Turn-on delay time (VGEN = 7.5 V) td(on) 15 30 ns VDD = 50 V, RL = 5, ID ≈ 10 A, VGEN = 7.5 V, Rg = 1 2
Rise time (VGEN = 7.5 V) tr 6 12 ns VDD = 50 V, RL = 5, ID ≈ 10 A, VGEN = 7.5 V, Rg = 1 2
Turn-off delay time (VGEN = 7.5 V) td(off) 19 38 ns VDD = 50 V, RL = 5, ID ≈ 10 A, VGEN = 7.5 V, Rg = 1 2
Fall time (VGEN = 7.5 V) tf 5 10 ns VDD = 50 V, RL = 5, ID ≈ 10 A, VGEN = 7.5 V, Rg = 1 2
Continuous source-drain diode current IS 56.8 A TC = 25 °C 2
Pulse diode forward current ISM 80 A 2
Body diode voltage VSD 0.78 1.1 V IS = 5 A, VGS = 0 V 2
Body diode reverse recovery time trr 43 86 ns IF = 10 A, di/dt = 100 A/μs, TJ = 25 °C 2
Body diode reverse recovery charge Qrr 72 144 nC IF = 10 A, di/dt = 100 A/μs, TJ = 25 °C 2

CAD (KiCad official)

  • Symbol: VBQA1102N
  • Footprint: Package_DFN_QFN:DFN-S-8-1EP_6x5mm_P1.27mm
  • 3D model: DFN5x6-8 (KiCad packages3D, STEP)
  • 3D model files: vbqa1102n-etched.step / vbqa1102n-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); vbqa1102n.step / vbqa1102n.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: VBsemi Elec datasheet (8 pp, sha256 c64c8457b5f4b0df, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF