# UCC5350MCDWVR

**Texas Instruments** · Isolators - Gate Drivers · SOIC-8

UCC5350MCDWVR from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC1 | power_in | Input-side power supply voltage from 3V to 15V with integrated UVLO protection; connect low ESR/ESL decoupling capacitor to GND1. |
| 2 | IN+ | input | Non-inverting gate drive voltage control input with CMOS threshold (0.55×VCC1 typical high, 0.45×VCC1 typical low), internal pull-down to low when left open, and negative 5V input voltage tolerance. |
| 3 | IN- | input | Inverting gate drive voltage control input with CMOS threshold, internal pull-up to high when left open, and negative 5V input voltage tolerance. |
| 4 | GND1 | power_in | Input-side ground reference serving common return for all input signals and connection point for VCC1 decoupling capacitor. |
| 5 | VCC2 | power_in | Output-side positive power supply from 9.5V to 33V with integrated UVLO protection; connect low ESR/ESL decoupling capacitor to VEE2. |
| 6 | OUT | output | Gate drive output for Miller clamp configuration with 10A typical source current and 10A typical sink current, 12Ω pull-up and 0.26Ω pull-down on-resistance, switching between VCC2 and VEE2 rails. |
| 7 | CLAMP | input | Active Miller clamp input for preventing false turn-on of power switch by clamping gate voltage to approximately 2V below VCC2 to sink Miller current. |
| 8 | VEE2 | power_in | Output-side ground (GND for M version) serving as negative rail return for gate driver output stage; connect low ESR/ESL decoupling capacitor to VCC2. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-8 |
| Category | Power Management (PMIC) |
| Pins | 8 |

## CAD (KiCad official)

- Symbol: `UCC5350MCDWVR`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files: `ucc5350mcdwvr-etched.step` / `ucc5350mcdwvr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ucc5350mcdwvr.step` / `ucc5350mcdwvr.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/ucc5350) (57 pp, sha256 `84c7492975118783`, retrieved 2026-10-07, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-4-5-20251001` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/ucc5350mcdwvr-datasheet.pdf)