component

US2BA

Public Made by Adom

by adom

onsemi Fast Recovery / High Efficiency Diodes, SMA(DO-214AC). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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US2BA

onsemi · Fast Recovery / High Efficiency Diodes · SMA(DO-214AC)

US2BA from onsemi, in a SMA(DO-214AC). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Cathode passive Cathode terminal, marked by the color band on the package; the datasheet uses the cathode pin as the reference for the junction-to-lead thermal characteristic (RθJL = 31 °C/W typical).
2 Anode passive Anode terminal of the rectifier, opposite the cathode; the device is rated for repetitive peak reverse voltage up to 1000 V (US2MA) and average forward rectified current of 1.5 A.

Key specifications

Parameter Value
Manufacturer onsemi
Package SMA(DO-214AC)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Repetitive Peak Reverse Voltage VRRM 100 V 2
RMS Reverse Voltage VRMS 70 V 2
DC Blocking Voltage VDC 100 V 2
Average Forward Rectified Current IF(AV) 1.5 A 2
Peak Forward Surge Current IFSM 50 A 8.3 ms single half-sine wave, superimposed on rated load 2
Operating Junction Temperature Range TJ -55 150 °C 2
Storage Temperature Range TSTG -55 150 °C 2
Maximum Instantaneous Forward Voltage VF 1 V at Rated IF(AV), pulse test 2
Maximum Reverse Current IR 5 µA at Rated VR, TJ = 25°C 2
Maximum Reverse Current IR 100 µA at Rated VR, TJ = 125°C 2
Typical Thermal Resistance, Junction-to-Ambient RθJA 189 °C/W Device mounted at minimum pad 2
Typical Thermal Characteristics, Junction-to-Lead (with reference to cathode pin) RθJL 31 °C/W with reference to cathode pin 2

CAD (KiCad official)

  • Symbol: US2BA
  • Footprint: Diode_SMD:D_SMA
  • 3D model: SMA(DO-214AC) (KiCad packages3D, STEP)
  • 3D model files: us2ba-etched.step / us2ba-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); us2ba.step / us2ba.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (5 pp, sha256 042650c3157e53ed, retrieved 2026-10-16, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF